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    1315H Search Results

    1315H Result Highlights (2)

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    89891-315HLF Amphenol Communications Solutions Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 30 Positions, 2.54mm (0.100in) Pitch Visit Amphenol Communications Solutions
    GSB3111315HR Amphenol Communications Solutions USB3.2, A, GEN1, RightAngle, DIP, 30u\\ GOLD, BLUE, TL 2.4MM Visit Amphenol Communications Solutions
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    1315H Price and Stock

    Microchip Technology Inc MCP101-315HI/TO

    IC SUPERVISOR 1 CHANNEL TO92-3
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    DigiKey MCP101-315HI/TO Bulk 254 1
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    Mouser Electronics MCP101-315HI/TO 1,968
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    NAC MCP101-315HI/TO Bag 2,000
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    Avnet Silica MCP101-315HI/TO 16 Weeks 1,000
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    Master Electronics MCP101-315HI/TO
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    JRH Electronics M83513/15-H03CP

    MICRO D CONNECTOR
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    DigiKey M83513/15-H03CP Bulk 200 1
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    JRH Electronics M83513/15-H01CN

    MICRO D CONNECTOR
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    JRH Electronics M83513/15-H01NP

    MICRO D CONNECTOR
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    DigiKey M83513/15-H01NP Bulk 95 1
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    JRH Electronics M83513/15-H03NY

    MICRO D CONNECTOR
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    DigiKey M83513/15-H03NY Bulk 92 1
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    1315H Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    NEC asu

    Abstract: 13E3h 1442H
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original     		PDF R8C/22 R8C/23 REJ09B0251-0200 NEC asu 13E3h 1442H

    13CD

    Abstract: MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H
    Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0020 Rev.0.20 Sep 29, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is


    Original     		PDF R8C/22, R8C/23 16-BIT REJ03B0097-0020 48-pin 13CD MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H

    smd marking STPA

    Abstract: 1488h stpa smd PM5354 sx 460 k2462 0741H AM 702 0B48H E22/6/AS7620/MSP430/AS7620/Datasheet-091/ITT TCA 700 Y
    Text: 08 AM S/UNI MULTI-2x12 ASSP Telecom Standard Product Data Sheet Released be r, 20 04 07 :2 4: PM5354 y, 14 Se pt em S/UNI® MULTI-2x12 in er In co n Tu es da Multi-rate SATURN® User Network Interface for 2x622, and 4x155 Released Issue No. 2: September 2003


    Original     		PDF MULTI-2x12 2x622, 4x155 PMC-2030926, MULTI-2x12 PM5354 31x31 JESD51 smd marking STPA 1488h stpa smd PM5354 sx 460 k2462 0741H AM 702 0B48H E22/6/AS7620/MSP430/AS7620/Datasheet-091/ITT TCA 700 Y

    63A52

    Abstract: PM5360 Hex schmitt trigger ecl isp connector block diagram 0521H 10A1H 0836H 1E6C
    Text: 22 AM S/UNI MULTI-48 ASSP Telecom Standard Product Data Sheet Released be r, 20 04 07 :2 3: PM5360 y, 14 Se pt em S/UNI® MULTI-48 in er In co n Tu es da Multi-rate SATURN® User Network Interface for 1x2488, 4x622, and 4x155 Released Issue No. 5: September 2003


    Original     		PDF MULTI-48 1x2488, 4x622, 4x155 PMC-2020735, MULTI-48TM PM5360 JESD51 63A52 PM5360 Hex schmitt trigger ecl isp connector block diagram 0521H 10A1H 0836H 1E6C

    1N44H

    Abstract: 1a5ah 1178H 1N60H 1171H 1A86H 0m02 1b7ah 19C1H 1N14H
    Text: SONET/SDH Payload Extractor/Aligner SPECTRA-4x155 Production PM5316 SPECTRA 4x155 SONET/SDH Payload Extractor/Aligner 4 x 155 Mbit/s Datasheet Proprietary and Confidential Production Issue 4: March 2001 Proprietary and Confidential to PMC-Sierra, Inc. and for its customers’ internal use


