NEC asu
Abstract: 13E3h 1442H
Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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R8C/22
R8C/23
REJ09B0251-0200
NEC asu
13E3h
1442H
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1037h
Abstract: 1250H 1488h MX12 MX23 PM5365
Text: PM5365 TEMAP STANDARD PRODUCT DATASHEET PMC-1991148 ISSUE 3 HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER PM5365 TEMAP VT/TU MAPPER AND M13 MULTIPLEXER DATA SHEET PROPRIETARY AND CONFIDENTIAL RELEASED ISSUE 3: SEPTEMBER 2001 Proprietary and Confidential to PMC-Sierra, Inc. and for its Customers’ Internal Use
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PM5365
PMC-1991148
PM5365
1037h
1250H
1488h
MX12
MX23
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BIT3112
Abstract: DMI FUSE
Text: Intel Xeon® Processor L3406 Datasheet – Volume 2 March 2010 Document Number: 323055-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
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L3406
L3406
BIT3112
DMI FUSE
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Untitled
Abstract: No abstract text available
Text: PM8315 TEMUX STANDARD PRODUCT DATASHEET ISSUE 7 HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MUX :5 4: 01 AM PMC-1981125 co n Fr id ay ,2 TEMUX 9O ct ob er ,2 00 4 10 PM8315 DATASHEET PROPRIETARY AND CONFIDENTIAL ISSUE 7: MAY 2001 Do wn lo
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PM8315
PMC-1981125
PM8315
PMC-19nd
PMC-1971268
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13CD
Abstract: MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H
Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0020 Rev.0.20 Sep 29, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is
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R8C/22,
R8C/23
16-BIT
REJ03B0097-0020
48-pin
13CD
MA 1360H
13BFh
1344H
R5F21226JFP
R5F21226KFP
R5F21227JFP
R5F21227KFP
1421H
1447H
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1587H
Abstract: No abstract text available
Text: PM8315 TEMUX PRELIMINARY DATASHEET PMC-981125 ISSUE 4 HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MUX PM8315 TEMUX HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MULTIPLEXER DATASHEET PROPRIETARY AND CONFIDENTIAL PRELIMINARY
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PMC-981125
PM8315
PM8315
PMC-981125
PMC-971268
1587H
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0B-09
Abstract: bip 109
Text: PM5365 TEMAP PRELIMINARY DATASHEET PMC-991148 ISSUE 1 VT/TU MAPPER AND M13 MUX PM5365 TEMAP VT/TU MAPPER AND M13 MULTIPLEXER DATASHEET PROPRIETARY AND CONFIDENTIAL PRELIMINARY ISSUE 1: SEPTEMBER 1999 PMC-Sierra, Inc. 105 - 8555 Baxter Place Burnaby, BC Canada V5A 4V7 604 .415.6000
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PMC-991148
PM5365
PM5365
PMC-991148
PMC-990691
0B-09
bip 109
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1N44H
Abstract: 1a5ah 1178H 1N60H 1171H 1A86H 0m02 1b7ah 19C1H 1N14H
Text: SONET/SDH Payload Extractor/Aligner SPECTRA-4x155 Production PM5316 SPECTRA 4x155 SONET/SDH Payload Extractor/Aligner 4 x 155 Mbit/s Datasheet Proprietary and Confidential Production Issue 4: March 2001 Proprietary and Confidential to PMC-Sierra, Inc. and for its customers’ internal use
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SPECTRA-4x155)
PM5316
4x155
PMC-1990822,
1n31h
PMC-1990822
1N44H
1a5ah
1178H
1N60H
1171H
1A86H
0m02
1b7ah
19C1H
1N14H
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1312H
Abstract: 144BH 1458h 1351h 13D0H 1444H
Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0100 Rev.1.00 Oct 27, 2006 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level
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R8C/22
R8C/23
REJ03B0097-0100
48-pin
1312H
144BH
1458h
1351h
13D0H
1444H
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SI 1340H
Abstract: 1542H mx-126 1488h integrators si 1340h PSL 26 SA8 357 T1E1-7 DATA SHEET Equivalent MX12 MX23
Text: PM5365 TEMAP STANDARD PRODUCT REGISTER DESCRIPTION PMC-1990682 ISSUE 2 HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER PM5365 TEMAP HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER REGISTER DESCRIPTION Proprietary and Confidential ISSUE 2: JULY 2001 PMC-Sierra, Inc.
