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    1.27 PAD LAYOUT Search Results

    1.27 PAD LAYOUT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    V36BEZ02307000T Amphenol Communications Solutions ExtremePort QSFP-DD 112G stacked SMT connector, Glue pad version Visit Amphenol Communications Solutions
    NDHN3B7 Amphenol Communications Solutions Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, 30u\\ Pd Ni with Gold flash plating Visit Amphenol Communications Solutions
    NDHN3B2 Amphenol Communications Solutions Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, 8u\\ Gold plating Visit Amphenol Communications Solutions
    NDHN6B2 Amphenol Communications Solutions Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Bulkhead, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, 8u\\ Gold plating Visit Amphenol Communications Solutions
    MSPEP6P22A0 Amphenol Communications Solutions SPE IP67 Plug, Push Pull Lock, Solder Pad, 28 to 18 AWG, Cable OD 0.138in to 0.252in, 3 Grommets Visit Amphenol Communications Solutions

    1.27 PAD LAYOUT Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    C10943X

    Abstract: No abstract text available
    Text: Mounting pad of tape BGA The drawings of tape BGA mounting pads are shown in Figure 1-15, followed by Table 1-9, which provides detailed information of these pads. Figure 1-15. Mounting Pad Dimensions of Tape BGA 352 pins 35 x 35 1.27 x 25 = 31.75 1.27 x 19 = 24.13


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    S256N7-B6 P352N2-F6 S352N7-F6 P420N2-F6 S420N7-F6 S500N7-H6 S576N7-H6 S696N7-H9 C10943X) C10943X PDF

    TCXO rakon E3179

    Abstract: RAKON E3179
    Text: E3179 SMD TCXO GR-1244 & GR-253 STRATUM 3 -Outline mm 7.0±0.15 Supply Voltage 1 2 3 8 7 6 0.81 4 5 9 0.6 Underside View 2.03 0.80 10 Solder Pad Layout 2.54 0.63 2.03 1.0 1.27 1.27 ▪▪ HCMOS ▪▪ Load: 15pF max ▪▪ VOL: <10% VS ▪▪ VOH: >90% VS


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    E3179 GR-1244 GR-253 2002/95/EC 980m/s2 10Hz-60Hz 60-2000Hz 30mins TCXO rakon E3179 RAKON E3179 PDF

    E3199

    Abstract: No abstract text available
    Text: E3199 SMD TCXO STRATUM 3 Outline mm 7.0±0.15 Supply Voltage 1 2 3 8 7 6 0.81 4 5 9 0.6 Underside View 2.03 0.80 10 Solder Pad Layout 2.54 0.63 2.03 1.0 1.27 1.27 ▪▪ HCMOS ▪▪ 15pF max ▪▪ VoL: ≤10% VS ▪▪ VoH: ≥90% VS ▪▪ Duty Cycle @ 50%: 45/55%


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    E3199 2002/95/EC GR-1244 GR-253 980m/s2 10Hz-60Hz MIL-STD-202, 60-2000Hz 30mins FS566088 PDF

    Untitled

    Abstract: No abstract text available
    Text: E2747 SMD TCXO STRATUM 3 Outline mm 7.0±0.15 Supply Voltage 1 2 3 8 7 6 0.81 4 5 9 0.6 Underside View 2.03 0.80 10 Solder Pad Layout 2.54 0.63 2.03 1.0 1.27 1.27 ▪▪ HCMOS ▪▪ 15pF max ▪▪ VoL: ≤10% VS ▪▪ VoH: ≥90% VS ▪▪ Duty Cycle @ 50%: 45% to 55%


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    E2747 2002/95/EC 980m/s2 10Hz-60Hz MIL-STD-202, C/10sec 60-2000Hz 30mins FS566088 PDF

