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Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: Reportable Substances in Components Package Type : QFN 10 Lead #: No 1 2 3 3 4 5 6 Material Molding Compound Copper Alloy Frame Leadframe Plating Silver Die Attach Epoxy Gold Wire External Lead Plating Silicon Die Rev ECN A 112910HC09 Content in % 58.71% 34.66%	Original	PDF	QFN22-10LD-GRN-RS-3 112910HC09

Catalog Datasheet

MFG & Type

PDF

Document Tags

Untitled

Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : QFN 10 Lead #: No 1 2 3 3 4 5 6 Material Molding Compound Copper Alloy Frame Leadframe Plating Silver Die Attach Epoxy Gold Wire External Lead Plating Silicon Die Rev ECN A 112910HC09 Content in % 58.71% 34.66%

Original

PDF

QFN22-10LD-GRN-RS-3 112910HC09