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    1433H Search Results

    1433H Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    68001-433HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 33 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    89891-433H Amphenol Communications Solutions Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 66 Positions, 2.54mm (0.100in) Pitch Visit Amphenol Communications Solutions
    68031-433HLF Amphenol Communications Solutions BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail. Visit Amphenol Communications Solutions
    68461-433HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Right Angle, 10.16 mm (0.4 in.) Mating, 8.13 mm (0.32 in.) Tail Visit Amphenol Communications Solutions
    68771-433HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 6.86 mm (0.27 in.) Mating, 2.54 mm (0.1 in.) Tail Visit Amphenol Communications Solutions
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    1433H Price and Stock

    CTS Corporation CA25C1433HNR

    XTAL OSC XO 14.31818MHZ HCMOS
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    DigiKey CA25C1433HNR Reel 3,000
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    Avnet Americas CA25C1433HNR Reel 3,000
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    Mouser Electronics CA25C1433HNR
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    CTS Corporation CA70C1433HNT

    XTAL OSC XO 14.31818MHZ HCMOS
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    DigiKey CA70C1433HNT Reel 1,000
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    Avnet Americas CA70C1433HNT Reel 8 Weeks 1,000
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    Avnet Abacus CA70C1433HNT Reel 15 Weeks 1,000
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    Amphenol Communications Solutions 68001-433HLF

    CONN HEADER VERT 33POS 2.54MM
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    DigiKey 68001-433HLF Bag
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    Amphenol Communications Solutions 89891-433HLF

    CONN RCPT 66POS 0.1 TIN PCB
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    DigiKey 89891-433HLF Tube
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    Newark 89891-433HLF Bulk 500
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    CTS Corporation CA50C1433HLT

    XTAL OSC XO 14.31818MHZ HCMOS
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    DigiKey CA50C1433HLT Reel 1,000
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    Avnet Americas CA50C1433HLT Reel 1,000
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    Avnet Abacus CA50C1433HLT Reel 15 Weeks 1,000
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    1433H Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    NEC asu

    Abstract: 13E3h 1442H
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


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    PDF R8C/22 R8C/23 REJ09B0251-0200 NEC asu 13E3h 1442H

    sekisui 5760

    Abstract: sis950 SiS chipset 486 SEAGATE st51080n Bt848KPF KSV884T4A1A-07 lad1 5vdc SiS chipset SiS301 kingmax usb flash drive
    Text: SiS540 Super 7 2D/3D Ultra-AGPTM Single Chipset Content Figure .vi Table. vii


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    PDF SiS540 sekisui 5760 sis950 SiS chipset 486 SEAGATE st51080n Bt848KPF KSV884T4A1A-07 lad1 5vdc SiS chipset SiS301 kingmax usb flash drive

    SIS 5595

    Abstract: nand 67-Ball bga SiS chipset AMD 700 chipset SIS 5592 SIS 672 SiS 651 chipset SiS 671 SiS5591 SiS5595
    Text: SiS5591/5592 Pentium PCI A.G.P. Chipset 1. SiS5591/5592 SiS5595 OVERVIEW SiS5591/5592 SiS5595 PCI A.G.P. & CPU Memory Controller PCI SYSTEM I/O The SiS5591/5592 SiS5595 glueless P5 A.G.P. chipset provides a high performance/cost index Desktop/Mobile solution for the Intel Pentium P54C/P55C, AMD K5/K6, and Cyrix M1/M2 A.G.P. system.


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    PDF SiS5591/5592 SiS5595 P54C/P55C, SiS5591/SiS5592 SIS 5595 nand 67-Ball bga SiS chipset AMD 700 chipset SIS 5592 SIS 672 SiS 651 chipset SiS 671 SiS5591

    13CD

    Abstract: MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H
    Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0020 Rev.0.20 Sep 29, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is


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    PDF R8C/22, R8C/23 16-BIT REJ03B0097-0020 48-pin 13CD MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H

    SIS 5595

    Abstract: Pentium 3 processor sis vga sis chipset SIS5595 sis 5600
    Text: SiS 5600 Pentium II PCI /A.G.P. Chipset CONTENTS 1. SiS 5600/SiS 5595 OVERVIEW . 1 2. FEATURES . 2


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    PDF 5600/SiS SIS 5595 Pentium 3 processor sis vga sis chipset SIS5595 sis 5600

    smd marking STPA

    Abstract: 1488h stpa smd PM5354 sx 460 k2462 0741H AM 702 0B48H E22/6/AS7620/MSP430/AS7620/Datasheet-091/ITT TCA 700 Y
    Text: 08 AM S/UNI MULTI-2x12 ASSP Telecom Standard Product Data Sheet Released be r, 20 04 07 :2 4: PM5354 y, 14 Se pt em S/UNI® MULTI-2x12 in er In co n Tu es da Multi-rate SATURN® User Network Interface for 2x622, and 4x155 Released Issue No. 2: September 2003


