NEC asu
Abstract: 13E3h 1442H
Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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R8C/22
R8C/23
REJ09B0251-0200
NEC asu
13E3h
1442H
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BIT3112
Abstract: DMI FUSE
Text: Intel Xeon® Processor L3406 Datasheet – Volume 2 March 2010 Document Number: 323055-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
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L3406
L3406
BIT3112
DMI FUSE
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13CD
Abstract: MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H
Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0020 Rev.0.20 Sep 29, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is
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R8C/22,
R8C/23
16-BIT
REJ03B0097-0020
48-pin
13CD
MA 1360H
13BFh
1344H
R5F21226JFP
R5F21226KFP
R5F21227JFP
R5F21227KFP
1421H
1447H
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1312H
Abstract: 144BH 1458h 1351h 13D0H 1444H
Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0100 Rev.1.00 Oct 27, 2006 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level
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R8C/22
R8C/23
REJ03B0097-0100
48-pin
1312H
144BH
1458h
1351h
13D0H
1444H
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SI 1340H
Abstract: 1542H mx-126 1488h integrators si 1340h PSL 26 SA8 357 T1E1-7 DATA SHEET Equivalent MX12 MX23
Text: PM5365 TEMAP STANDARD PRODUCT REGISTER DESCRIPTION PMC-1990682 ISSUE 2 HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER PM5365 TEMAP HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER REGISTER DESCRIPTION Proprietary and Confidential ISSUE 2: JULY 2001 PMC-Sierra, Inc.
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PM5365
PMC-1990682
PM5365
PMC-1990682
SI 1340H
1542H
mx-126
1488h
integrators si 1340h
PSL 26
SA8 357
T1E1-7 DATA SHEET Equivalent
MX12
MX23
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R5F2123
Abstract: R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP
Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0110 Rev.1.10 Mar 16, 2007 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level
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R8C/22
R8C/23
REJ03B0097-0110
48-pin
R5F2123
R5F2123CKFP
131Bh
R5F2122CJFP
R5F21226DFP
R5F21226JFP
R5F21227DFP
R5F21227JFP
1428H
R5F21228JFP
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r5f2122ckfp
Abstract: r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H
Text: REJ09B0251-0200 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU R8C FAMILY / R8C/2x SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by
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REJ09B0251-0200
R8C/22
R8C/23
r5f2122ckfp
r5f21237jfp
R5F21238KFP
REJ09B0251-0200
R5F21236JFP
R5F2123CKFP
1342H
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SI 1360H
Abstract: 1542H 1488h 1558h PSL 26 MX12 MX23 PM8315 SI 1340H
Text: PM8315 TEMUX STANDARD PRODUCT REGISTER DESCRIPTIONS PMC-1990495 ISSUE 5 HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MUX PM8315 TEMUX HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MULTIPLEXER REGISTER DESCRIPTIONS Proprietary and Confidential
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PM8315
PMC-1990495
PM8315
SI 1360H
1542H
1488h
1558h
PSL 26
MX12
MX23
SI 1340H
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NEC 1378h
Abstract: R5F2123CKFP 1347h 13F9H R5F21226DFP R5F21226JFP R5F2123 R5F21227JFP R5F21228DFP R5F21228JFP
Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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145AH
Abstract: MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP
Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0200 Rev.2.00 Aug 20, 2008 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of
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R8C/22
R8C/23
REJ03B0097-0200
48-pin
145AH
MA 1360H
1320H
1378H ic
r5f2122ckfp
R5F2123CKFP
13C4H
R5F2122AJFP
R5F21226DFP
R5F21227DFP
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13D2H
Abstract: 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H
Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0010 Rev.0.10 Mar 08, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU
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R8C/22,
R8C/23
16-BIT
REJ03B0097-0010
48-pin
di5-900
Unit2607
13D2H
1429H
1332H
R5F2123
1466H
1439H
1423H
1342H
13F9H
1436H
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Untitled
Abstract: No abstract text available
Text: REJ09B0251-0110 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU M16C FAMILY / R8C/Tiny SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by
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REJ09B0251-0110
R8C/22
R8C/23
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