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    1427MM Price and Stock

    Apex Tool Group LLC SZ-14-27MM

    Bit 7/8 Hex Ins 27Mm Ml Hex 2" Oal |Apex SZ-14-27MM
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark SZ-14-27MM Bulk 25
    • 1 -
    • 10 -
    • 100 $165.57
    • 1000 $159.96
    • 10000 $159.96
    		Buy Now

    Apex Tool Group LLC SZ-8-14-27MM

    Bit 1" Sq Dr 27Mm Ml Hex 3.251" Oal |Apex SZ-8-14-27MM
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark SZ-8-14-27MM Bulk 25
    • 1 -
    • 10 -
    • 100 $182.7
    • 1000 $182.7
    • 10000 $182.7
    		Buy Now

    1427MM Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ht 13003

    Abstract: LCD 16002 Aromat relay hb2e HT 1200-4 hb2e MOTOROLA 13003 Aromat hb2e HT 1000-4 amp 12011p 87c196
    Text: Correct-A-Chip Adapters DIP-to-JEDEC TO Adapter Socket – www.arieselec.com/products/18012.pdf Correct-A-Chip™ with Collet Contacts – www.arieselec.com/products/18003.pdf SOIC-to-JEDEC TO Adapter – www.arieselec.com/products/18013.pdf Series 350000-HT High-Temperature


    Original     		PDF com/products/18012 com/products/18003 com/products/18013 350000-HT com/products/18005 com/products/18013RC 35W000 com/products/18007 com/products/18014 35W000-11-RC ht 13003 LCD 16002 Aromat relay hb2e HT 1200-4 hb2e MOTOROLA 13003 Aromat hb2e HT 1000-4 amp 12011p 87c196

    1720G

    Abstract: No abstract text available
    Text: CSP/MicroBGA Test & Burn-In Socket for Devices Up to 13mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to


    Original     		PDF device17 1720G

    Untitled

    Abstract: No abstract text available
    Text: CSP/MicroBGA Test & Burn-In Socket for Devices Up to 13mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: TELEPRESENCE SERIES BrightCom’s Lumina Telepresence series is the next step in telecommunication technology. Offering fully integrated HD video and data conferencing solutions, Lumina Telepresence delivers a complete immersive conference experience. With the natural feeling of face to face


    Original     		PDF 50-60Hz 4579mm 1427mm 10Mbit

    Untitled

    Abstract: No abstract text available
    Text: CSP/MicroBGA Test & Burn-In Socket for Devices Up to 13mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to


    Original     		PDF device17