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    100 BALL EMMC MEMORY Search Results

    100 BALL EMMC MEMORY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CYD18S18V18-167BBAXC Rochester Electronics LLC 1MX18 DUAL-PORT SRAM, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Visit Rochester Electronics LLC Buy
    CYD36S36V18-167BGXI Rochester Electronics 1MX36 DUAL-PORT SRAM, 4ns, PBGA484, 27 X 27 MM, 2.33 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-484 Visit Rochester Electronics Buy
    CYD18S18V18-167BBAXI Rochester Electronics LLC 1MX18 DUAL-PORT SRAM, 4ns, PBGA256, 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Visit Rochester Electronics LLC Buy
    MD2114A-5 Rochester Electronics LLC SRAM Visit Rochester Electronics LLC Buy
    MC28F008-10/B Rochester Electronics LLC EEPROM, Visit Rochester Electronics LLC Buy

    100 BALL EMMC MEMORY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    eMMC data retention

    Abstract: emmc jedec mechanical standard data retention samsung emmc boot emmc 5.0 numonyx oneNand flash Samsung EMMC "boot mode" samsung eMMC emmc Initialization eMMC samsung eMMC 5.0
    Text: NAND225AQA9P 2-Gbit demux I/O OneNAND , 2-Gbyte NAND with MMC™ interface & 2x1-Gbit x32 DDR LPSDRAM MCP Preliminary Data Features • MCP (multichip package) – 2-Gbit (x16) high-density SLC large page OneNAND™ flash memory(a) – 2x1-Gbit (x32) DDR LPSDRAM


    Original     		PDF NAND225AQA9P LFBGA199 eMMC data retention emmc jedec mechanical standard data retention samsung emmc boot emmc 5.0 numonyx oneNand flash Samsung EMMC "boot mode" samsung eMMC emmc Initialization eMMC samsung eMMC 5.0

    emmc 5.0

    Abstract: numonyx oneNand flash NUMONYX emmc samsung eMMC 5.0 eMMC driver eMMC powerdown emmc samsung eMMC samsung emmc boot samsung mcp emmc
    Text: NAND225AQA5P 2-Gbit demux I/O OneNAND , 2-Gbyte NAND with MMC™ interface & 2x1-Gbit x32 DDR LPSDRAM MCP Preliminary Data Features • MCP (multichip package) – 2-Gbit (x16) high-density SLC large page OneNAND™ flash memory(a) – 2x1-Gbit (x32) DDR LPSDRAM


    Original     		PDF NAND225AQA5P LFBGA199 emmc 5.0 numonyx oneNand flash NUMONYX emmc samsung eMMC 5.0 eMMC driver eMMC powerdown emmc samsung eMMC samsung emmc boot samsung mcp emmc

    emmc pin

    Abstract: 221 ball eMMC memory numonyx oneNand flash samsung emmc boot eMMC slc mode emmc 5.0 samsung eMMC 5.0 emmc boot operation emmc jedec Flash Memory SAMSUNG OneNAND mcp
    Text: NAND114APA5M 1-Gbit, mux I/O OneNAND , 1-Gbyte NAND with MMC™ interface & 1-Gbit x32 DDR LPSDRAM MCP Preliminary Data Features • ■ ■ MCP (multichip package) – 1-Gbit (x16) high-density SLC large page OneNAND™ flash memory(a) – 1-Gbit (x32) DDR LPSDRAM


    Original     		PDF NAND114APA5M LFBGA199 emmc pin 221 ball eMMC memory numonyx oneNand flash samsung emmc boot eMMC slc mode emmc 5.0 samsung eMMC 5.0 emmc boot operation emmc jedec Flash Memory SAMSUNG OneNAND mcp

    emmc pin

    Abstract: emmc 5.0 samsung eMMC 5.0 221 ball eMMC memory emmc controller emmc jedec mechanical standard data retention samsung eMMC NUMONYX emmc eMMC slc mode NAND08GAH
    Text: NAND114AQA5M 1-Gbit, demux I/O OneNAND , 1-Gbyte NAND with MMC™ interface & 1-Gbit x32 DDR LPSDRAM MCP Preliminary Data Features • MCP (multichip package) – 1-Gbit (x16) high-density SLC large page OneNAND™ flash memory(a) – 1-Gbit (x32) DDR LPSDRAM


