8008-1
Abstract: No abstract text available
Text: VISHAY Vishay Semiconductors Component Construction Infrared components are available in plastic or metal packages. Plastic devices, where the chip is mounted and bonded on a lead frame are lower in cost and have enhanced output power or sensitivity. Devices in hermetically sealed packages have better
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17-Mar-04
8008-1
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metal oxide in capacitor
Abstract: capacitor porous
Text: V I S H A Y I N T E R T E C H N O L O G Y, I N C . DC LEAKAGE FAILURE MODE Abstract This paper is submitted as an educational medium for use by anyone who has interest in solid tantalum chip capacitor performance. It represents technical phenomena that are generic to all solid tantalum chip
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VSD-TN0003-0402
17-Mar-04
metal oxide in capacitor
capacitor porous
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NAS-1744
Abstract: nas 1744 raychem RPIP-850-00 Raychem D-1744-02 splice RPIP-850-00 NAS1744 Raychem WPC 60 RT-1404 d-1744-02 D-1744-01
Text: SPECIFICATION CONTROL DRAWING Product Revision Product Name D-1744-01 B D-1744-02 C D-1744-03 B D-1744-04 B Product Dimensions L øA øB max min min 29.70 1.90 2.40 1.170 (0.075) (0.095) 30.15 2.80 3.15 (1.187) (0.110) (0.125) 29.60 4.60 5.10 (1.165) (0.180)
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D-1744-01
D-1744-02
D-1744-03
D-1744-04
D-1744-01/-02/-03/-04
D040063
D030265
17-Mar-04
NAS-1744
nas 1744
raychem RPIP-850-00
Raychem D-1744-02 splice
RPIP-850-00
NAS1744
Raychem WPC 60
RT-1404
d-1744-02
D-1744-01
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Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: NYLON 6T COLOR: BLACK CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: GOLD QUALITY CLASS: 3 AS PER CECC 75 301-802 PITCH: 2.54MM A ENVIRONMENTAL OPERATING TEMPERATURE: -40 UP TO 125°C
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UL94-V0
23-NOV-07
29-MAR-04
17-MAR-04
26-SEP-02
11-DEC-06
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Untitled
Abstract: No abstract text available
Text: 572D Vishay Sprague Solid Tantalum Chip Capacitors TANTAMOUNT , Low Profile, Single Sided Terminations, Conformal Coated, Maximum CV FEATURES • • • • P case top P case bottom S and A cases Images not to scale B and T cases PERFORMANCE CHARACTERISTICS
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EIA-481-1
178mm]
330mm]
17-Mar-04
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112LQFP
Abstract: HCS12 HCS12BFAMILYPP M68HC11
Text: Freescale Semiconductor, Inc. MOTOROLA Freescale Semiconductor, Inc. HCS12BFAMILYPP Rev 2.7, 17-Mar-04 SEMICONDUCTOR TECHNICAL DATA MC9S12B-Family PRODUCT BRIEF 16-Bit Microcontroller Designed for automotive multiplexing applications, members of the MC9S12B-Family of 16 bit Flashbased microcontrollers are fully pin compatible and enable users to choose between different memory
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HCS12BFAMILYPP
17-Mar-04
MC9S12B-Family
16-Bit
MC9S12B-Family
CPU12)
112LQFP
HCS12
HCS12BFAMILYPP
M68HC11
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Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: NYLON 66 MAW TEMPERATURE: 220°C 10 S COLOR: BEIGE CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: TIN QUALITY CLASS: 25 MATING CYCLES PITCH: 2.50MM A ENVIRONMENTAL OPERATING TEMPERATURE: -40 UP TO 105°C
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UL94-V0
31-JAN-07
31-MAR-04
17-MAR-04
31-JAN-01
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Untitled
Abstract: No abstract text available
Text: Tape Information Vishay Siliconix SC-70: 5- AND 6-LEADS T1 AND T3 METHODS See Note 4 2.000"0.050 1.750"0.100 O1.500"0.1000 See Note 1 4.000"0.100 See Note 4 3.500"0.100 8.000"0.300 4.000"0.100 NOTES: 1. 10 sprocket hole pitch cumulative tolerance "0.2 mm.
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SC-70:
S-40346--Rev.
15-Mar-04
loc00
17-Mar-04
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Untitled
Abstract: No abstract text available
Text: Crystek Corporation AVAILABLE PERFORMANCE SPECIFICATION Lower Frequency: Upper Frequency: Tuning Voltage: Supply Voltage: Output Power: Supply Current: Harmonic Suppression 2nd Harmonic : Pushing: Pulling, all Phases: Tuning Sensitivity: Phase Noise: @ 10kHz offset:
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10kHz
CVCO55BE-3000-3100
17-Mar-04
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MMSZ5243
Abstract: No abstract text available
Text: MMSZ5225 to MMSZ5267 VISHAY Vishay Semiconductors Zener Diodes Features • Silicon Planar Power Zener Diodes. • Standard Zener voltage tolerance is ± 5 % with a "B" suffix. Other tolerance are available upon request. • These diodes are also available in MiniMELF case
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MMSZ5225
MMSZ5267
TZM5225
TZM5267,
DO-35
1N5225
1N5267
OT-23
MMBZ5225
MMBZ5267.