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PM5365
PMC-1990682
PM5365
PMC-1990682
SI 1340H
1542H
mx-126
1488h
integrators si 1340h
PSL 26
SA8 357
T1E1-7 DATA SHEET Equivalent
MX12
MX23
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Untitled
Abstract: No abstract text available
Text: PM8315 TEMUX PRELIMINARY DATASHEET PMC-1981125 ISSUE 5 HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MUX PM8315 TEMUX HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MULTIPLEXER DATASHEET PROPRIETARY AND CONFIDENTIAL PRELIMINARY
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PMC-1981125
PM8315
PM8315
PMC-971268
PMC-1981125
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R5F2123
Abstract: R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP
Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0110 Rev.1.10 Mar 16, 2007 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level
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R8C/22
R8C/23
REJ03B0097-0110
48-pin
R5F2123
R5F2123CKFP
131Bh
R5F2122CJFP
R5F21226DFP
R5F21226JFP
R5F21227DFP
R5F21227JFP
1428H
R5F21228JFP
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1587H
Abstract: sdh demapper 1035H-1037H 1037h 1250H 1488h MX12 MX23 PM5365 9811J
Text: PM5365 TEMAP STANDARD PRODUCT DATASHEET ISSUE 3 HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER 11 :3 2: 49 PM PMC-1991148 ,1 1J an ua ry ,2 00 3 PM5365 to n Sa tu rd ay TEMAP DATA SHEET PROPRIETARY AND CONFIDENTIAL RELEASED ISSUE 3: SEPTEMBER 2001 Do wn lo
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PM5365
PMC-1991148
PM5365
1587H
sdh demapper
1035H-1037H
1037h
1250H
1488h
MX12
MX23
9811J
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1C65H
Abstract: 1a5ah
Text: :5 6: 55 AM SPECTRA 4x155 ASSP Telecom Standard Product Data Sheet Released m be r, 20 05 12 PM5316 es da y, 13 De ce SPECTRA 4x155 Data Sheet Released Issue No. 6: November 2005 Do wn lo ad ed by Co nt e nt Te a m of P ar tm in er In co n Tu SONET/SDH Payload Extractor/Aligner
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4x155
PM5316
4x155
PMC-1990822,
1C65H
1a5ah
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Untitled
Abstract: No abstract text available
Text: PM5365 TEMAP PRELIMINARY DATASHEET PMC-1991148 ISSUE 2 VT/TU MAPPER AND M13 MUX PM5365 TEMAP VT/TU MAPPER AND M13 MULTIPLEXER DATASHEET PROPRIETARY AND CONFIDENTIAL PRELIMINARY ISSUE 2: FEBRUARY 2000 PMC-Sierra, Inc. 105 - 8555 Baxter Place Burnaby, BC Canada V5A 4V7 604 .415.6000
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PMC-1991148
PM5365
PM5365
PMC-1991148
PMC-990691
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SI 1360H
Abstract: 1542H 1488h 1558h PSL 26 MX12 MX23 PM8315 SI 1340H
Text: PM8315 TEMUX STANDARD PRODUCT REGISTER DESCRIPTIONS PMC-1990495 ISSUE 5 HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MUX PM8315 TEMUX HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MULTIPLEXER REGISTER DESCRIPTIONS Proprietary and Confidential
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PM8315
PMC-1990495
PM8315
SI 1360H
1542H
1488h
1558h
PSL 26
MX12
MX23
SI 1340H
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NEC 1378h
Abstract: R5F2123CKFP 1347h 13F9H R5F21226DFP R5F21226JFP R5F2123 R5F21227JFP R5F21228DFP R5F21228JFP
Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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145AH
Abstract: MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP
Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0200 Rev.2.00 Aug 20, 2008 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of
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R8C/22
R8C/23
REJ03B0097-0200
48-pin
145AH
MA 1360H
1320H
1378H ic
r5f2122ckfp
R5F2123CKFP
13C4H
R5F2122AJFP
R5F21226DFP
R5F21227DFP
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EMFP RS
Abstract: mark 321f PM8315-PI 1037h 1250H 1488h MX12 MX23 PM8315 mux E1
Text: PM8315 TEMUX STANDARD PRODUCT DATASHEET PMC-1981125 ISSUE 7 HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MUX PM8315 TEMUX HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MULTIPLEXER DATASHEET PROPRIETARY AND CONFIDENTIAL ISSUE 7: MAY 2001
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PM8315
PMC-1981125
PM8315
PMC-1971268
EMFP RS
mark 321f
PM8315-PI
1037h
1250H
1488h
MX12
MX23
mux E1
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13D2H
Abstract: 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H
Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0010 Rev.0.10 Mar 08, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU
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R8C/22,
R8C/23
16-BIT
REJ03B0097-0010
48-pin
di5-900
Unit2607
13D2H
1429H
1332H
R5F2123
1466H
1439H
1423H
1342H
13F9H
1436H
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Untitled
Abstract: No abstract text available
Text: 2: 03 PM SPECTRA 4x155 ASSP Telecom Standard Product Data Sheet Released m be r, 20 02 02 :4 PM5316 da y, 03 De ce SPECTRA 4x155 Data Sheet Released Issue No. 5: September 2002 Do wn lo ad ed by Pa rtM i ne rI nc of Pa rtm in er In co n Tu es SONET/SDH Payload Extractor/Aligner
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4x155
PM5316
4x155
PMC-1990822,
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Untitled
Abstract: No abstract text available
Text: REJ09B0251-0110 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU M16C FAMILY / R8C/Tiny SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by
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REJ09B0251-0110
R8C/22
R8C/23
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