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    1.8 MM PITCH BGA Search Results

    1.8 MM PITCH BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    D6417750RBP240DV Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    HD6417750RBP240 Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    HD6417750RBP200V Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    7MMV4101S10BGI Renesas Electronics Corporation 128K X 24 MCM BGA 3.3 Visit Renesas Electronics Corporation
    7MMV4101S15BG Renesas Electronics Corporation 128K X 24 MCM BGA 3.3 Visit Renesas Electronics Corporation

    1.8 MM PITCH BGA Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    gs8182d18d200

    Abstract: No abstract text available
    Text: GS8182D18D-200/167 200 MHz–167 MHz 1.8 V VDD 1.8 V and 1.5 V I/O 18Mb Burst of 4 SigmaQuad-II SRAM 165-Bump BGA Commercial Temp Industrial Temp SigmaRAM Family Overview Bottom View 165-Bump, 13 mm x 15 mm BGA 1 mm Bump Pitch, 11 x 15 Bump Array JEDEC Std. MO-216, Variation CAB-1


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    GS8182D18D-200/167 165-Bump 165-bump, 144Mb 8182Dxx gs8182d18d200 PDF

    Untitled

    Abstract: No abstract text available
    Text: GS8182Q18/36D-200/167/133 200MHz133MHz 1.8 V VDD 1.8 V and 1.5 V I/O 18Mb Burst of 2 SigmaQuad-II SRAM 165-Bump BGA Commercial Temp Industrial Temp SigmaRAM Family Overview Bottom View 165-Bump, 13 mm x 15 mm BGA 1 mm Bump Pitch, 11 x 15 Bump Array JEDEC Std. MO-216, Variation CAB-1


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    GS8182Q18/36D-200/167/133 165-Bump 165-bump, 144Mb 200MHz 133MHz 8182Qxx PDF

    CYUSB301X

    Abstract: No abstract text available
    Text: CYUSB301X EZ-USB FX3 SuperSpeed USB Controller Features • Independent power domains for core and I/O ❐ Core operation at 1.2 V 2 ❐ I S, UART, and SPI operation at 1.8 to 3.3 V 2 ❐ I C operation at 1.2 V ■ 10- x 10-mm, 0.8-mm pitch Pb-free ball grid array BGA


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    CYUSB301X 10-mm CYUSB301X PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS8342D08/09/18/36E-400/300/250/200/167 36Mb SigmaQuad-II Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp 167 MHz–400 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package


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    GS8342D08/09/18/36E-400/300/250/200/167 165-Bump 165-bump, 144Mb 165-Pin PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS8662T08/09/18/36E-333/300/267*/250/200/167 72Mb SigmaCIO DDR-II Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp 167 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaCIO Interface • Common I/O bus


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    GS8662T08/09/18/36E-333/300/267 165-Bump 165-bump, GS866x36E-300T. GS8662Txx PDF

    GS818

    Abstract: No abstract text available
    Text: Preliminary GS8662S08/09/18/36E-333/300/250/200/167 167 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O 72Mb Burst of 2 DDR SigmaSIO-II SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • Simultaneous Read and Write SigmaSIO Interface • JEDEC-standard pinout and package


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    GS8662S08/09/18/36E-333/300/250/200/167 165-Bump 165-bump, 144Mb 165-Pin GS866x36E-300T. GS818 PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS8342Q08/09/18/36E-300/250/200/167 36Mb SigmaQuad-II Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp 167 MHz–300 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package


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    GS8342Q08/09/18/36E-300/250/200/167 165-Bump 165-bump, 144Mb GS8342Q08E-200I GS8342Q08\E-167I 165-Pin GS8342x36E-200T. PDF

    k2333

    Abstract: GS8342T GS8342T36
    Text: Preliminary GS8342T08/18/36E-400/300/250/200/167 36Mb SigmaCIO DDR-II Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp 167 MHz–400 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaCIO Interface • Common I/O bus


