Untitled
Abstract: No abstract text available
Text: 3.0 ORDERING INFORMATION RadHard MSI - 14-Lead Packages: Military Temperature Range UT54 * * - * * * * Lead Finish: A = Solder (C) = Gold (X) = Optional Screening: (C) = Mil Temp Package Type: (P) = 14-lead ceramic side-brazed DIP (U) = 14-lead ceramic bottom-brazed dual-in-line Flatpack
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14-Lead
16-lead
20-lead
MIL-PRF-38535
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smd cross reference
Abstract: dual flatpack 8
Text: 3.0 ORDERING INFORMATION RadHard MSI - 14-Lead Packages: Military Temperature Range UT54 * * - * * * * Lead Finish: See Notes 1 and 2 (A) = Solder (C) = Gold (X) = Optional Screening: (See Note 3) (C) = Mil Temp Package Type: (P) = 14-lead ceramic side-brazed DIP
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14-Lead
MIL-PRF-38535
smd cross reference
dual flatpack 8
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UT54ACS04
Abstract: UT54ACTS04
Text: UT54ACS04/UT54ACTS04 Radiation-Hardened Hex Inverters FEATURES PINOUTS 14-Pin DIP Top View radiation-hardened CMOS - Latchup immune High speed Low power consumption Single 5 volt supply Available QML Q or V processes Flexible package - 14-pin DIP - 14-lead flatpack
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UT54ACS04/UT54ACTS04
14-Pin
14-lead
UT54ACS04
UT54ACTS04
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A101
Abstract: A144
Text: Package Diagrams Thin Quad Flat Packs 32-Lead Thin Plastic Quad Flatpack 7 x 7 x 1.0mm A32 51-85063-B 44-Lead Thin Plastic Quad Flat Pack A44 51-85064-B 1 Package Diagrams 64-Pin Thin Plastic Quad Flat Pack 10 x 10 x 1.4 mm A64 51-85051-A 64-Lead Thin Plastic Quad Flat Pack (14 x 14 x 1.4 mm) A65
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32-Lead
51-85063-B
44-Lead
51-85064-B
64-Pin
1-85051-A
64-Lead
51-85046-B
80-Pin
51-85065-B
A101
A144
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transistor A144
Abstract: A101 TQFP 144 PACKAGE 51-85050-A 85049 A144 plastic quad flat pack
Text: Package Diagram Thin Quad Flat Packs 32-Lead Thin Plastic Quad Flatpack 7 x 7 x 1.0mm A32 51-85063-B 44-Lead Thin Plastic Quad Flat Pack A44 51-85064-B 1 Package Diagram 64-Pin Thin Plastic Quad Flat Pack 10 x 10 x 1.4 mm A64 51-85051-A 64-Lead Thin Plastic Quad Flat Pack (14 x 14 x 1.4 mm) A65
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32-Lead
51-85063-B
44-Lead
51-85064-B
64-Pin
1-85051-A
64-Lead
51-85046-B
80-Pin
51-85065-B
transistor A144
A101
TQFP 144 PACKAGE
51-85050-A
85049
A144
plastic quad flat pack
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plastic quad flat pack
Abstract: No abstract text available
Text: Package Diagrams Thin Quad Flat Packs 32-Lead Thin Plastic Quad Flatpack 7 x 7 x 1.0mm A32 51-85063-B 44-Lead Thin Plastic Quad Flat Pack A44 51-85064-B 1 Package Diagrams 64-Pin Thin Plastic Quad Flat Pack 10 x 10 x 1.4 mm A64 51-85051-A 64-Lead Thin Plastic Quad Flat Pack (14 x 14 x 1.4 mm) A65
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32-Lead
51-85063-B
44-Lead
51-85064-B
64-Pin
1-85051-A
64-Lead
51-85046-B
80-Pin
51-85065-B
plastic quad flat pack
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UT54ACTS220
Abstract: UT69151
Text: UT54ACTS220 Clock and Wait-State Generation Circuit FEATURES PINOUTS radiation-hardened CMOS - Latchup immune High speed Low power consumption Single 5-volt supply Available QML Q or V processes Flexible package - 14-pin DIP - 14-lead flatpack 14-Pin DIP Top View
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UT54ACTS220
14-pin
14-lead
24MHz
UT54ACTS220
UT69151
48MHz
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CERAMIC FLATPACK
Abstract: F14C F10B F16B FA32A FA36A
Text: Ceramic Flatpack 10 Lead Ceramic Flatpack NS Package Number F10B 2000 National Semiconductor Corporation MS101108 www.national.com Ceramic Flatpack August 1999 Ceramic Flatpack 14 Lead Ceramic Flatpack NS Package Number F14C 16 Lead Ceramic Flatpack NS Package Number F16B