    RAKON

    Abstract: No abstract text available
    Text: E2791 SMD TCXO GR-1244 & GR-253 STRATUM 3 Outline mm 7.0±0.15 Supply Voltage 1 2 3 8 7 6 5 0.6 Underside View 9 0.81 4 2.03 0.80 10 Solder Pad Layout 2.54 0.63 2.03 1.0 1.27 1.27 ▪▪ HCMOS ▪▪ 15pF max ▪▪ VoL: ≤10%VS ▪▪ VoH: ≥90%VS ▪▪ Duty Cycle @ 50%: 45/55%


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    E2791 GR-1244 GR-253 2002/95/EC 980m/s2 10Hz-60Hz MIL-STD-202, 60-2000Hz RAKON PDF

    Untitled

    Abstract: No abstract text available
    Text: *R oH S CO M PL IA NT Features • 1.27 mm pitch ■ RoHS compliant* - see processing ■ Precious metal contacts information on RoHS compliant modular contacts ■ For applications/processing guidelines, click here ■ Twin hot contacts symmetrical pad layout


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    70AB/Female PDF

    Untitled

    Abstract: No abstract text available
    Text: Package Physical Dimensions in inches mm Suggested PCB Pad Layout. .370 (9.40) MAX. .525 (13.34) EP7 SURFACE MOUNT Package .375 (9.53) MAX. .100 (2.54) TYP. .375 (9.53) MAX. .025 (0.64) .050 (1.27) TYP. .34 (8.6) .075 (1.905) TYP. .098 (2.50) .028 (0.70)


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    RS23X11 G16-L J14-L J16-L 16-Pin PDF

    Untitled

    Abstract: No abstract text available
    Text: *R oH S CO M PL IA NT Features • 1.27 mm pitch ■ RoHS compliant* - see processing ■ Precious metal contacts information on RoHS compliant modular contacts ■ For applications/processing guidelines, click here ■ Twin hot contacts symmetrical pad layout


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    70AB/Male 70ABJ PDF

    Untitled

    Abstract: No abstract text available
    Text: *R oH S CO M PL IA NT Features • 1.27 mm pitch ■ RoHS compliant* - see processing ■ Precious metal contacts information on RoHS compliant modular contacts ■ For applications/processing guidelines, click here ■ Twin hot contacts symmetrical pad layout


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    70AB/Female PDF

    Untitled

    Abstract: No abstract text available
    Text: *R oH S CO M PL IA NT Features • 1.27 mm pitch ■ RoHS compliant* - see processing ■ Precious metal contacts information on RoHS compliant modular contacts ■ For applications/processing guidelines, click here ■ Twin hot contacts symmetrical pad layout


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    70AB/Male 70ABJ PDF

    Untitled

    Abstract: No abstract text available
    Text: *R oH S CO M PL IA NT Features • 1.27 mm pitch ■ RoHS compliant* - see processing ■ Precious metal contacts information on RoHS compliant modular contacts ■ For applications/processing guidelines, click here ■ Twin hot contacts symmetrical pad layout


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    70AB/Female PDF

    c 220nj

    Abstract: 330nj 63 470nj 100nj 100 SMCC1008-620NJ SMCC1008-680NJ 680nj
    Text: 2.54 2.03 Max 2.79 Max 1.02 2.92 Max 1.52 1.27 0.51 Dimensions in mm Pad Layout FEATURES • Ceramic core, wire wound for superior performance • Very stable electrical properties • High SRF • Designed for pick and place APPLICATIONS • LC Resonant circuits


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    SMCC1008-10NK SMCC1008-12NK SMCC1008-15NK SMCC1008-18NK SMCC1008-22NJ SMCC1008-27NJ SMCC1008-33NJ SMCC1008-39NJ SMCC1008-47NJ SMCC1008-56NJ c 220nj 330nj 63 470nj 100nj 100 SMCC1008-620NJ SMCC1008-680NJ 680nj PDF