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    GS8342T08/18/36E-400/300/250/200/167 165-Bump 165-bump, 144Mb GS834x36E-300T. GS8342T k2333 GS8342T GS8342T36 PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS8662D08/09/18/36E-333/300/250/200/167 72Mb SigmaQuad-II Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp 167 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package


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    GS8662D08/09/18/36E-333/300/250/200/167 165-Bump 165-bump, 144Mb 165-Pin PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS8662R08/09/18/36E-333/300/250/200/167 72Mb SigmaCIO DDR-II Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp 167 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaCIO Interface • Common I/O bus


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    GS8662R08/09/18/36E-333/300/250/200/167 165-Bump 165-bump, 144Mb GS866x36E-300T. GS8662Rxx PDF

    ECHO schematic diagrams

    Abstract: No abstract text available
    Text: Preliminary GS8170LW18/36/72C-333/300/250 18Mb Σ1x1 Late Write SigmaRAM SRAM 209-Bump BGA Commercial Temp Industrial Temp 250 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Late Write mode • Pipeline read operation • JEDEC-standard SigmaRAM™ pinout and package


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    GS8170LW18/36/72C-333/300/250 209-Bump 209-bump, 8170LW18 ECHO schematic diagrams PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS8342Q08/09/18/36E-300/250/200/167 36Mb SigmaQuad-II Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp 167 MHz–300 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package


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    GS8342Q08/09/18/36E-300/250/200/167 165-Bump 165-bump, 144Mb GS8342Q08E-250I GS8342Q08E-200I GS8342Q08\E-167I 165-Pin PDF

    GS8180D18D-100

    Abstract: GS8180D18D-133 GS8180D18D-167 GS8180D18D-167I GS8180D18D-200 GS8180D18D-200I GS8180D18D-250 GS8180D18D-250I
    Text: GS8180D18D-250/200/167/133/100 250 MHz–100 MHz 1.8 V VDD 1.8 V or 1.5 V I/O 18Mb Burst of 4 SigmaQuad SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package


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    GS8180D18D-250/200/167/133/100 165-Bump 165-bump, 144Mb 165-in GS8180D18GD-167I 165-Pin GS8180D18GD-133I GS8180D18GD-100I GS8180D18D-100 GS8180D18D-133 GS8180D18D-167 GS8180D18D-167I GS8180D18D-200 GS8180D18D-200I GS8180D18D-250 GS8180D18D-250I PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS8342S08/18/36E-400/300/250/200/167 36Mb Burst of 2 DDR SigmaSIO-II SRAM 165-Bump BGA Commercial Temp Industrial Temp 167 MHz–400 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaSIO Interface • JEDEC-standard pinout and package


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    GS8342S08/18/36E-400/300/250/200/167 165-Bump 165-bump, 144Mb Sigma0/200/167 GS8342S08E-167I 165-Pin GS834x36E-300T. 8342Sxx PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS8342D08/18/36E-400/300/250/200/167 36Mb SigmaQuad-II Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp 167 MHz–400 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package


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    GS8342D08/18/36E-400/300/250/200/167 165-Bump 165-bump, 144Mb GS8342D36E-167I 165-Pin GS834x36E-300T. PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS8342R08/18/36E-400/300/250/200/167 36Mb SigmaCIO DDR-II Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp 167 MHz–400 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaCIO Interface • Common I/O bus


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    GS8342R08/18/36E-400/300/250/200/167 165-Bump 165-bump, 144Mb GS834x36E-300T. GS8342Rxx PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS8182S18/36D-330/300/250/200/167/133 18Mb Σ2x1B2 DDR SigmaSIO-II SRAM 165-Bump BGA Commercial Temp Industrial Temp 133 MHz–330 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package


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    GS8182S18/36D-330/300/250/200/167/133 165-Bump 165-bump, 144Mb 165-Pin PDF

