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    103IN Price and Stock

    L-com Inc LCCA30710-3IN

    COAX CBL SMA TO CABLE 3"
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    DigiKey LCCA30710-3IN Bag 1
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    Newark LCCA30710-3IN Bulk 1
    • 1 $42.01
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    RS LCCA30710-3IN Bulk 3 Weeks 1
    • 1 $43.59
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    • 100 $37.88
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    IBase Technology (USA) INOSP191B-COVER

    Modules Accessories IP65 I/O cover (Backward),191B M12 w/LAN,USB,COM,Power input
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    IBase Technology (USA) INOSP191D-COVER

    Modules Accessories IP65 I/O cover (Downward),191D M12 w/LAN,USB,COM,Power input
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    IBase Technology (USA) INOSP-151-RE

    Panel PCs 15" PANEL PC,Atom D2550,RES-TS 4GB RAM (no PSU/HDD/IO cover)
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    Mouser Electronics INOSP-151-RE
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    IBase Technology (USA) INOSP-191-RE

    Panel PCs 19" PANEL PC,Atom D2550,RES-TS 4GB RAM (no PSU/HDD/IO cover)
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    103IN Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    STM CL-80

    Abstract: P87C591VFA 8xC591 80C51 P83C591 P83C591VFA P83C591VFB P87C554 P87C591 P87C591VFB
    Text: INTEGRATED CIRCUITS DATA SHEET P8xC591 Single-chip 8-bit microcontroller with CAN controller Preliminary Specification File under Integrated Circuits, IC28 2000 Jul 26 Philips Semiconductors Preliminary Specification Single-chip 8-bit microcontroller with CAN controller


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    P8xC591 STM CL-80 P87C591VFA 8xC591 80C51 P83C591 P83C591VFA P83C591VFB P87C554 P87C591 P87C591VFB PDF

    duraseal

    Abstract: SiC IGBT High Power Modules sic wafer 100 mm Wacker Silicones 28Cu72Ag wacker 100C parallel mosfet Cree SiC MOSFET silicon carbide
    Text: Performance and Reliability Characteristics of 1200 V, 100 A, 200oC Half-Bridge SiC MOSFET-JBS Diode Power Modules James D. Scofield and J. Neil Merrett Air Force Research Laboratory 1950 Fifth St WPAFB, OH 45433 937-255-5949 james.scofield@wpafb.af.mil James Richmond and


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    200oC duraseal SiC IGBT High Power Modules sic wafer 100 mm Wacker Silicones 28Cu72Ag wacker 100C parallel mosfet Cree SiC MOSFET silicon carbide PDF

    STM CL-80

    Abstract: MHI001 Philips ID27 8xC591 MHI009 sm 0038 ir receiver MHI002 Microcontroller Based Automatic Railways Signaling P87C591SFB 80C51
    Text: INTEGRATED CIRCUITS DATA SHEET P8xC591 Single-chip 8-bit microcontroller with CAN controller Objective Specification File under Integrated Circuits, IC20 1999 Aug 19 Philips Semiconductors Objective Specification Single-chip 8-bit microcontroller with CAN controller


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    P8xC591 STM CL-80 MHI001 Philips ID27 8xC591 MHI009 sm 0038 ir receiver MHI002 Microcontroller Based Automatic Railways Signaling P87C591SFB 80C51 PDF

    tungsten slug glass diode

    Abstract: CERAMIC PIN GRID ARRAY wire lead frame 28F001BX 28F010 28F020 a5637 a5609 PERFORMANCE CHARACTERISTICS OF IC PACKAGES
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


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    PDF

    A5620

    Abstract: 3g call flow Sensor Cement Capacitor CQ DIODE DATABOOK tsop Ir sensor SLOTTED OPTICAL SWITCH inductive displacement sensors Side Brazed Ceramic Dual-In-Line Packages schematic inductive proximity sensor schematic AC inductive proximity sensor
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


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    Philips SJA1000 standalone CAN

    Abstract: MHI-002 80C51 P80C591 P80C591SFA P80C591SFB P83C591 P83C591SFA P87C554 P87C591
    Text: INTEGRATED CIRCUITS DATA SHEET P8xC591 Single-chip 8-bit microcontroller with CAN controller Objective Specification File under Integrated Circuits, IC20 1999 Aug 19 Philips Semiconductors Objective Specification Single-chip 8-bit microcontroller with CAN controller


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    P8xC591 Philips SJA1000 standalone CAN MHI-002 80C51 P80C591 P80C591SFA P80C591SFB P83C591 P83C591SFA P87C554 P87C591 PDF

    A5625-01

    Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


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    PDF

    MHI-002

    Abstract: No abstract text available
    Text: INTEGRATED CIRCUITS DAT P8xC591 Single-chip 8-bit microcontroller with CAN controller Preliminary Specification File under Integrated Circuits, IC28 2000 Jul 26 Philips Semiconductors Preliminary Specification Single-chip 8-bit microcontroller with CAN controller


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    P8xC591 MHI-002 PDF