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    PDF MULTI-2x12 2x622, 4x155 PMC-2030926, MULTI-2x12 PM5354 31x31 JESD51 smd marking STPA 1488h stpa smd PM5354 sx 460 k2462 0741H AM 702 0B48H E22/6/AS7620/MSP430/AS7620/Datasheet-091/ITT TCA 700 Y

    63A52

    Abstract: PM5360 Hex schmitt trigger ecl isp connector block diagram 0521H 10A1H 0836H 1E6C
    Text: 22 AM S/UNI MULTI-48 ASSP Telecom Standard Product Data Sheet Released be r, 20 04 07 :2 3: PM5360 y, 14 Se pt em S/UNI® MULTI-48 in er In co n Tu es da Multi-rate SATURN® User Network Interface for 1x2488, 4x622, and 4x155 Released Issue No. 5: September 2003


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    PDF MULTI-48 1x2488, 4x622, 4x155 PMC-2020735, MULTI-48TM PM5360 JESD51 63A52 PM5360 Hex schmitt trigger ecl isp connector block diagram 0521H 10A1H 0836H 1E6C

    1312H

    Abstract: 144BH 1458h 1351h 13D0H 1444H
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0100 Rev.1.00 Oct 27, 2006 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level


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    PDF R8C/22 R8C/23 REJ03B0097-0100 48-pin 1312H 144BH 1458h 1351h 13D0H 1444H

    SI 1340H

    Abstract: 1542H mx-126 1488h integrators si 1340h PSL 26 SA8 357 T1E1-7 DATA SHEET Equivalent MX12 MX23
    Text: PM5365 TEMAP STANDARD PRODUCT REGISTER DESCRIPTION PMC-1990682 ISSUE 2 HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER PM5365 TEMAP HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER REGISTER DESCRIPTION Proprietary and Confidential ISSUE 2: JULY 2001 PMC-Sierra, Inc.


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    PDF PM5365 PMC-1990682 PM5365 PMC-1990682 SI 1340H 1542H mx-126 1488h integrators si 1340h PSL 26 SA8 357 T1E1-7 DATA SHEET Equivalent MX12 MX23

    1257h

    Abstract: 1488h 1542H 1250H 200H MX12 PM4328 PM5362 PM5365 PM8315
    Text: TEMUX Programmer's Guide Released PM8315, PM5365, PM4328 TM TEMUX TEMUX, TEMAP, TECT3 HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MULTIPLEXER Programmer’s Guide Proprietary and Confidential Release Issue 4: November 2001 Proprietary and Confidential to PMC-Sierra, Inc., and for its Customers’ Internal Use


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    PDF PM8315, PM5365, PM4328 PMC-1991268, PMC-1991268 120AH: 1257h 1488h 1542H 1250H 200H MX12 PM4328 PM5362 PM5365 PM8315

    R5F2123

    Abstract: R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0110 Rev.1.10 Mar 16, 2007 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level


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    PDF R8C/22 R8C/23 REJ03B0097-0110 48-pin R5F2123 R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP

    diode K1V 645

    Abstract: 0923H 0A68H 1031f 09-D2 1182h 1488h ya11 PM5332-BI 1221H
    Text: 28 AM SPECTRA 1x2488 ASSP Telecom Standard Product Data Sheet Released be r, 20 03 02 :5 7: PM5332 da y, 14 Oc to SPECTRA™ 1x2488 Data Sheet Released Issue No. 3: March 2003 lo ad ed by Am r Ma ns ou ro fS ilic on Ex pe rt Te cn ol og yI nc on Tu es SONET/SDH Payload Extractor/Aligner


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    PDF 1x2488 PM5332 1x2488 PMC-2012682, diode K1V 645 0923H 0A68H 1031f 09-D2 1182h 1488h ya11 PM5332-BI 1221H

    r5f2122ckfp

    Abstract: r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H
    Text: REJ09B0251-0200 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU R8C FAMILY / R8C/2x SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by


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    PDF REJ09B0251-0200 R8C/22 R8C/23 r5f2122ckfp r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H

    SiS5595

    Abstract: SiS chipset psl6 PCI33 SiS600 ID12-ID5 SILICON INTEGRATED SYSTEMS AAD27 intel desktop board SERVICE MANUAL
    Text: SiS600 Pentium II PCI /A.G.P. Chipset CONTENTS 1. SiS600/SiS5595 OVERVIEW. 1 2. FEATURES . 2


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    PDF SiS600 SiS600/SiS5595 SiS600 SiS5595 SiS chipset psl6 PCI33 ID12-ID5 SILICON INTEGRATED SYSTEMS AAD27 intel desktop board SERVICE MANUAL

