Aluminum Backside
Abstract: No abstract text available
Text: SO LITR O IM P O W E R M O S F E T CHIP NUMBER CONTACT METALLIZATION Top Contact: A Aluminum 22,000 Backside Contact: 3,000 A Gold ASSEM BLY RECOMMENDATIONS It is advisable that: 111 MILS 2.81mm a) the chip be eutectically mounted with gold silicon preform 98/2% .
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Aluminum Backside
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TIS88A equivalent
Abstract: 2N3456 equivalent J411 fet 2n5952 equivalent 2n3820 equivalent 2N5248 equivalent fet 2N4304 2n5245 equivalent 2N4304 equivalent 2N5454 equivalent
Text: a t t m ,© O R D E R IN G IN F O R M A T IO N Devices, Inc T O / » © 0© T Q K © K lO tP i M f l® The following is the product code index lor J-FET and MOS FET DIE/WAFERS having 2N, 3N JEDEC prefixes. This product code index is Solitron San Diego's standard for Q. A. production, marketing and sales.
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TIS88A equivalent
2N3456 equivalent
J411 fet
2n5952 equivalent
2n3820 equivalent
2N5248 equivalent
fet 2N4304
2n5245 equivalent
2N4304 equivalent
2N5454 equivalent
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Abstract: SOLITRON
Text: S O LIT R O N P O W E R M O S FET CHIP NUMBER /O CONTACT METALLIZATION Top Contact: A Aluminum 22,000 Backside Contact: 3,000 A Gold ASSEMBLY RECOMMENDATIONS It is advisable that: 111 MILS 2.81mm a) the chip be eutectically mounted with gold silicon preform 98/2%.
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111x109
top 261
SOLITRON
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