SMTSDR575047
Abstract: SDR453226 SMTSDR453226C
Text: MINIATURE SMD CHIP CHOKE COILS SMTSDR 322515/321618C/322520 C /453226(C)/575047C TYPE Shape and Size :(Dimension are in mm ) Features : Ordering Information : ．These miniature chip inductors wound on a special ferrite core. SMT (1) ．SMTSDR322520 / 453226 / 322515 are high Q value
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322515/321618C/322520
/575047C
SMTSDR322520
SMTSDR321618C
322520C
453226C
565047C
SDR453226
100uH.
SMTSDR575047C
SMTSDR575047
SMTSDR453226C
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SMTSDR322520
Abstract: SDR453226 SMTSDR575047 SMTSDR453226C 575047C SMTSDR322520C 321618C w32 smd
Text: MINIATURE SMD CHIP CHOKE COILS SMTSDR 322515/321618C/322520 C /453226(C)/575047C TYPE Shape and Size :(Dimension are in mm ) Features : Ordering Information : ．These miniature chip inductors wound on a special SMT ferrite core. (1) ．SMTSDR322520 / 453226 / 322515 are high Q value
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322515/321618C/322520
/575047C
SMTSDR322520
SMTSDR321618C
322520C
453226C
565047C
SDR453226
100uH.
SMTSDR575047C
SMTSDR575047
SMTSDR453226C
575047C
SMTSDR322520C
321618C
w32 smd
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Untitled
Abstract: No abstract text available
Text: SMD Power Inductorɡ ɡVLH ɎDimensions Unit: mm Type A B C E F H I J 201609E 2.0±0.3 1.6±0.3 0.9±0.2 0.8ref 0.8ref 2.2 1.0 0.6 201514 2.0±0.3 1.5±0.3 1.4±0.4 0.5min. 1.0min. 2.2 0.95 0.8 321618C 3.2±0.3 1.6±0.2 1.8±0.3 0.7min. 0.7min. 1.5 1.5 1.0
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201609E
321618C
322520C
453226C
575047C
100KHz,
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Untitled
Abstract: No abstract text available
Text: X-ray TDI Camera C12200-321 Evolutional high speed scanning with TDI new standard. X-ray TDI camera C12200-321 is useful for in-line applications requiring high-speed operation with high sensitivity. TDI is a special image acquisition method that has been used extensively
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C12200-321
C12200-321
SFAS0026E02
AUG/2012
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SC22U6D3V5MX-2GP
Abstract: WISTRON power sequence WISTRON M40 TPS51125 TP2801 220O WISTRON hall effect sensor 66a WPCE773LA0DG SM r707 SAW
Text: 5 4 3 2 1 D D Alba UMA Schematics uFCPGA Mobile Penryn Intel Cantiga-GM + ICH9M C C 2009-01-13 REV : SB B B DY : Nopop Component A A <Core Design> Wistron Corporation 21F, 88, Sec.1, Hsin Tai Wu Rd., Hsichih, Taipei Hsien 221, Taiwan, R.O.C. Title Size Document Number
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SLG8SP513VTR
4BK01
4BK04
ISL62660K
PR3306
PR3431
PR3418
PR3802
SC22U6D3V5MX-2GP
WISTRON power sequence
WISTRON M40
TPS51125
TP2801
220O
WISTRON
hall effect sensor 66a
WPCE773LA0DG
SM r707 SAW
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Untitled
Abstract: No abstract text available
Text: CONDENSATEURS CHIPS CERAMIQUE CLASSE 2 CNC Format / Format 0403 0603 Modèle normalisé / Standard model 0402 CNC 19 CNC 19 A L W T max. a Conformes aux spécifications des normes CECC 32101 et NF C 93133 In accordance with the specifications of CECC 32101 and NF C 93133 standards
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maa 0403
Abstract: No abstract text available
Text: CONDENSATEURS CHIPS CERAMIQUE CLASSE 2 CNC BASSE TENSION LOW VOLTAGE Format / Format 0403 0603 Modèle normalisé / Standard model 0402 CNC 19 CNC 19 A L W T max. a Conformes aux spécifications des normes CECC 32101 et NF C 93133 In accordance with the specifications of
