QUALITY CONTROL HARNESS ASSEMBLY
Abstract: 1612776-1
Text: 411-78121 Instruction Sheet 取扱説明書 CLEAN BODY 22FEB08 025/040 Rev. B1 防水 132 極/104 極/60 極 コネクタ （CLEAN BODY 025/040 SEALED 132Pos 104Pos 60Pos CONNECTOR） １． 製品名称及 製品名称及び び型番 Product Descriptions and Part Numbers
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22FEB08
132Pos
104Pos
60Pos
44Pos
34Pos
QUALITY CONTROL HARNESS ASSEMBLY
1612776-1
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JIS D1601 vibration Testing Method for Automobile
Abstract: No abstract text available
Text: Product Specification CLEAN BODY 025/040 Sealed 132pos Con Connector 108-5911 21SEP10 Rev.A3 1.Scope: 1.1 Contents This specification covers the requirements for product performance, test methods and quality assurance provisions of Clean Body 025/040 Sealed 132pos.Connector.
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132pos
21SEP10
100mm
44Pos
JIS D1601 vibration Testing Method for Automobile
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hk-001 94v-0
Abstract: sec d 5072 transistor D 5038 Transistor Horizontal equivalent of transistor sec 5027 8011-8G7 LSG-1DG17-14 508-AG10D augat 510AG92D20ES Catalog 1307612 augat 8136
Text: Catalog 1307612 Courtesy of Steven Engineering, Inc. Ÿ 230 Ryan Way, South San Francisco, CA, 94080-6370 Ÿ Main Office: 650 588-9200 Ÿ Outside Local Area: (800) 258-9200 Ÿ www.stevenengineering.com Sockets Revised 7-01 Table of Contents DIP Sockets Solder Tail Dual Leaf (DL) Contact …………………………………………5002-5007
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8046-1G1
8046-1G2
8046-1G3
8046-1G4
8046-1G5
8046-1G6
8046-1G7
8046-1G8
8046-1G9
8046-1G10
hk-001 94v-0
sec d 5072 transistor
D 5038 Transistor Horizontal
equivalent of transistor sec 5027
8011-8G7
LSG-1DG17-14
508-AG10D augat
510AG92D20ES
Catalog 1307612
augat 8136
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din 42802
Abstract: AMP,simel insulated crimp lugs raychem catalog termination kit and splicing kit cma 10024 531220-2 simel AMP 2-520128-2 7483 Raychem 55A CATALOG 42770-2
Text: Catalog 296642 Focused Product Guide Revised 3-99 Input/Output Connectors Index Table of Contents Section One: Input/Output Connector Click Below Subminiature D, HDP-20 Crimp, Snap-In Connector AMPLIMITE Crimp, Snap-In Contacts and Solder Contacts, Size 20 D
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HDP-20
HDF-20
HDJ-20
HD-22
HD-20
HDE-20
Weight--14
din 42802
AMP,simel insulated crimp lugs
raychem catalog termination kit and splicing kit
cma 10024
531220-2
simel
AMP 2-520128-2
7483
Raychem 55A CATALOG
42770-2
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95-132I25
Abstract: AMS-QQ-N-290
Text: P/N 95-132I25 JEDEC 132-Position QFP-to-PGA Adapter 0.025 [0.64] Pitch FEATURES • Convert surface-mount QFP packages to a 13x13 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,
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95-132I25
132-Position
13x13
C36000,
995132125-P
13x13
132PGM13072-30
AMS-QQ-N-290
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ht 13003
Abstract: LCD 16002 Aromat relay hb2e HT 1200-4 hb2e MOTOROLA 13003 Aromat hb2e HT 1000-4 amp 12011p 87c196
Text: Correct-A-Chip Adapters DIP-to-JEDEC TO Adapter Socket – www.arieselec.com/products/18012.pdf Correct-A-Chip™ with Collet Contacts – www.arieselec.com/products/18003.pdf SOIC-to-JEDEC TO Adapter – www.arieselec.com/products/18013.pdf Series 350000-HT High-Temperature
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com/products/18012
com/products/18003
com/products/18013
350000-HT
com/products/18005
com/products/18013RC
35W000
com/products/18007
com/products/18014
35W000-11-RC
ht 13003
LCD 16002
Aromat relay hb2e
HT 1200-4
hb2e
MOTOROLA 13003
Aromat hb2e
HT 1000-4 amp
12011p
87c196
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18017
Abstract: No abstract text available
Text: P/N 95-132I25 JEDEC 132-Position QFP-to-PGA Adapter 0.025 [0.64] Pitch FEATURES • Convert surface-mount QFP packages to a 13x13 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,
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95-132I25
132-Position
13x13
C36000,
B16/B16M
995132125-P
132PGM13072-30
18017
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DIMENSIONS PQFP 132
Abstract: 821949-51
Text: Data downloaded from http://www.anglia.com - the website of Anglia - tel: 01945 474747 Catalogue 1654741 PQFP Sockets Revised 1-04 Standard Product Facts .025 [0.64] centerline for high density, low cost packaging • Low profile permits even higher density packaging
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Untitled
Abstract: No abstract text available
Text: 132-Position 8 x 4 Header jjLnmn nom-iBy_nJLiUL 2-2.6 dia ( 2 - , 102) 2-2.6 dia 3.5 (.138) ( 2- , 102) am am m) am r-> o (r> «SI J=1 UUUU UUUU ITU U U U UUUU 32 29 28 2 5 ' 2 4 5 4 1 3 (•118) . contact No. 3.15 (.124) 116.22 (4.576) Right angle type
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132-Position
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Untitled
Abstract: No abstract text available
Text: Catalog 296642 Focused Product Guide Miscellaneous 1C Sockets PLCC Sockets - Low Profile, Surface Mount Square Sockets Material and Finish Housing — Polyphenylene sulfide, 40% glass-filled, 94V-0 rated 220°C Contacts — Phosphor bronze, plated.000200 [0,00508] min, tin-lead per
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MIL-T-10727
QQ-N-290
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80286 schematic
Abstract: lp9 pinout fe3031 FE3021A 8042 "Keyboard Controller" A1981 8042 keyboard controller LIM EMS 4.0 tl982 c3fff
Text: FE3021 DESCRIPTION 1.0 DESCRIPTION 1.1 The FE3021 is a 16 MHz AT address buffer and memory controller in a 132-pin JEDEC package. Chip count is significantly reduced by integrating the memory controller, AT bus address buffers, and I/O into one chip. The memory controller is a
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FE3021
FE3021
132-pin
FE3021.
FE3600B
aS5S23s36S3
0io10
Tl982
132POSN
80286 schematic
lp9 pinout
fe3031
FE3021A
8042 "Keyboard Controller"
A1981
8042 keyboard controller
LIM EMS 4.0
c3fff
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Untitled
Abstract: No abstract text available
Text: A I V I P Catalog 1307612 PQFP Sockets Revised 7-01 Standard Product Facts • .025 [0.64] centerline for high density, low cost packaging ■ Low profile permits even higher density packaging with only .375 [9.53] maximum height pc boards ■ High normal force and
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