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    Untitled

    Abstract: No abstract text available
    Text: Application Note from Europe for the World European PowerSemiconductor and Electronics Company Mounting of the IGBT-High-Power-Modules 140x130mm The contact surfaces of module and heatsink must be free from damage and contamination. A thin and uniform film of thermal compound should be applied to the contact area before mounting. A recommended method is applying the thermal compound with rollers or spatulas to the surface of the module or the heatsink. The quantity of thermal compound is sufficient if a small rim can be observed around the mounted module.


    Original     		140x130mm D-59581 140x130 PDF

    cm500ha-34a

    Abstract: vmos CM100DY-34A CM400DY-34A series connection igbt cm200dy-34a IGBT cross CM100DU-34KA CM200DU-34KA CM300DY-34A
    Text: NEW 1700V A-SERIES IGBT MODULES WITHS CSTBT AND IMPROVED FWDi By Nicholas Clark1, John Donlon1, Shinichi Iura2 1 Powerex Inc., Youngwood, PA, USA 2) Power Device Works, Mitsubishi Electric Corp., Fukuoka, Japan Abstract: This paper presents a new series of 1700V IGBT Insulated Gate Bipolar Transistor) modules using


    Original     		PDF