    Original     		PDF NAND114AQA5M LFBGA199 emmc pin emmc 5.0 samsung eMMC 5.0 221 ball eMMC memory emmc controller emmc jedec mechanical standard data retention samsung eMMC NUMONYX emmc eMMC slc mode NAND08GAH

    "Manufacturer ID" eMMC

    Abstract: emmc JESD84-A43 eMMC memory emmc ball EXT_CSD emmc CID NAND02GAH0L emmc EXT_CSD Manufacturer ID list eMMC
    Text: NAND02GRH0L NAND02GAH0L NAND08GAH0N 256-Mbyte, 1-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface LFBGA169 ■ 256 Mbytes and 1 Gbyte of formatted data


    Original     		PDF NAND02GRH0L NAND02GAH0L NAND08GAH0N 256-Mbyte, LFBGA169 LFBGA169 "Manufacturer ID" eMMC emmc JESD84-A43 eMMC memory emmc ball EXT_CSD emmc CID emmc EXT_CSD Manufacturer ID list eMMC

    SDIN7DP2-4G

    Abstract: TWL6037 Sandisk eMMC OMAP5432 OMAP5430 SDIN7DP2 IN248 IN255 SN75LVCP412
    Text: OMAP5432 ES2.0 EVM System Reference Manual Texas Instruments Revision 0.4 March 1, 2013 DOC-21163 OMAP5432 ES2.0 EVM System Reference Manual Preface Read This First About This Manual This manual should be used by software and hardware developers of applications based on the


    Original     		PDF OMAP5432 DOC-21163 750-2628-2XX-SCH) EVM5432 750-2628-213-EBOM) SDIN7DP2-4G TWL6037 Sandisk eMMC OMAP5430 SDIN7DP2 IN248 IN255 SN75LVCP412

    "Manufacturer ID" eMMC

    Abstract: Specification eMMC 4.0 JESD84-B41 Manufacturer ID list eMMC eMMC slc mode emmc Extended CSD emmc write emmc csd JESD84-A41 emmc firmware
    Text: NAND02GAH0I NAND08GAH0F 256-Mbyte, 1-Gbyte, 1.8 V/3.3 V supply, NAND flash memory with MultiMediaCard interface Features • Packaged NAND flash memory with MultiMediaCard interface ■ 256 Mbytes and 1 Gbyte of formatted data storage ■ eMMC/MultiMediaCard system specification,


    Original     		PDF NAND02GAH0I NAND08GAH0F 256-Mbyte, "Manufacturer ID" eMMC Specification eMMC 4.0 JESD84-B41 Manufacturer ID list eMMC eMMC slc mode emmc Extended CSD emmc write emmc csd JESD84-A41 emmc firmware

    MMC02G

    Abstract: emmc bga "Manufacturer ID" eMMC emmc csd NUMONYX emmc NAND08GAH0J NAND16GAH0H 221 ball eMMC memory emmc CID Manufacturer ID list eMMC
    Text: NAND08GAH0J NAND16GAH0H 1-Gbyte, 2-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface ■ Up to 2 Gbytes of formatted data storage ■ eMMC/MultiMediaCard system specification,


    Original     		PDF NAND08GAH0J NAND16GAH0H MMC02G emmc bga "Manufacturer ID" eMMC emmc csd NUMONYX emmc NAND16GAH0H 221 ball eMMC memory emmc CID Manufacturer ID list eMMC