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CECC 32101
Abstract: 0805 cnc 331 MARKING CODE DE
Text: =Y lf exPage 9 rU e CeVoir / Se CERAMIC CHIP CAPACITORS CLASS 2 BASSE TENSION LOW VOLTAGE Format / Format 0403 0603 Modèle normalisé / Standard model 0402 CNC 19 CNC 19 A L W T max. a Conformes aux spécifications des normes CECC 32101 et NF C 93133 In accordance with the specifications of
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TP2801
Abstract: slg8sp513v diode tp806 RTM875N-606-VD-GR C5855 rtm875n-606 RTL8103 92HD81B1X5 ST330U2D5VDM-13GP 1SMB22AT3G-GP-U
Text: 5 4 3 2 1 D D Alba Discrete ATI M92-LP gDDR2 Schematics uFCPGA Mobile Penryn Intel Cantiga-PM + ICH9M C C 2009-03-23 REV : SA B B DY : Nopop Component GM : Pop when Cantiga is GM PM : Pop when Cantiga is PM G/P : BOM control if Cantiga is PM A A <Core Design>
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M92-LP
ISL6266A
SLG8SP513VTRove
R2218
R2220
C3005.
R4108.
PD3107
1SMB22AT3G.
PC3208,
TP2801
slg8sp513v
diode tp806
RTM875N-606-VD-GR
C5855
rtm875n-606
RTL8103
92HD81B1X5
ST330U2D5VDM-13GP
1SMB22AT3G-GP-U
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SN0608098
Abstract: MEC5035-NU R5U241 TPS5116 ZTE MF 180 circuit SLG8LP554VTR isl6260 SN0608098-GP TPS5117 foose
Text: 5 4 3 2 1 FOOSE 14" nVIDIA NB9M Schematics Document D D uFCPGA Mobile Penryn Intel Cantiga-PM + ICH9M C C 2009-04-07 REV : -1 DY : Nopop Component B_TPM : Use LOM TPM C_TPM : Use China TPM B B 5761 BTPM A A Wistron Corporation 21F, 88, Sec.1, Hsin Tai W u Rd., Hsichih,
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ISL6260
EMC4002
32Mx32BITx2
700MHz
cod68
49R95
8R274
C6387
R8149
SN0608098
MEC5035-NU
R5U241
TPS5116
ZTE MF 180 circuit
SLG8LP554VTR
isl6260
SN0608098-GP
TPS5117
foose
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TPS5117
Abstract: SN0608098 EMC4002 MEC5035 SRN100KJ-6-GP BCM5761 WISTRON power sequence EPSON C691 MAIN THERMAL fuse M33 07F schematic lcd inverter dell
Text: 5 4 3 2 1 D D FOOSE 15" UMA Schematics Document uFCPGA Mobile Penryn www.kythuatvitinh.com 2008-06-04 Intel Cantiga-GM + ICH9M C C REV : -1 B B DY : Nopop Component 5761 : Use BCM5761E 5756 : Use BCM5756M B_TPM : Use LOM TPM C_TPM : Use China TPM A A Wistron Corporation
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BCM5761E
BCM5756M
ISL6260
EMC4002
SLG8LP554Vscription
PC100706)
PR8140
PC9410
PR81411
TPS5117
SN0608098
EMC4002
MEC5035
SRN100KJ-6-GP
BCM5761
WISTRON power sequence
EPSON C691 MAIN
THERMAL fuse M33 07F
schematic lcd inverter dell
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Untitled
Abstract: No abstract text available
Text: 1 1234567895ABC5DEF55 5 55 5 1 1 22 5 245 5 85 85 1234562 5 A 5 2345674281 9ABC12C81 DEC221 F19AAA1 24A4281 9ABC12C81 DEC221 D1 A A 1 E 1 24!A"41 9ABC1C21 DEC21 #A$1%&A 1 1 1 1 1
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1234567895ABC5DEF
9ABC12C81
DEC221
9ABC12C8
DEC21
123456789A88B889BCD4E6FDC34DD68
88B88
88B88
63B4F588B88
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fit 221 heat shrink tubing
Abstract: FIT-500-8 heat gun
Text: 559-2012:QuarkCatalogTempNew 8/23/12 2:51 PM Page 559 4 Heat Shrink Products FIT MINIGUN® Kit 1 RoHS Shrink Ratio FITFAB-1 FITFAB-2 FITFAB-3 FITFAB-4 FITFAB-5 FITFAB-6 FITFAB-7 0.47 0.79 1.18 1.57 1.97 2.36 2.76 2:1 2:1 2:1 2:1 2:1 2:1 2:1 Spools of 25 or 50
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UL-1441.