    Original     		PDF SPECTRA-4x155) PM5316 4x155 PMC-1990822, 1n31h PMC-1990822 1N44H 1a5ah 1178H 1N60H 1171H 1A86H 0m02 1b7ah 19C1H 1N14H

    1312H

    Abstract: 144BH 1458h 1351h 13D0H 1444H
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0100 Rev.1.00 Oct 27, 2006 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level


    Original     		PDF R8C/22 R8C/23 REJ03B0097-0100 48-pin 1312H 144BH 1458h 1351h 13D0H 1444H

    SI 1340H

    Abstract: 1542H mx-126 1488h integrators si 1340h PSL 26 SA8 357 T1E1-7 DATA SHEET Equivalent MX12 MX23
    Text: PM5365 TEMAP STANDARD PRODUCT REGISTER DESCRIPTION PMC-1990682 ISSUE 2 HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER PM5365 TEMAP HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER REGISTER DESCRIPTION Proprietary and Confidential ISSUE 2: JULY 2001 PMC-Sierra, Inc.


    Original     		PDF PM5365 PMC-1990682 PM5365 PMC-1990682 SI 1340H 1542H mx-126 1488h integrators si 1340h PSL 26 SA8 357 T1E1-7 DATA SHEET Equivalent MX12 MX23

    R5F2123

    Abstract: R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0110 Rev.1.10 Mar 16, 2007 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level


    Original     		PDF R8C/22 R8C/23 REJ03B0097-0110 48-pin R5F2123 R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP

    1C65H

    Abstract: 1a5ah
    Text: :5 6: 55 AM SPECTRA 4x155 ASSP Telecom Standard Product Data Sheet Released m be r, 20 05 12 PM5316 es da y, 13 De ce SPECTRA 4x155 Data Sheet Released Issue No. 6: November 2005 Do wn lo ad ed by Co nt e nt Te a m of P ar tm in er In co n Tu SONET/SDH Payload Extractor/Aligner


    Original     		PDF 4x155 PM5316 4x155 PMC-1990822, 1C65H 1a5ah

    r5f2122ckfp

    Abstract: r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H
    Text: REJ09B0251-0200 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU R8C FAMILY / R8C/2x SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by


    Original     		PDF REJ09B0251-0200 R8C/22 R8C/23 r5f2122ckfp r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H

    2482h b3

    Abstract: 3204H PL 2305H PMC-2021098 1A27H 171bh 1D18 336FH 1733H 3583H
    Text: 14 PM TUPP 2488 ASSP Data Sheet Register Description Released ob sd ay ,2 8O ct TUPP 2488 er ,2 00 4 12 :5 9: PM5364 rtm in er In co n Th ur SONET/SDH Tributary Unit Payload Processor For 2488.32 Mbit/s Interfaces Released Issue No. 6: August 2004 Do wn


    Original     		PDF PMC-2020188, PM5364 0115H, 011DH: 2482h b3 3204H PL 2305H PMC-2021098 1A27H 171bh 1D18 336FH 1733H 3583H

    SI 1360H

    Abstract: 1542H 1488h 1558h PSL 26 MX12 MX23 PM8315 SI 1340H
    Text: PM8315 TEMUX STANDARD PRODUCT REGISTER DESCRIPTIONS PMC-1990495 ISSUE 5 HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MUX PM8315 TEMUX HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MULTIPLEXER REGISTER DESCRIPTIONS Proprietary and Confidential


    Original     		PDF PM8315 PMC-1990495 PM8315 SI 1360H 1542H 1488h 1558h PSL 26 MX12 MX23 SI 1340H

    NEC 1378h

    Abstract: R5F2123CKFP 1347h 13F9H R5F21226DFP R5F21226JFP R5F2123 R5F21227JFP R5F21228DFP R5F21228JFP
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original     		PDF

