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    1100SF Search Results

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    1100SF Price and Stock

    JRH Electronics 805-010Z121-100SF

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    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 805-010Z121-100SF 237 1
    • 1 $6346.39
    • 10 $5838.682
    • 100 $5584.826
    • 1000 $5584.826
    • 10000 $5584.826
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    JRH Electronics 805-003-07M21-100SF

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    DigiKey 805-003-07M21-100SF 152 1
    • 1 $4068.17
    • 10 $3742.713
    • 100 $3579.9863
    • 1000 $3579.9863
    • 10000 $3579.9863
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    JRH Electronics 805-003-22NF21-100SF

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    DigiKey 805-003-22NF21-100SF 147 1
    • 1 $3932.15
    • 10 $3617.575
    • 100 $3460.2888
    • 1000 $3460.2888
    • 10000 $3460.2888
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    JRH Electronics 805-004-22Z121-100SF

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    DigiKey 805-004-22Z121-100SF 95 1
    • 1 $3010.83
    • 10 $2795.769
    • 100 $2688.2393
    • 1000 $2688.2393
    • 10000 $2688.2393
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    JRH Electronics 805-061-16M21-100SF316

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    DigiKey 805-061-16M21-100SF316 89 1
    • 1 $3440.95
    • 10 $3000.076
    • 100 $2903.2993
    • 1000 $2903.2993
    • 10000 $2903.2993
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    Find more 1100SF price and stock on Findchips.com

    1100SF Datasheets Context Search

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    Untitled

    Abstract: No abstract text available
    Text: Gap Filler 1100SF Two-Part Thermally Conductive, Silicone-Free, Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 1100SF PROPERTY Color / Part A • Thermal conductivity: 1.1 W/m-K • No silicone outgassing or extraction


    Original     		PDF 100SF 1100SF 1100SF

    diode sod-123 marking code 120

    Abstract: No abstract text available
    Text: CYStech Electronics Corp. Spec. No. : C338SF Issued Date : 2003.06.16 Revised Date : Page No. : 1/3 1.0Amp. Surface Mount Schottky Barrier Diodes CSOD120-1100SF Series Features • For surface mounted applications. • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications


    Original     		PDF C338SF CSOD120-1100SF MIL-S-19500/228 OD-123/Mini MIL-STD-750 UL94V-0 CSOD120-1100SF diode sod-123 marking code 120

    Untitled

    Abstract: No abstract text available
    Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE


    Original     		PDF