KIT-221BK
KIT-221BK
fit 221 heat shrink tubing
FIT-500-8
heat gun
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SCD1U16V2KX-3GP
Abstract: b24 b03 so-8 WISTRON power sequence RTM875N-606-VD-GRT max8778 SC2D2U10V3KX-1GP SCD1U16V2KX RTS5158E WPCE773L g86 630 a2
Text: 5 4 3 2 1 D D DR1 Roberts Schematics Document uFCPGA Mobile Penryn Intel Cantiga-GM + ICH9M C C 2008-10-02 REV : A00 B B DY : Nopop Component A A <Core Design> Wistron Corporation 21F, 88, Sec.1, Hsin Tai Wu Rd., Hsichih, Taipei Hsien 221, Taiwan, R.O.C.
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ISL6266A
SLG8SP513VTR
4AQ01
TPS51117
P2003EVG
SCD1U16V2KX-3GP
b24 b03 so-8
WISTRON power sequence
RTM875N-606-VD-GRT
max8778
SC2D2U10V3KX-1GP
SCD1U16V2KX
RTS5158E
WPCE773L
g86 630 a2
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SLG8SP513VTR
Abstract: SC4D7P50V2CN-1GP max8778 WISTRON power sequence RTM875N-606-VD-GRT SC2D2U10V3KX-1GP wpce773 2N7002SPT ISL6236 foxconn
Text: 5 4 3 2 1 D D DR1 Roberts Schematics Document uFCPGA Mobile Penryn Intel Cantiga-GM + ICH9M C C 2008-06-27 REV : SB B B DY : Nopop Component A A <Core Design> Wistron Corporation 21F, 88, Sec.1, Hsin Tai Wu Rd., Hsichih, Taipei Hsien 221, Taiwan, R.O.C.
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ISL6266A
SLG8SP513VTR
4AQ01
08212-SB
TPS51117
SC4D7P50V2CN-1GP
max8778
WISTRON power sequence
RTM875N-606-VD-GRT
SC2D2U10V3KX-1GP
wpce773
2N7002SPT
ISL6236
foxconn
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55199
Abstract: awm style 2464 AWM 1015 AWG 20 awm style 2464 vw-1 24 awg awm style 2464 vw-1 2464 CSA AWM II A 24 AWG ft1 awm 2464 cable specification awm 2464 ft1 awm 20234 awm 2343
Text: UL Type CM AWM 2464 CSA PCC FT4 RoHS COMPLIANT 300 VOLT MULTICONDUCTOR, UNSHIELDED Xtreme Performance In Critical, High Technology Electronic Signal Applications XTREME PERFORMANCE BENEFITS: Unique Premium-Grade PVC Insulation And Jacket Provides Easier Routing Of
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HI1206N101R-10
Abstract: MI0805L301R-10 HR2220V801R-10 chip bead HI1612X560R-10 LI0805H121R-10
Text: Ferrite EMI Chip Beads Features: • Up to 10 Amps I MAX continuous operating capability • Low DCR • Vibration Resistant • Rugged monolithic construction • Small footprint • Excellent retention under bias • Superior impedance vs. frequency characteristics
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601on
LF0805A252R-10
LF1206A302R-10
LF1206C202R-10
LF1206E152R-10
SIP-BRO-CHIPBEADS-0807-C
HI1206N101R-10
MI0805L301R-10
HR2220V801R-10
chip bead
HI1612X560R-10
LI0805H121R-10
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HI1206N101R-10
Abstract: DA0804A601R-10 DA0804B471R-10 MI0603J601R-10 HI1206N101R-10 STEWARD
Text: Ferrite EMI Chip Beads Features: • Up to 10 Amps I MAX continuous operating capability • Low DCR • Vibration Resistant • Rugged monolithic construction • Small footprint • Excellent retention under bias • Superior impedance vs. frequency characteristics
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601on
LF0805A252R-10
LF1206A302R-10
