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Catalog Datasheet	MFG & Type	PDF	Document Tags
SDIP42 Abstract: No abstract text available Text: Thermal Data  SDIP 42 42 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Charts enclosed :	Original	PDF	063W/cm 160x80 80x80 80x160 160x160x160 80x8er SDIP42

Catalog Datasheet

MFG & Type

PDF

Document Tags

SDIP42

Abstract: No abstract text available
Text: Thermal Data  SDIP 42 42 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Charts enclosed :

Original

PDF

063W/cm 160x80 80x80 80x160 160x160x160 80x8er SDIP42