    145AH

    Abstract: MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0200 Rev.2.00 Aug 20, 2008 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of


    Original     		PDF R8C/22 R8C/23 REJ03B0097-0200 48-pin 145AH MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP

    13D2H

    Abstract: 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H
    Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0010 Rev.0.10 Mar 08, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU


    Original     		PDF R8C/22, R8C/23 16-BIT REJ03B0097-0010 48-pin di5-900 Unit2607 13D2H 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H

    Untitled

    Abstract: No abstract text available
    Text: 2: 03 PM SPECTRA 4x155 ASSP Telecom Standard Product Data Sheet Released m be r, 20 02 02 :4 PM5316 da y, 03 De ce SPECTRA 4x155 Data Sheet Released Issue No. 5: September 2002 Do wn lo ad ed by Pa rtM i ne rI nc of Pa rtm in er In co n Tu es SONET/SDH Payload Extractor/Aligner


    Original     		PDF 4x155 PM5316 4x155 PMC-1990822,

    Untitled

    Abstract: No abstract text available
    Text: REJ09B0251-0110 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU M16C FAMILY / R8C/Tiny SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by


    Original     		PDF REJ09B0251-0110 R8C/22 R8C/23

    how to interface microcontroller optocoupler

    Abstract: b08 optocoupler all tda audio circuit diagrams TDA1315H C200 E008 FS48 SAA7310 Z/tvs e029
    Text: IN TEG R A TED C IR C U ITS T D A 1315H Digital audio input/output circuit DAIO Objective specification Supersedes data of M ay 1994 File under Integrated Circuits, IC01 D ecem ber 1994 Philips Sem iconductors PHILIPS P H ILIP S 7110fi5fc> O D flb in s ib


    OCR Scan     		PDF TDA1315H 711002b how to interface microcontroller optocoupler b08 optocoupler all tda audio circuit diagrams TDA1315H C200 E008 FS48 SAA7310 Z/tvs e029

    Untitled

    Abstract: No abstract text available
    Text: INTEGRATED CIRCUITS 1315H Digital audio input/output circuit DAIO Product specification Supersedes data of December 1994 File under Integrated Circuits, IC01 Philips Sem iconductors 1995 Jul 17 PHILIPS Philips Semiconductors Product specification Digital audio input/output circuit (DAIO)


    OCR Scan     		PDF TDA1315H 500/05/pp36

    7057Q

    Abstract: CD 1517 intergrated circuit 8844T 1305T A2611 7040T A1560Q 1557Q F908 1313T
    Text: Philips Semiconductors Semiconductors for Radio, Audio and CD/DVD Systems_ Types added to the range since the last issue of the IC02 C D -R O M 1997 issue are shown in bold print. In addition, types marked with an asterisk (*) are also in this booklet,


    OCR Scan     		PDF 80C31/80C51/87C51 80C32/80C52/87C52 80C451/83C451/87C451 80C52/80C54/80C58 80C528/83C528 80C550/83C550/87C550 80C552/83C552 P80C562; 80C652/83C652 80C851/83C851 7057Q CD 1517 intergrated circuit 8844T 1305T A2611 7040T A1560Q 1557Q F908 1313T

    TDA 1093

    Abstract: TDA 1083 1076 2t5 how to interface microcontroller optocoupler C200 E008 FS48 TDA1315H DD81S
    Text: Objective specification Philips Semiconductors Digital audio input/output circuit DAIO 1315H FEATURES GENERAL DESCRIPTION • Transceiver for SPDIF and “IEC 958” encoded signals The Digital Audio Input/Output circuit (DAIO) of the 1315H is a complete transceiver for biphase-mark


    OCR Scan     		PDF TDA1315H 7110fl2b SAA7310, 711002b TDA 1093 TDA 1083 1076 2t5 how to interface microcontroller optocoupler C200 E008 FS48 TDA1315H DD81S