    MMC02G

    Abstract: LFBGA169 BGA 221 eMMC
    Text: NAND08GAH0J NAND16GAH0H 1-Gbyte, 2-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface LFBGA153 ■ Up to 2 Gbytes of formatted data storage


    Original     		PDF NAND08GAH0J NAND16GAH0H LFBGA153 MMC02G LFBGA169 BGA 221 eMMC

    OMAP5430

    Abstract: OMAP5432 MIPI CSI-2 Parallel bridge Toshiba eMMC 4.40 emmc pcb layout toshiba eMMC DS MIPI DPI CAMERA PARALLEL RGB TO MIPI CSI-2 TWL6041 emmc toshiba
    Text: Version F EL I M Data Manual IN Multimedia Device Engineering Samples 2.0 AR OMAP5430 Public Version PR ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.


    Original     		PDF OMAP5430 SWPS052F OMAP5430 OMAP5432 MIPI CSI-2 Parallel bridge Toshiba eMMC 4.40 emmc pcb layout toshiba eMMC DS MIPI DPI CAMERA PARALLEL RGB TO MIPI CSI-2 TWL6041 emmc toshiba

    emmc spec

    Abstract: ppi interface 1007 ppi 2120 ADSP-BF524KBCZ-4C2 sk emmc e-mmc ADZS-BF518F-EZLITE emmc controller ADSP-BF548BBCZ-5A ADSP-BF516KSWZ-4F4
    Text: Blackfin Processor Family Cryptography Rights Management Open Source Car Telematics IPTV Mobile TV Driver Assistance Biometrics Streaming Media High Definition Embedded Processing Why Choose a Blackfin Processor? Effects Processing • High performance, 16-/32-bit processor core with DSP and RISC functionality


    Original     		PDF 16-/32-bit G04492-5-10/08 emmc spec ppi interface 1007 ppi 2120 ADSP-BF524KBCZ-4C2 sk emmc e-mmc ADZS-BF518F-EZLITE emmc controller ADSP-BF548BBCZ-5A ADSP-BF516KSWZ-4F4

    MMC04G

    Abstract: "Manufacturer ID" eMMC LFBGA169 MMC08G EMMC HOST CONTROLLER emmc bga NAND32GAH emmc Extended CSD NAND32GAH0H NAND64GAH0H
    Text: NAND32GAH0H NAND64GAH0H 4-Gbyte, 8-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface ■ Up to 8 Gbytes of formatted data storage ■ High capacity memory access


    Original     		PDF NAND32GAH0H NAND64GAH0H MMC04G "Manufacturer ID" eMMC LFBGA169 MMC08G EMMC HOST CONTROLLER emmc bga NAND32GAH emmc Extended CSD NAND64GAH0H

    emmc spi

    Abstract: programming for embedded systems ADSP-BF532SBSTZ400 ADSP-BF537-STAMP EMMC HOST CONTROLLER adsp-bf537kbcz-6av LABVIEW EMBEDDED PLATFORM EVALUATION KIT ADSP-BF525 ADSP-BF518 AD1871
    Text: Blackfin Processor Family Why Choose a Blackfin Processor? • High performance, 16-/32-bit Blackfin processor core with DSP and RISC functionality and programmability • Eliminates need for multiple separate processors • Large portfolio of products ranging from 300 MHz to 600 MHz


    Original     		PDF 16-/32-bit G04492-2-12/09 emmc spi programming for embedded systems ADSP-BF532SBSTZ400 ADSP-BF537-STAMP EMMC HOST CONTROLLER adsp-bf537kbcz-6av LABVIEW EMBEDDED PLATFORM EVALUATION KIT ADSP-BF525 ADSP-BF518 AD1871

    MMC02G

    Abstract: "Manufacturer ID" eMMC 2Gbyte NAND flash emmc controller eMMC driver emmc 16g emmc csd emmc Initialization emmc jedec emmc jedec mechanical standard
    Text: NAND08GAH0J NAND16GAH0H 1-Gbyte, 2-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface LFBGA153 ■ Up to 2 Gbytes of formatted data storage