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MS101108
FA32A
FA36A
CERAMIC FLATPACK
F14C
F10B
F16B
FA32A
FA36A
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UT54ACS54
Abstract: UT54ACTS54
Text: UT54ACS54/UT54ACTS54 Radiation-Hardened FEATURES • • • • • PINOUTS 14-Pin DIP Top View radiation-hardened CMOS - Latchup immune High speed Low power consumption Single 5 volt supply Available QML Q or V processes Flexible package - 14-pin DIP - 14-lead flatpack
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UT54ACS54/UT54ACTS54
14-Pin
14-lead
UT54ACS54
UT54ACTS54
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UT54ACS02
Abstract: UT54ACTS02
Text: UT54ACS02/UT54ACTS02 Radiation-Hardened Quadruple 2-Input NOR Gates FEATURES PINOUTS radiation-hardened CMOS - Latchup immune High speed Low power consumption Single 5 volt supply Available QML Q or V processes Flexible package - 14-pin DIP - 14-lead flatpack
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UT54ACS02/UT54ACTS02
14-pin
14-lead
UT54ACS02
UT54ACTS02
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Untitled
Abstract: No abstract text available
Text: PXO Hybrid Clocks ECL OSCILLATORS REFERENCE TABLE MODEL 069 082 769 770 771 FREQUENCY PACKAGE 30 MHz to 130 MHz 30 MHz to 130 MHz 30 MHz to 130 MHz 30 MHz to 130 MHz 30 MHz to 130 MHz COMPLEMENTARY OUTPUT 14 Lead Flatpack 32 Pad LCC 14 Pin DIP 4 Pin DIP 14 Pin DIP
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D-74924
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Untitled
Abstract: No abstract text available
Text: UT54ACTS220 Clock and Wait-State Generation Circuit FEATURES • 1.2 radiation-hardened CMOS - Latchup immune • High speed • Low power consumption • Single 5-volt supply • Available QML Q or V processes • Flexible package - 14-pin DIP - 14-lead flatpack
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UT54ACTS220
14-pin
14-lead
UT54ACTS220
UT69151
48MHz
24MHz
UT54ACT220
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UT54ACTS220
Abstract: ut69151 lxe/dxe UT69151 SUmmit E
Text: UT54ACTS220 Clock and Wait-State Generation Circuit FEATURES • 1.2µ radiation-hardened CMOS - Latchup immune • High speed • Low power consumption • Single 5-volt supply • Available QML Q or V processes • Flexible package - 14-pin DIP - 14-lead flatpack
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UT54ACTS220
14-pin
14-lead
24MHz
UT54ACTS220
UT69151
ut69151 lxe/dxe
SUmmit E
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225VDD
Abstract: No abstract text available
Text: UT54ACTS220 Clock and Wait-State Generation Circuit FEATURES • 1.2µ radiation-hardened CMOS - Latchup immune • High speed • Low power consumption • Single 5-volt supply • Available QML Q or V processes • Flexible package - 14-pin DIP - 14-lead flatpack
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UT54ACTS220
14-pin
14-lead
UT54ACTS220
UT69151
48MHz
24MHz
UT54ACT220
225VDD
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Solder bar of Senju M705
Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
Text: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold
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SCBA017D
14/16/20-terminal
MO-241,
Solder bar of Senju M705
senju M31 GRN360
Senju
senju m31
JESD
Senju 7100 reflow profile
16QN50T23030
JESD 51-7, ambient measurement
qfn 32 land pattern
Senju paste 7100
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HCTS10D
Abstract: HCTS10DMSR HCTS10HMSR HCTS10K HCTS10KMSR HCTS10MS
Text: HCTS10MS Radiation Hardened Triple 3-Input NAND Gate September 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T14, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si)
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HCTS10MS
MIL-STD-1835
CDIP2-T14,
-55oC
125oC
HCTS10D
HCTS10DMSR
HCTS10HMSR
HCTS10K
HCTS10KMSR
HCTS10MS
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HCS05D
Abstract: HCS05DMSR HCS05HMSR HCS05K HCS05KMSR HCS05MS