MMSZ5243
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SI1473DH
Abstract: marking R5* sc-70 N2 SC70 tsop6 marking DC 74371 N2 SC70 6pin MSOP-8 marking AX PIN diode Pspice model V30114 EQUIVALENT OF TO252 PACK OF P-CHANNEL MOSFET WITH
Text: New Product Si1473DH Vishay Siliconix P-Channel 30-V D-S MOSFET FEATURES PRODUCT SUMMARY rDS(on) (Ω) ID (A)c 0.100 at VGS = - 10 V - 1.6 0.145 at VGS = - 4.5 V - 1.6 VDS (V) - 30 Qg (Typ) 4.1 nC • TrenchFET Power MOSFET APPLICATIONS RoHS • Load Switch for Portable Devices
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Si1473DH
OT-363
SC-70
Si1473DH-T1-E3
03-May-07
marking R5* sc-70
N2 SC70
tsop6 marking DC
74371
N2 SC70 6pin
MSOP-8 marking AX
PIN diode Pspice model
V30114
EQUIVALENT OF TO252 PACK OF P-CHANNEL MOSFET WITH
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AT91R40006-66AI
Abstract: 1732ES AT91R40008 atmel 751
Text: Features • Incorporates the ARM7TDMI ARM® Thumb® Processor Core • • • • • • • • • • • • • • – High-performance 32-bit RISC Architecture – High-density 16-bit Instruction Set – Leader in MIPS/Watt – Little-endian – EmbeddedICE In-circuit Emulation
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32-bit
16-bit
8/16-bit
1732FS
12-Apr-06
AT91R40006-66AI
1732ES
AT91R40008
atmel 751
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Untitled
Abstract: No abstract text available
Text: RECOMMENDED PANEL CUTOUT EMPFOHLENER FRONTPLATTEN AUSSCHNITT 14.89 [.586] 21.59 MAX 0.38±0.10 [.015±.004] 60.19±0.20 [2.370±.008] TOP OF PCB LP 59.09 [2.326] 8 1 8 1 8 1 8 13.80 [.543] 1 3.20±0.20 [.126±.008] 6 x 6.99[.275] = 41.94 [1.651] NOTE 1: REAR SHIELD TABS BETWEEN EACH PORT (T)
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8C10T,
02MAR04
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1732ES
Abstract: atmel Reflow soldering AT91R40008 ICE Components 1732BS
Text: Features • Incorporates the ARM7TDMI ARM® Thumb® Processor Core • • • • • • • • • • • • • • – High-performance 32-bit RISC Architecture – High-density 16-bit Instruction Set – Leader in MIPS/Watt – Little-endian – Embedded ICE In-circuit Emulation
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32-bit
16-bit
8/16-bit
1732ES
10-Aug-05
atmel Reflow soldering
AT91R40008
ICE Components
1732BS
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CECC00802
Abstract: 80080
Text: VISHAY Vishay Semiconductors Assembly Instructions General Soldering Instructions Optoelectronic semiconductor devices can be mounted in any position. Connection wires may be bent provided the bend is not less than 1.5 mm from bottom of case. During bending, no forces must be
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17-Mar-04
CECC00802
80080
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Untitled
Abstract: No abstract text available
Text: THIS DRAWING IS UNPUBLISHED. COPYRIGHT - RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC G ALL RIGHTS RESERVED. DIST R E V IS IO N S 50 LTR DESCRIPTION DATE REV PER 0G 3H — 0 0 7 4 — 0 4 DWN 17MAR04 APVD JR MS D D B B ACTIVE 40501-09-90
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17MAR04
90BEND
31MAR2000
19APR01
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l286
Abstract: No abstract text available
Text: THIS DRAWING IS UNPUBLISHED. COPYRIGHT - RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC G ALL RIGHTS RESERVED. DIST R E V IS IO N S 50 LTR DESCRIPTION REV PER 0G 3H — 0 0 7 4 — 0 4 DATE DWN APVD 17MAR04 JR MS D D K 850 H ±.010 REF i
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17MAR04
405DIA,
31MAR2000
19APR01
l286
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Untitled
Abstract: No abstract text available
Text: THIS DRAWING IS UNPUBLISHED. COPYRIGHT - RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC G ALL RIGHTS RESERVED. DIST R E V IS IO N S 50 LTR B DESCRIPTION DATE REV PER 0G 3H — 0 0 7 4 — 0 4 DWN 17MAR04 APVD JR MS D D B B ACTIVE 40383-11-90
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17MAR04
19APR01
31MAR2000
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M39029/101-553
Abstract: No abstract text available
Text: REV ECN APP'D 5277 JT 12-28-05 6078/ t VT~ s //*YVJ - A 4X R.050 MAX 3 X 0 .1 5 0 .150 TYP .500 -GASKET SUPPLIED WITH RELAY PIN MARKING PER TABLE RELAY PHILLIPS MTG SCREW, S.S. CONICAL SPRING COMPRESSED DAJE C0DE 1. MATERIALSSOCKET BODY: POLYETHERIMIDE PER ASTM-D-5205
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ASTM-D-5205
MIL-PRF-12883/44.
M39029/101-553
JRE400110
JRE400101
JRE400100
JRE400111
17-Mar-04
E400100
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