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    Wakefield-Vette 263-145AB

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    ams OSRAM Group AS5145 Adapterboard

    Sockets & Adapters AS5145 Adapterboard
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    Carlo Gavazzi Holding AG GAVG45-14-5ABK

    Circuit Breaker Accessories 3 POLE BUSBAR FOR 5 GMS-32
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    Carlo Gavazzi Holding AG GAVG54-14-5ABK

    Circuit Breaker Accessories 3 POLE BUSBAR FOR 5 GMS-32 W/ 1 AUX SPACING
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    Carlo Gavazzi Holding AG GAVG63-14-5ABK

    Circuit Breaker Accessories 3 POLE BUSBAR FOR 5 GMS-32 W/ 2 AUX SPACING
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    Mouser Electronics GAVG63-14-5ABK
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    145AB Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    marking 2x

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS ÍÍ ICEPAK 6.3x4.9 − E PAD CASE 145AB−01 ISSUE O SCALE 2:1 DATE 04 NOV 2008 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO THE FLANGES


    Original
    145AB-01 145AB marking 2x PDF

    Untitled

    Abstract: No abstract text available
    Text: NTMKE4890N Power MOSFET 30 V, 155 A, Single N−Channel, ICEPAK Features • • • • • • • Low Package Inductance Low RDS on to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses Optimized Gate Charge to Minimize Switching Losses


    Original
    NTMKE4890N 145AB E4890 NTMKE4890N/D PDF

    VDSS-25V

    Abstract: S7130 mx 2910 62a500
    Text: NTMKE4894N Power MOSFET 25 V, 160 A, Single N−Channel, ICEPAK Features • • • • • • • Low Package Inductance Low RDS on to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses Optimized Gate Charge to Minimize Switching Losses


    Original
    NTMKE4894N 145AB NTMKE4894N/D VDSS-25V S7130 mx 2910 62a500 PDF

    BS1474

    Abstract: 91AB 523AB 520AB 543AB PPD50PH PPD50 PP50HC ABL Heatsinks 120AB
    Text: INDEX INDEX PRINT 1 Pages 2 INTRODUCTION 3 GENERAL INFORMATION 4 GUIDE TO FORCED AIR COOLING GRAPH 5 CUSTOM DESIGN 6 - 7 SPRING CLIPS 8 - 1 6 PRESSED ALUMINIUM - LOUVRE SINKS 1 7 - 2 4 BOARD MOUNTING SERIES PP 25-39 100 SERIES 40-41 200 SERIES 42-44 300 SERIES


    Original
    950AB BS1474 91AB 523AB 520AB 543AB PPD50PH PPD50 PP50HC ABL Heatsinks 120AB PDF

    Untitled

    Abstract: No abstract text available
    Text: NTMKE4894N Power MOSFET 25 V, 160 A, Single N−Channel, ICEPAKt Features • • • • • • Low Package Inductance Low RDS on to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses Optimized Gate Charge to Minimize Switching Losses


    Original
    NTMKE4894N NTMKE4894N/D PDF

    Untitled

    Abstract: No abstract text available
    Text: NTMKE4894N Power MOSFET 25 V, 160 A, Single N−Channel, ICEPAK Features • • • • • • • Low Package Inductance Low RDS on to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses Optimized Gate Charge to Minimize Switching Losses


    Original
    NTMKE4894N 145AB E4894 NTMKE4894N/D PDF

    NTMKE4890N

    Abstract: No abstract text available
    Text: NTMKE4890N Power MOSFET 30 V, 147 A, Single N−Channel, ICEPAKt Features • • • • • • • Low Package Inductance Low RDS on to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses Includes SyncFET Schottky Diode Optimized Gate Charge to Minimize Switching Losses


    Original
    NTMKE4890N NTMKE4890N/D PDF

    tl 72 oz

    Abstract: No abstract text available
    Text: NTMKE4890N Power MOSFET 30 V, 155 A, Single N−Channel, ICEPAK Features • • • • • • • Low Package Inductance Low RDS on to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses Optimized Gate Charge to Minimize Switching Losses


    Original
    NTMKE4890N 145AB NTMKE4890N/D tl 72 oz PDF

    Motorola transistors MRF 947

    Abstract: motorola hep cross reference 2N5070 2N5591 MOTOROLA Semicon volume 1 mrf532 transistor equivalents for 2n3866 siemens semiconductor manual Microlab Splitter Specification sheet pt9797
    Text: MOTOROLA RF DATA MANUAL Prepared by Technical Information Center M otorola’s leadership position of RF power, small-signal transistors and hybrid amplifiers is by research and new product development coupled with a com plete in-house m anufacturing ca pa b ility in clu d in g silico n g row ing,


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