    ECHO schematic diagrams

    Abstract: 8170D18 8170D36 GS8170D36B-300 GS8170D36B-333 Sigma ddr
    Text: Advanced Information GS8170D18/36B-333/300/275/250 209-Bump BGA Commercial Temp Industrial Temp ΣRAM 1M x 18, 512K x 36 16Mb DDR SRAM 333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Double Data Rate Read and Write mode • Observes the Sigma RAM pinout standard


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    GS8170D18/36B-333/300/275/250 209-Bump 209-bump, 8170D1836 ECHO schematic diagrams 8170D18 8170D36 GS8170D36B-300 GS8170D36B-333 Sigma ddr PDF

    MCL 1 029

    Abstract: ECHO schematic diagrams 2000-23 k4 8180S18 8180S36 GS8180S36B-333 Sigma ddr
    Text: Advanced Information GS8180S09/18/36B-333/300/275/250 209-Bump BGA Commercial Temp Industrial Temp ΣRAM 2M x 9, 1M x 18, 512K x 36 Separate I/O Sigma SDR SRAM 333 MHz 1.8 V VDD 1.8 V and 1.5 V I/ Features • Observes the Sigma RAM pinout standard • 1.8 V +150/–100 mV core power supply


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    GS8180S09/18/36B-333/300/275/250 209-Bump 209-bump, 8180S091836 MCL 1 029 ECHO schematic diagrams 2000-23 k4 8180S18 8180S36 GS8180S36B-333 Sigma ddr PDF

    ECHO schematic diagrams

    Abstract: flip chip bga 0,8 mm
    Text: Preliminary GS8170DW18/36/72C-333/300/250 18Mb Σ1x1 Double Late Write SigmaRAM SRAM 209-Bump BGA Commercial Temp Industrial Temp 250 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Double Late Write mode • JEDEC-standard SigmaRAM™ pinout and package


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    GS8170DW18/36/72C-333/300/250 209-Bump 209-bump, 8170DW18 ECHO schematic diagrams flip chip bga 0,8 mm PDF

    GS8182S36D-167

    Abstract: GS8182S36D-200 GS8182S36D-250 GS8182S36D-300 GS8182S36D-333I
    Text: Preliminary GS8182S18/36D-333/300/250/200/167 18Mb Burst of 2 DDR SigmaSIO-II SRAM 165-Bump BGA Commercial Temp Industrial Temp 167 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package


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    GS8182S18/36D-333/300/250/200/167 165-Bump 165-bump, 8182Sxx 333MHz GS8182S36D-167 GS8182S36D-200 GS8182S36D-250 GS8182S36D-300 GS8182S36D-333I PDF

    8170S18

    Abstract: 8170S36 8170S72
    Text: Advanced Information GS8170S18/36/72B-333/300/275/250 209-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36, 256K x 72 RAM Σ 16Mb Synchronous SRAM 333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • User-configurable Early, Late, and Double Late Write modes


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    GS8170S18/36/72B-333/300/275/250 209-Bump 8170S183672 8170S18 8170S36 8170S72 PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS8182S18/36D-333/300/250/200/167 18Mb Σ2x1B2 DDR SigmaSIO-II SRAM 165-Bump BGA Commercial Temp Industrial Temp 167 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package


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    GS8182S18/36D-333/300/250/200/167 165-Bump 165-bump, 144Mb GS818x36D-300T. 8182Sxx 333MHz PDF

    GS8182S36D-200

    Abstract: GS8182S36D-250 GS8182S36D-300
    Text: Preliminary GS8182S18/36D-333/300/250/200/167 18Mb Σ2x1B2 DDR SigmaSIO-II SRAM 165-Bump BGA Commercial Temp Industrial Temp 167 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package


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    GS8182S18/36D-333/300/250/200/167 165-Bump 165-bump, 8D-167I 165-Pin GS818x36D-300T. 8182Sxx 333MHz GS8182S36D-200 GS8182S36D-250 GS8182S36D-300 PDF