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    Wakefield-Vette 263-145AB

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    ams OSRAM Group AS5145 Adapterboard

    Sockets & Adapters AS5145 Adapterboard
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    Carlo Gavazzi Holding AG GAVG45-14-5ABK

    Circuit Breaker Accessories 3 POLE BUSBAR FOR 5 GMS-32
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    Carlo Gavazzi Holding AG GAVG54-14-5ABK

    Circuit Breaker Accessories 3 POLE BUSBAR FOR 5 GMS-32 W/ 1 AUX SPACING
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    Carlo Gavazzi Holding AG GAVG63-14-5ABK

    Circuit Breaker Accessories 3 POLE BUSBAR FOR 5 GMS-32 W/ 2 AUX SPACING
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    Mouser Electronics GAVG63-14-5ABK
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    145AB Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    marking 2x

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS ÍÍ ICEPAK 6.3x4.9 − E PAD CASE 145AB−01 ISSUE O SCALE 2:1 DATE 04 NOV 2008 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO THE FLANGES


    Original
    PDF 145AB-01 145AB marking 2x

    Untitled

    Abstract: No abstract text available
    Text: NTMKE4890N Power MOSFET 30 V, 155 A, Single N−Channel, ICEPAK Features • • • • • • • Low Package Inductance Low RDS on to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses Optimized Gate Charge to Minimize Switching Losses


    Original
    PDF NTMKE4890N 145AB E4890 NTMKE4890N/D

    VDSS-25V

    Abstract: S7130 mx 2910 62a500
    Text: NTMKE4894N Power MOSFET 25 V, 160 A, Single N−Channel, ICEPAK Features • • • • • • • Low Package Inductance Low RDS on to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses Optimized Gate Charge to Minimize Switching Losses


    Original
    PDF NTMKE4894N 145AB NTMKE4894N/D VDSS-25V S7130 mx 2910 62a500

    BS1474

    Abstract: 91AB 523AB 520AB 543AB PPD50PH PPD50 PP50HC ABL Heatsinks 120AB
    Text: INDEX INDEX PRINT 1 Pages 2 INTRODUCTION 3 GENERAL INFORMATION 4 GUIDE TO FORCED AIR COOLING GRAPH 5 CUSTOM DESIGN 6 - 7 SPRING CLIPS 8 - 1 6 PRESSED ALUMINIUM - LOUVRE SINKS 1 7 - 2 4 BOARD MOUNTING SERIES PP 25-39 100 SERIES 40-41 200 SERIES 42-44 300 SERIES


    Original
    PDF 950AB BS1474 91AB 523AB 520AB 543AB PPD50PH PPD50 PP50HC ABL Heatsinks 120AB

    Untitled

    Abstract: No abstract text available
    Text: NTMKE4894N Power MOSFET 25 V, 160 A, Single N−Channel, ICEPAKt Features • • • • • • Low Package Inductance Low RDS on to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses Optimized Gate Charge to Minimize Switching Losses


    Original
    PDF NTMKE4894N NTMKE4894N/D

    Untitled

    Abstract: No abstract text available
    Text: NTMKE4894N Power MOSFET 25 V, 160 A, Single N−Channel, ICEPAK Features • • • • • • • Low Package Inductance Low RDS on to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses Optimized Gate Charge to Minimize Switching Losses


    Original
    PDF NTMKE4894N 145AB E4894 NTMKE4894N/D

    NTMKE4890N

    Abstract: No abstract text available
    Text: NTMKE4890N Power MOSFET 30 V, 147 A, Single N−Channel, ICEPAKt Features • • • • • • • Low Package Inductance Low RDS on to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses Includes SyncFET Schottky Diode Optimized Gate Charge to Minimize Switching Losses


    Original
    PDF NTMKE4890N NTMKE4890N/D

    tl 72 oz

    Abstract: No abstract text available
    Text: NTMKE4890N Power MOSFET 30 V, 155 A, Single N−Channel, ICEPAK Features • • • • • • • Low Package Inductance Low RDS on to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses Optimized Gate Charge to Minimize Switching Losses


    Original
    PDF NTMKE4890N 145AB NTMKE4890N/D tl 72 oz

    Motorola transistors MRF 947

    Abstract: motorola hep cross reference 2N5070 2N5591 MOTOROLA Semicon volume 1 mrf532 transistor equivalents for 2n3866 siemens semiconductor manual Microlab Splitter Specification sheet pt9797
    Text: MOTOROLA RF DATA MANUAL Prepared by Technical Information Center M otorola’s leadership position of RF power, small-signal transistors and hybrid amplifiers is by research and new product development coupled with a com plete in-house m anufacturing ca pa b ility in clu d in g silico n g row ing,


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