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    Bimba Manufacturing Company TE-313-CDH

    Thruster, Linear Thruster (Composite Bearings) ; 2in Bore ; Stroke A: 3 in; Str | Bimba TE-313-CDH
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS TE-313-CDH Bulk 5 Weeks 1
    • 1 $1119.85
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    • 100 $1119.85
    • 1000 $1119.85
    • 10000 $1119.85
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    Bimba Manufacturing Company TE-313-CDHM

    Thruster, Linear Thruster (Composite Bearings) ; 2in Bore ; Stroke A: 3 in; Str | Bimba TE-313-CDHM
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS TE-313-CDHM Bulk 5 Weeks 1
    • 1 $1153.5
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    • 100 $1153.5
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    SKF 7213 CD/HCP4ADGA

    Precision Bearing | SKF 7213 CD/HCP4ADGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS 7213 CD/HCP4ADGA Bulk 3 Weeks 1
    • 1 $2311.63
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    SKF 7013 CD/HCP4ADGA

    ABEC-7 Prescision Ball Bearing | SKF 7013 CD/HCP4ADGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS 7013 CD/HCP4ADGA Bulk 3 Weeks 1
    • 1 $1994.75
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    • 100 $1994.75
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    SKF S7013 CD/HCP4ADBA

    Precision Angular Contact Ball Bearing, ID 65 mm, OD 100 mm, W 36 mm | SKF S7013 CD/HCP4ADBA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS S7013 CD/HCP4ADBA Bulk 3 Weeks 1
    • 1 $1280.79
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    13CDH Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    NEC asu

    Abstract: 13E3h 1442H
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original     		R8C/22 R8C/23 REJ09B0251-0200 NEC asu 13E3h 1442H PDF

    13CD

    Abstract: MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H
    Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0020 Rev.0.20 Sep 29, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is


    Original     		R8C/22, R8C/23 16-BIT REJ03B0097-0020 48-pin 13CD MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H PDF

    1N44H

    Abstract: 1a5ah 1178H 1N60H 1171H 1A86H 0m02 1b7ah 19C1H 1N14H
    Text: SONET/SDH Payload Extractor/Aligner SPECTRA-4x155 Production PM5316 SPECTRA 4x155 SONET/SDH Payload Extractor/Aligner 4 x 155 Mbit/s Datasheet Proprietary and Confidential Production Issue 4: March 2001 Proprietary and Confidential to PMC-Sierra, Inc. and for its customers’ internal use


    Original     		SPECTRA-4x155) PM5316 4x155 PMC-1990822, 1n31h PMC-1990822 1N44H 1a5ah 1178H 1N60H 1171H 1A86H 0m02 1b7ah 19C1H 1N14H PDF

    1312H

    Abstract: 144BH 1458h 1351h 13D0H 1444H
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0100 Rev.1.00 Oct 27, 2006 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level


    Original     		R8C/22 R8C/23 REJ03B0097-0100 48-pin 1312H 144BH 1458h 1351h 13D0H 1444H PDF

    SI 1340H

    Abstract: 1542H mx-126 1488h integrators si 1340h PSL 26 SA8 357 T1E1-7 DATA SHEET Equivalent MX12 MX23
    Text: PM5365 TEMAP STANDARD PRODUCT REGISTER DESCRIPTION PMC-1990682 ISSUE 2 HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER PM5365 TEMAP HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER REGISTER DESCRIPTION Proprietary and Confidential ISSUE 2: JULY 2001 PMC-Sierra, Inc.


    Original     		PM5365 PMC-1990682 PM5365 PMC-1990682 SI 1340H 1542H mx-126 1488h integrators si 1340h PSL 26 SA8 357 T1E1-7 DATA SHEET Equivalent MX12 MX23 PDF

    R5F2123

    Abstract: R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0110 Rev.1.10 Mar 16, 2007 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level


    Original     		R8C/22 R8C/23 REJ03B0097-0110 48-pin R5F2123 R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP PDF

    1C65H

    Abstract: 1a5ah
    Text: :5 6: 55 AM SPECTRA 4x155 ASSP Telecom Standard Product Data Sheet Released m be r, 20 05 12 PM5316 es da y, 13 De ce SPECTRA 4x155 Data Sheet Released Issue No. 6: November 2005 Do wn lo ad ed by Co nt e nt Te a m of P ar tm in er In co n Tu SONET/SDH Payload Extractor/Aligner


    Original     		4x155 PM5316 4x155 PMC-1990822, 1C65H 1a5ah PDF

    r5f2122ckfp

    Abstract: r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H
    Text: REJ09B0251-0200 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU R8C FAMILY / R8C/2x SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by


    Original     		REJ09B0251-0200 R8C/22 R8C/23 r5f2122ckfp r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H PDF

    SI 1360H

    Abstract: 1542H 1488h 1558h PSL 26 MX12 MX23 PM8315 SI 1340H
    Text: PM8315 TEMUX STANDARD PRODUCT REGISTER DESCRIPTIONS PMC-1990495 ISSUE 5 HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MUX PM8315 TEMUX HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MULTIPLEXER REGISTER DESCRIPTIONS Proprietary and Confidential


    Original     		PM8315 PMC-1990495 PM8315 SI 1360H 1542H 1488h 1558h PSL 26 MX12 MX23 SI 1340H PDF

    NEC 1378h

    Abstract: R5F2123CKFP 1347h 13F9H R5F21226DFP R5F21226JFP R5F2123 R5F21227JFP R5F21228DFP R5F21228JFP
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original     		PDF

    145AH

    Abstract: MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0200 Rev.2.00 Aug 20, 2008 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of


    Original     		R8C/22 R8C/23 REJ03B0097-0200 48-pin 145AH MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP PDF

    13D2H

    Abstract: 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H
    Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0010 Rev.0.10 Mar 08, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU


    Original     		R8C/22, R8C/23 16-BIT REJ03B0097-0010 48-pin di5-900 Unit2607 13D2H 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H PDF

    Untitled

    Abstract: No abstract text available
    Text: 2: 03 PM SPECTRA 4x155 ASSP Telecom Standard Product Data Sheet Released m be r, 20 02 02 :4 PM5316 da y, 03 De ce SPECTRA 4x155 Data Sheet Released Issue No. 5: September 2002 Do wn lo ad ed by Pa rtM i ne rI nc of Pa rtm in er In co n Tu es SONET/SDH Payload Extractor/Aligner


    Original     		4x155 PM5316 4x155 PMC-1990822, PDF

    Untitled

    Abstract: No abstract text available
    Text: REJ09B0251-0110 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU M16C FAMILY / R8C/Tiny SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by


    Original     		REJ09B0251-0110 R8C/22 R8C/23 PDF