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    186 BALL EMMC MEMORY Search Results

    186 BALL EMMC MEMORY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CYD18S18V18-167BBAXC Rochester Electronics LLC 1MX18 DUAL-PORT SRAM, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Visit Rochester Electronics LLC Buy
    CYD36S36V18-167BGXI Rochester Electronics 1MX36 DUAL-PORT SRAM, 4ns, PBGA484, 27 X 27 MM, 2.33 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-484 Visit Rochester Electronics Buy
    CYD18S18V18-167BBAXI Rochester Electronics LLC 1MX18 DUAL-PORT SRAM, 4ns, PBGA256, 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Visit Rochester Electronics LLC Buy
    MD2114A-5 Rochester Electronics LLC SRAM Visit Rochester Electronics LLC Buy
    MC28F008-10/B Rochester Electronics LLC EEPROM, Visit Rochester Electronics LLC Buy

    186 BALL EMMC MEMORY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    "Manufacturer ID" eMMC

    Abstract: emmc JESD84-A43 eMMC memory emmc ball EXT_CSD emmc CID NAND02GAH0L emmc EXT_CSD Manufacturer ID list eMMC
    Text: NAND02GRH0L NAND02GAH0L NAND08GAH0N 256-Mbyte, 1-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface LFBGA169 ■ 256 Mbytes and 1 Gbyte of formatted data


    Original     		PDF NAND02GRH0L NAND02GAH0L NAND08GAH0N 256-Mbyte, LFBGA169 LFBGA169 "Manufacturer ID" eMMC emmc JESD84-A43 eMMC memory emmc ball EXT_CSD emmc CID emmc EXT_CSD Manufacturer ID list eMMC

    "Manufacturer ID" eMMC

    Abstract: Specification eMMC 4.0 JESD84-B41 Manufacturer ID list eMMC eMMC slc mode emmc Extended CSD emmc write emmc csd JESD84-A41 emmc firmware
    Text: NAND02GAH0I NAND08GAH0F 256-Mbyte, 1-Gbyte, 1.8 V/3.3 V supply, NAND flash memory with MultiMediaCard interface Features • Packaged NAND flash memory with MultiMediaCard interface ■ 256 Mbytes and 1 Gbyte of formatted data storage ■ eMMC/MultiMediaCard system specification,


    Original     		PDF NAND02GAH0I NAND08GAH0F 256-Mbyte, "Manufacturer ID" eMMC Specification eMMC 4.0 JESD84-B41 Manufacturer ID list eMMC eMMC slc mode emmc Extended CSD emmc write emmc csd JESD84-A41 emmc firmware

    MMC02G

    Abstract: emmc bga "Manufacturer ID" eMMC emmc csd NUMONYX emmc NAND08GAH0J NAND16GAH0H 221 ball eMMC memory emmc CID Manufacturer ID list eMMC
    Text: NAND08GAH0J NAND16GAH0H 1-Gbyte, 2-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface ■ Up to 2 Gbytes of formatted data storage ■ eMMC/MultiMediaCard system specification,


    Original     		PDF NAND08GAH0J NAND16GAH0H MMC02G emmc bga "Manufacturer ID" eMMC emmc csd NUMONYX emmc NAND16GAH0H 221 ball eMMC memory emmc CID Manufacturer ID list eMMC

    MMC02G

    Abstract: LFBGA169 BGA 221 eMMC
    Text: NAND08GAH0J NAND16GAH0H 1-Gbyte, 2-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface LFBGA153 ■ Up to 2 Gbytes of formatted data storage


    Original     		PDF NAND08GAH0J NAND16GAH0H LFBGA153 MMC02G LFBGA169 BGA 221 eMMC

    MMC04G

    Abstract: "Manufacturer ID" eMMC LFBGA169 MMC08G EMMC HOST CONTROLLER emmc bga NAND32GAH emmc Extended CSD NAND32GAH0H NAND64GAH0H
    Text: NAND32GAH0H NAND64GAH0H 4-Gbyte, 8-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface ■ Up to 8 Gbytes of formatted data storage ■ High capacity memory access


    Original     		PDF NAND32GAH0H NAND64GAH0H MMC04G "Manufacturer ID" eMMC LFBGA169 MMC08G EMMC HOST CONTROLLER emmc bga NAND32GAH emmc Extended CSD NAND64GAH0H

    MMC04G

    Abstract: MMC08G FBGA169 "Manufacturer ID" eMMC LFBGA169 MMC16G eMMC driver MMC32G emmc bga TFBGA169
    Text: NAND32GAHOK NAND64GAHOK NAND128AHOK NAND256AHOK 4-Gbyte, 8-Gbyte, 16-Gbyte, 32-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface ■ Up to 32 Gbytes of formatted data storage


    Original     		PDF NAND32GAHOK NAND64GAHOK NAND128AHOK NAND256AHOK 16-Gbyte, 32-Gbyte, MMC04G MMC08G FBGA169 "Manufacturer ID" eMMC LFBGA169 MMC16G eMMC driver MMC32G emmc bga TFBGA169