LF1206C202R-10
LF1206E152R-10
SIP-BRO-CHIPBEADS-0807-C
HI1206N101R-10
DA0804A601R-10
DA0804B471R-10
MI0603J601R-10
HI1206N101R-10 STEWARD
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awm 2464
Abstract: alpha 5533 RoHS 5170C 464459 alpha 5522 ul 2464 cable AWM 2464 22 awg Style 2464 - CSA AWM cable
Text: 484-2012:QuarkCatalogTempNew 8/22/12 5:31 PM Page 484 3 TEST & MEASUREMENT Xtra-Guard 1 — Multiconductor, Foil Shield, Premium Grade PVC Jacket WIRE & CABLE Xtra-Guard ® Performance Cable Conductor: Stranded tinned copper. Insulation: Color coded premium PVC. Shield: Aluminum/polyester foil facing in plus
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17CT3
Abstract: 6586F a6W16 ETX 75 EA 250 301cl pn 0 273 003 210 D852 BD 266 S B536 FUS-040
Text: Table C-2. ASCII/EBCDIC Code Conversion Table Cont. AS C II TO EBCDIC HEX GPH OCT HEX 42 3 302 C2 43 C 303 C3 44 D 304 C4 45 E 305 C5 46 F 306 C6 47 G 307 C7 48 H 310 C8 49 I 311 C9 4A J 321 Ol 4ri K 322 D2 4C L 323 D3 4D M 324 D4 4E N 325 D5 4F O 326 D6
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OCR Scan
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CP-860
Abstract: CP-851 D5420
Text: T H IS COPY IS PROVIDED ON A RESTRICTED B A S IS AND IS NOT TO BE USED IN ANY WAY DETRIMENTAL TO THE INTERESTS OF PANDUIT CORP. PANDUIT PART NUMBER STUD SIZE PN18-6FF-3K #6 PN18-8FF-3K #8 P N 18 -10FF-3K # 10 DI ME NS IO NS . ±.030 A .80 12 0 . 321 .87 12 2 . 1 0 1
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PN18-6FF-3K
PN18-8FF-3K
-10FF-3K
CP-851,
CP-860,
CP-861
CA-800
1093AA
D8925
D5420
CP-860
CP-851
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391K0
Abstract: KO331 F KO 317 MS14049 ms75103 MS14043
Text: Mil Standard to Delevan Conversion Chart / MS -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 128 129 130 131 132 133 134 135 136 137 -30 -32 -34 -36 -38 -40 -42 -44 -47 -51 MS o CO LT10K 1537 00 MS 14046 17 18 19 20 21 22 23 24 25 26 MS LT4K MS18100 -10 thru -20 See MS14040
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OCR Scan
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LT10K
MS18100
MS14040
MS14041
MSI8100-28
MS14042
391K0
KO331
F KO 317
MS14049
ms75103
MS14043
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Untitled
Abstract: No abstract text available
Text: DALLAS DS1645EE Partitioned 1024K NV SRAM SEMICONDUCTOR PIN ASSIGNMENT FEATURES • Data retention in the absence of Vcc • Data ¡s automatically protected during power loss • Directly replaces 128K x 8 EPROM, EEPROM, or FLASH NC I| 1 321 Vcc A16 I1 311
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DS1645EE
1024K
32-pin
DS1645Y
DS1645Y/AB1024K
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7812+AA
Abstract: No abstract text available
Text: List of part numbers Page Part No. 09 09 09 09 09 18 009 18 009 18 009 18 009 18 009 7003 7004 7005 7007 7008 21 21 21 21 21 09 09 09 09 09 18 015 18 015 18 015 18 015 18 015 7003 7004 7005 7007 7008 21 21 21 21 21 09 09 09 09 09 18 025 18 025 18 025 18 025
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