    Original     		PDF NAND08GAH0J NAND16GAH0H MMC02G "Manufacturer ID" eMMC 2Gbyte NAND flash emmc controller eMMC driver emmc 16g emmc csd emmc Initialization emmc jedec emmc jedec mechanical standard

    Untitled

    Abstract: No abstract text available
    Text: NAND16GAH0P NAND64GAH0P 2-Gbyte, 8-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface ■ 2 and 8 Gbytes of formatted data storage ■ eMMC/MultiMediaCard system specification,


    Original     		PDF NAND16GAH0P NAND64GAH0P

    ADSP-BF561SBBCZ-5A

    Abstract: D1854 ADSP-BF537-STAMP adzs-hpusb-ice ADZS-BF533 ADP5022 ADSP-BF516BBCZ-4 ADSP-BF518BBCZ-4F4 ADSP-BF539BBCZ-5F8 ADSP-BF504BCPZ
    Text: Blackfin Processor Family Why Choose a Blackfin Processor? • High performance, 16-/32-bit Blackfin processor core with DSP and RISC functionality and programmability • Eliminates need for multiple separate processors • Large portfolio of products ranging from 300 MHz to 600 MHz


    Original     		PDF 16-/32-bit G04492-2-9/10 ADSP-BF561SBBCZ-5A D1854 ADSP-BF537-STAMP adzs-hpusb-ice ADZS-BF533 ADP5022 ADSP-BF516BBCZ-4 ADSP-BF518BBCZ-4F4 ADSP-BF539BBCZ-5F8 ADSP-BF504BCPZ

    JESD84-A43

    Abstract: emmc EXT_CSD CMD38 NAND16GAH0P EXT_CSD emmc csd emmc sector size emmc jedec 32G nand NAND32GAH0P
    Text: NAND16GAH0P NAND32GAH0P NAND64GAH0P 2-Gbyte, 4-Gbyte, 8-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface ■ 2, 4 and 8 Gbytes of formatted data storage


    Original     		PDF NAND16GAH0P NAND32GAH0P NAND64GAH0P JESD84-A43 emmc EXT_CSD CMD38 EXT_CSD emmc csd emmc sector size emmc jedec 32G nand

    Toshiba NAND BGA 224

    Abstract: Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB
    Text: Preliminary THGBM3G5D1FBAIE TOSHIBA e-MMC Module 4GB THGBM3G5D1FBAIE INTRODUCTION THGBM3G5D1FBAIE is 4-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.


    Original     		PDF P-TFBGA169-1216-0 Toshiba NAND BGA 224 Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB

    Toshiba emmc

    Abstract: THGBM eMMC data retention Toshiba NAND BGA 224 P-TFBGA153-1113-0 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G
    Text: Preliminary THGBM3G4D1FBAIG TOSHIBA e-MMC Module 2GB THGBM3G4D1FBAIG INTRODUCTION THGBM3G4D1FBAIG is 2-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.


    Original     		PDF P-TFBGA153-1113-0 Toshiba emmc THGBM eMMC data retention Toshiba NAND BGA 224 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 5, 06/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50

    Samsung eMMC 4.51

    Abstract: samsung eMMC 4.5
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50 Samsung eMMC 4.51 samsung eMMC 4.5

    samsung eMMC 4.5

    Abstract: Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4
    Text: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 2, 04/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50 samsung eMMC 4.5 Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4

    samsung eMMC 4.5

    Abstract: eMMC 4.51 Samsung eMMC 4.41 emmc 4.5 spec Samsung eMMC 4.51 emmc 4.41 spec eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec samsung
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50 samsung eMMC 4.5 eMMC 4.51 Samsung eMMC 4.41 emmc 4.5 spec Samsung eMMC 4.51 emmc 4.41 spec eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec samsung

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 6, 08/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50