    MMC02G

    Abstract: "Manufacturer ID" eMMC 2Gbyte NAND flash emmc controller eMMC driver emmc 16g emmc csd emmc Initialization emmc jedec emmc jedec mechanical standard
    Text: NAND08GAH0J NAND16GAH0H 1-Gbyte, 2-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface LFBGA153 ■ Up to 2 Gbytes of formatted data storage


    Original     		PDF NAND08GAH0J NAND16GAH0H MMC02G "Manufacturer ID" eMMC 2Gbyte NAND flash emmc controller eMMC driver emmc 16g emmc csd emmc Initialization emmc jedec emmc jedec mechanical standard

    Untitled

    Abstract: No abstract text available
    Text: NAND16GAH0P NAND64GAH0P 2-Gbyte, 8-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface ■ 2 and 8 Gbytes of formatted data storage ■ eMMC/MultiMediaCard system specification,


    Original     		PDF NAND16GAH0P NAND64GAH0P

    SDIN7DP2-4G

    Abstract: TWL6037 Sandisk eMMC OMAP5432 OMAP5430 SDIN7DP2 IN248 IN255 SN75LVCP412
    Text: OMAP5432 ES2.0 EVM System Reference Manual Texas Instruments Revision 0.4 March 1, 2013 DOC-21163 OMAP5432 ES2.0 EVM System Reference Manual Preface Read This First About This Manual This manual should be used by software and hardware developers of applications based on the


    Original     		PDF OMAP5432 DOC-21163 750-2628-2XX-SCH) EVM5432 750-2628-213-EBOM) SDIN7DP2-4G TWL6037 Sandisk eMMC OMAP5430 SDIN7DP2 IN248 IN255 SN75LVCP412

    Toshiba NAND BGA 224

    Abstract: Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB
    Text: Preliminary THGBM3G5D1FBAIE TOSHIBA e-MMC Module 4GB THGBM3G5D1FBAIE INTRODUCTION THGBM3G5D1FBAIE is 4-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.


    Original     		PDF P-TFBGA169-1216-0 Toshiba NAND BGA 224 Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB

    Toshiba emmc

    Abstract: THGBM eMMC data retention Toshiba NAND BGA 224 P-TFBGA153-1113-0 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G
    Text: Preliminary THGBM3G4D1FBAIG TOSHIBA e-MMC Module 2GB THGBM3G4D1FBAIG INTRODUCTION THGBM3G4D1FBAIG is 2-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.


    Original     		PDF P-TFBGA153-1113-0 Toshiba emmc THGBM eMMC data retention Toshiba NAND BGA 224 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G

    JESD84-A43

    Abstract: emmc EXT_CSD CMD38 NAND16GAH0P EXT_CSD emmc csd emmc sector size emmc jedec 32G nand NAND32GAH0P
    Text: NAND16GAH0P NAND32GAH0P NAND64GAH0P 2-Gbyte, 4-Gbyte, 8-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface ■ 2, 4 and 8 Gbytes of formatted data storage


    Original     		PDF NAND16GAH0P NAND32GAH0P NAND64GAH0P JESD84-A43 emmc EXT_CSD CMD38 EXT_CSD emmc csd emmc sector size emmc jedec 32G nand

    toshiba emmc

    Abstract: 153 ball eMMC memory toshiba 16GB Nand flash emmc THGBM MMC04G toshiba 8GB Nand flash bga 4GB eMMC toshiba THGBM1G5D2EBAI7 toshiba 8GB Nand flash emmc "Manufacturer ID" eMMC
    Text: THGBM1GxDxEBAIx TOSHIBA e-MMC Module 1GB / 2GB / 4GB / 8GB / 16GB / 32GB THGBM1GxDxEBAIx Series INTRODUCTION THGBM1GxDxEBAIx series are 1-GB , 2-GB , 4-GB , 8-GB , 16-GB and 32-GB densities of e-MMC Module products housed in 153/169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip


    Original     		PDF 16-GB 32-GB toshiba emmc 153 ball eMMC memory toshiba 16GB Nand flash emmc THGBM MMC04G toshiba 8GB Nand flash bga 4GB eMMC toshiba THGBM1G5D2EBAI7 toshiba 8GB Nand flash emmc "Manufacturer ID" eMMC

    OMAP5430

    Abstract: OMAP5432 MIPI CSI-2 Parallel bridge Toshiba eMMC 4.40 emmc pcb layout toshiba eMMC DS MIPI DPI CAMERA PARALLEL RGB TO MIPI CSI-2 TWL6041 emmc toshiba
    Text: Version F EL I M Data Manual IN Multimedia Device Engineering Samples 2.0 AR OMAP5430 Public Version PR ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.