Text: HCS05MS Radiation Hardened Hex Inverter with Open Drain September 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T14, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si)
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HCS05MS
MIL-STD-1835
CDIP2-T14,
-55oC
125oC
05A/cm2
HCS05D
HCS05DMSR
HCS05HMSR
HCS05K
HCS05KMSR
HCS05MS
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HCS27D
Abstract: HCS27DMSR HCS27HMSR HCS27K HCS27KMSR HCS27MS
Text: HCS27MS Radiation Hardened Triple 3-Input NOR Gate September 1995 Features Pinouts 14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T14, LEAD FINISH C TOP VIEW • 3 Micron Radiation Hardened SOS CMOS • Total Dose 200K RAD (Si)
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HCS27MS
MIL-STD-1835
CDIP2-T14,
-55oC
125oC
05A/cm2
HCS27D
HCS27DMSR
HCS27HMSR
HCS27K
HCS27KMSR
HCS27MS
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JM7000
Abstract: ACS86DMSR ACS86HMSR ACS86KMSR ACS86MS
Text: ACS86MS Semiconductor Radiation Hardened Quad 2-Input Exclusive OR Gate April 1995 Features Pinouts 14 LEAD CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR, CDIP2-T14, LEAD FINISH C TOP VIEW • 1.25 Micron Radiation Hardened SOS CMOS • Total Dose 300K RAD Si
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ACS86MS
MIL-STD-1835
CDIP2-T14,
-55oC
125oC
038mm)
JM7000
ACS86DMSR
ACS86HMSR
ACS86KMSR
ACS86MS
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5004
Abstract: HCS05D HCS05DMSR HCS05HMSR HCS05K HCS05KMSR HCS05MS
Text: HCS05MS Radiation Hardened Hex Inverter with Open Drain September 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T14, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si)
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HCS05MS
MIL-STD-1835
CDIP2-T14,
-55oC
125oC
5004
HCS05D
HCS05DMSR
HCS05HMSR
HCS05K
HCS05KMSR
HCS05MS
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Untitled
Abstract: No abstract text available
Text: UT54ACS04/UT54ACTS04 Radiation-Hardened Hex Inverters FEATURES • 1.2 1 radiation-hardened CMOS - Latchup immune • Highspeed • Low power consumption • Single 5 volt supply • Available QML Q or V processes • Flexible package - 14-pin DIP - 14-lead flatpack
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OCR Scan
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PDF
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UT54ACS04/UT54ACTS04
14-pin
14-lead
UT54ACS04
UT54ACTS04
rangeof-55<
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Untitled
Abstract: No abstract text available
Text: UT54ACS04/UT54ACTS04 Radiation-Hardened Hex Inverters FEATURES • 1.2|i radiation-hardened CMOS - Lgtchup immune • Highspeed • Low power consumption • Single 5 volt supply • Available QML Q or V processes • Flexible package - 14-pin DIP - 14-lead fl&tpack
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OCR Scan
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PDF
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UT54ACS04/UT54ACTS04
14-pin
14-lead
UT54ACS04
UT54ACTS04
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MIL-PRF-385353
Abstract: 1E6 MARKING 1E5 MARKING
Text: 3,0 Ordering Information Rad-Hard MSI - 14-LEAD PACKAGES: MILITARY TEMPERATURE RANGE, CLASS Q, & CLASS V UT54 * * - * * * * Total Dose: H = 1E6 rads(Si) (R) = 1E5 rads(Si) ( ) = Total dose characteristics neither tested nor guaranteed Lead Finish:1 (A) = Hot solder dipped
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14-LEAD
MIL-PRF-385353
16-lead
20-lead
MIL-PRF-38535
MIL-PRF-385353
1E6 MARKING
1E5 MARKING
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Untitled
Abstract: No abstract text available
Text: HCTS74MS Semiconductor Radiation Hardened Dual-D Flip-Flop with Set and Reset September 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 14 LEAD CERAM IC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP M IL-STD-183S CDIP2-T14, LEAD FINISH C TOP VIEW
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HCTS74MS
IL-STD-183S
CDIP2-T14,
05A/cm
HCTS74
TA14438A.
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