    NEC 1378h

    Abstract: R5F2123CKFP 1347h 13F9H R5F21226DFP R5F21226JFP R5F2123 R5F21227JFP R5F21228DFP R5F21228JFP
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original
    PDF

    Untitled

    Abstract: No abstract text available
    Text: 2: 34 PM SPECTRA 1x2488 ASSP Telecom Standard Product Data Sheet Released ob er ,2 00 4 02 :1 PM5332 sd ay ,2 8O ct SPECTRA™ 1x2488 Data Sheet Released Issue No. 3: March 2003 Do wn lo ad ed by C on te n tT ea m of Pa rtm in er In co n Th ur SONET/SDH Payload Extractor/Aligner


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    PDF 1x2488 PM5332 1x2488 PMC-2012682,

    Untitled

    Abstract: No abstract text available
    Text: 3: 35 PM SPECTRA 1x2488 ASSP Telecom Standard Product Data Sheet Released ch ,2 00 6 10 :3 PM5332 Mo nd ay ,1 3M ar SPECTRA™ 1x2488 Data Sheet Released Issue No. 4: January 2006 Do wn l oa de d by C on te nt T ea m of Pa rtm in er In co n SONET/SDH Payload Extractor/Aligner


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    PDF 1x2488 PM5332 1x2488 PMC-2012682,

    145AH

    Abstract: MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0200 Rev.2.00 Aug 20, 2008 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of


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    PDF R8C/22 R8C/23 REJ03B0097-0200 48-pin 145AH MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP

    ILD1020

    Abstract: PM573 PM5332-BI PM5332-BGI 1A90H 1S141 intel PM-400 AE-27 PM572
    Text: 5: 04 PM SPECTRA 1x2488 ASSP Telecom Standard Product Data Sheet Released 7A pr il, 20 06 09 :5 PM5332 Th ur sd ay ,2 SPECTRA™ 1x2488 Data Sheet Released Issue No. 4: January 2006 Do wn lo ad ed by Co nt e nt Te a m of Pa rtm in er In co n SONET/SDH Payload Extractor/Aligner


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    PDF 1x2488 1x2488 PMC-2012682, PM5332 500-pin ILD1020 PM573 PM5332-BI PM5332-BGI 1A90H 1S141 intel PM-400 AE-27 PM572

    PM5360

    Abstract: 63A52 PMC-2020735 0719h 0837H BC 459 3627AM 1602h* lcd BCD 548 BC 558 EQUIVALENT BC 309
    Text: 6: 27 AM S/UNI MULTI-48 ASSP Telecom Standard Product Data Sheet Released em be r, 20 11 08 :3 PM5360 Mo nd ay ,2 8N ov S/UNI® MULTI-48 nd ar es an of IH S on Multi-rate SATURN® User Network Interface for 1x2488, 4x622, and 4x155 Released Issue No. 5: September 2003


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    PDF MULTI-48 PMC-2020735, 1x2488, 4x622, 4x155 MULTI-48TM PM5360 JESD51 PM5360 63A52 PMC-2020735 0719h 0837H BC 459 3627AM 1602h* lcd BCD 548 BC 558 EQUIVALENT BC 309

    13D2H

    Abstract: 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H
    Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0010 Rev.0.10 Mar 08, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU


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    PDF R8C/22, R8C/23 16-BIT REJ03B0097-0010 48-pin di5-900 Unit2607 13D2H 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H

    Untitled

    Abstract: No abstract text available
    Text: 7: 30 PM SPECTRA 1x2488 ASSP Telecom Standard Product Data Sheet Released 5M ay ,2 00 3 01 :1 PM5332 Th ur sd ay ,1 SPECTRA™ 1x2488 Data Sheet Released Issue No. 3: March 2003 Do wn lo ad ed by Co nt en tT ea m of Pa rtm in er In co n SONET/SDH Payload Extractor/Aligner


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    PDF 1x2488 PM5332 1x2488 PMC-2012682,

    Untitled

    Abstract: No abstract text available
    Text: REJ09B0251-0110 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU M16C FAMILY / R8C/Tiny SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by


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    PDF REJ09B0251-0110 R8C/22 R8C/23

    SIS 5595

    Abstract: SiS530 SiS5595 lcd 96x64 SiS530 SiS5595 vertex m1 intel 94 mda to vga converter 8A53 TA 8210H bitblt s3
    Text: SiS530 Host, PCI, 3D Graphics & Memory Controller Content 1. SiS530/ SiS5595 OVERVIEW . 3 2. FEATURES. 2


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    PDF SiS530 SiS530/ SiS5595 SiS530 SIS 5595 lcd 96x64 SiS530 SiS5595 vertex m1 intel 94 mda to vga converter 8A53 TA 8210H bitblt s3