    Original     		PDF OMAP5430 SWPS052F OMAP5430 OMAP5432 MIPI CSI-2 Parallel bridge Toshiba eMMC 4.40 emmc pcb layout toshiba eMMC DS MIPI DPI CAMERA PARALLEL RGB TO MIPI CSI-2 TWL6041 emmc toshiba

    lpddr4

    Abstract: emmc pcb layout
    Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision A5.2 April 11, 2013 Author: Gerald Coley Contributing Editor: Robert P J Day Page 1 of 108 Rev A5.2 REF: BBONEBLK_SRM BeagleBone Black System Reference Manual


    Original     		PDF

    d2516ec

    Abstract: KE4CN2H5A kingston memory schematic
    Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision C.1 May 22, 2014 Author: Gerald Coley gerald@beagleboard.org Contributing Editor: Robert P J Day Page 1 of 126 Rev C.1 REF: BBONEBLK_SRM BeagleBone Black System


    Original     		PDF

    H26M* hynix

    Abstract: Hynix eMMC 4.5 controller hynix emmc H26M3100 FBGA153 H26M4 FBGA169 H26M31001FPR Hynix eMMC 5.1 controller h26m5
    Text: 26nm 32Gb based e-NAND product Family This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.1 / Apr. 2011 1 Document Title


    Original     		PDF 150ms) 512KB 220ms 247ms 262ms H26M* hynix Hynix eMMC 4.5 controller hynix emmc H26M3100 FBGA153 H26M4 FBGA169 H26M31001FPR Hynix eMMC 5.1 controller h26m5

    SCIMX538DZK1C

    Abstract: samsung eMMC 4.5 MCIMX535 emmc pcb layout lpddr2 pcb layout LPDDR2 PoP samsung* lpddr2* pop package N7U2 Freescale i.MX53 Quick Start Board AMBA AXI
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4.1, 2/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch


    Original     		PDF IMX53CEC MCIMX53xD MX53xD SCIMX538DZK1C samsung eMMC 4.5 MCIMX535 emmc pcb layout lpddr2 pcb layout LPDDR2 PoP samsung* lpddr2* pop package N7U2 Freescale i.MX53 Quick Start Board AMBA AXI

    MCIMX535

    Abstract: MCIMX535DVV1C MCIMX535DVV IMX53CEC mc33902 tepbga-2 MCIMX538DZK1C H.263 *IMX53 emmc pcb layout
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4, 11/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch


    Original     		PDF IMX53CEC MCIMX53xD MX53xD MCIMX535 MCIMX535DVV1C MCIMX535DVV mc33902 tepbga-2 MCIMX538DZK1C H.263 *IMX53 emmc pcb layout

    eMMC "thermal impedance"

    Abstract: PCIMX535DVV1C emmc Card connector 062N n78c 4.712 eMMC PoP emmc pcb layout 100KPD diode 4.7-16
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 2, 5/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm


    Original     		PDF IMX53CEC MCIMX53xD MX53xD DDR2/LVDDR2-800, eMMC "thermal impedance" PCIMX535DVV1C emmc Card connector 062N n78c 4.712 eMMC PoP emmc pcb layout 100KPD diode 4.7-16

    CMD24

    Abstract: emmc ball
    Text: NAND08GAH0B 1-Gbyte, 1.8 V/3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface ■ 1 Gbyte of formatted data storage ■ eMMC/MultiMediaCard system specification,


    Original     		PDF NAND08GAH0B CMD24 emmc ball

    NAND08GAH0B

    Abstract: emmc csd emmc Initialization CMD24 emmc ball emmc 4.4 standard jedec MultiMediaCard System Specification MultiMediaCard System Specification Version MMCA emmc jedec mechanical standard emmc spi
    Text: NAND08GAH0B 1-Gbyte, 1.8 V/3 V supply, NAND flash memories with MultiMediaCard interface Features • Packaged NAND flash memory with MultiMediaCard interface ■ 1 Gbyte of formatted data storage ■ eMMC/MultiMediaCard system specification, compliant with V4.2


    Original     		PDF NAND08GAH0B NAND08GAH0B emmc csd emmc Initialization CMD24 emmc ball emmc 4.4 standard jedec MultiMediaCard System Specification MultiMediaCard System Specification Version MMCA emmc jedec mechanical standard emmc spi

    SCIMX

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4.1, 2/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch


    Original     		PDF IMX53CEC MCIMX53xD MX53xD SCIMX

    pin vga CRT pinout

    Abstract: samsung* lpddr2 LPDDR2-800 i.MX53 PCIMX535DVV1C emmc DDR pcb layout Samsung eMMC 4.41 LPDDR2 PoP JESD209-2 flexcan2
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 3, 7/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm


    Original     		PDF IMX53CEC MCIMX53xD MX53xD pin vga CRT pinout samsung* lpddr2 LPDDR2-800 i.MX53 PCIMX535DVV1C emmc DDR pcb layout Samsung eMMC 4.41 LPDDR2 PoP JESD209-2 flexcan2