    Untitled

    Abstract: No abstract text available
    Text: PL IA NT Features CO M • 1.27 mm pitch ■ For applications/processing guidelines, click here *R oH S ■ Precious metal contacts ■ Twin hot contacts symmetrical pad layout ■ Pick & place compatible ■ High cycle life ■ RoHS compliant* - see processing


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    70AB/Male 70ABJ PDF

    Untitled

    Abstract: No abstract text available
    Text: PL IA NT Features • For applications/processing CO M ■ 1.27 mm pitch guidelines, click here *R oH S ■ Precious metal contacts ■ Twin hot contacts symmetrical pad layout ■ Pick & place compatible ■ High cycle life ■ RoHS compliant* - see processing


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    70AB/Female PDF

    70AB

    Abstract: No abstract text available
    Text: PL IA NT Features Applications *R oH S CO M 1.27 mm pitch 3 to 4 precious metal contacts Twin hot contacts symmetrical pad layout Pick & place compatible High cycle life RoHS compliant* - see processing information on lead free modular contacts Handheld communications - mobile


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    70AB/Male 70AB PDF

    Untitled

    Abstract: No abstract text available
    Text: PL IA N T Features • RoHS compliant* - see processing CO M ■ 1.27 mm pitch *R oH S ■ Precious metal contacts ■ Twin hot contacts symmetrical pad layout information on RoHS compliant modular contacts ■ Pick & place compatible ■ High cycle life


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    70AB/Female PDF

    Untitled

    Abstract: No abstract text available
    Text: PL IA N T Features • RoHS compliant* - see processing CO M ■ 1.27 mm pitch information on RoHS compliant modular contacts *R oH S ■ Precious metal contacts ■ Twin hot contacts symmetrical pad layout ■ Pick & place compatible ■ High cycle life


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    70AB/Male 70ABJ Resistance50 PDF

    SF-BGA119A-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA119A C 7.62mm [0.300"] See BGA pattern code to the right for actual pattern layout Y 20.32mm [0.800"] X Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] Ø 0.64mm pad [Ø 0.025"] 1.27mm [0.050"]


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    BGA119A FR4/G10 SF-BGA119A-B-11 PDF

    Stanyl

    Abstract: No abstract text available
    Text: MOUNTING PAD LAYOUT 1.723 [43.76] MIN.-282 [7.16] REF. 078 [1.98] DIA. HOLE. .265 [6.73] a -I .289 [7.34] MIN ± . 0 0 5 [ ± 0 .15 ] 2 PLS 250 [6.35] MIN. (2) PLS 1.360 [34.52] MAX. rex + 1.723 [43.76] 1.030 [26.16] U .050 [1.27] DIA. x .050[1.27] L. LEG


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    PDF

    LS 7112

    Abstract: No abstract text available
    Text: PCB-Mounted Receptacle Assemblies _ 2.54 mm 0.100 in. D escription Double Row (Dual-Entry) 68046 RECOMMENDED PCB PAD LAYOUT DIM A Double Row With Holddowns (Top Entry Only) RECOMMENDED PCB PAD LAYOUT 1.27 mm (0.050 in.) MIN Double Row With Holddowns (Dual-Entry)


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    68622-6YY 69154-6YY BUS-12-055 LS 7112 PDF

    a 69154

    Abstract: 69154 BERG 6 pin dual row BUS-12-055 LR46923 dc/s41 621
    Text: PCB-Mounted Receptacle Assemblies 2.54 mm 0.100 in. D escription Double Row (Dual-Entry) 68046 RECOMMENDED PCB PAD LAYOUT Double Row With Holddowns (Top Entry Only) 68622 RECOMMENDED PCB PAD LAYOUT 1.27 mm (0.050 in.) MIN Double Row With Holddowns (Dual-Entry)


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    BUS-12-055 G002bSb a 69154 69154 BERG 6 pin dual row BUS-12-055 LR46923 dc/s41 621 PDF

    Untitled

    Abstract: No abstract text available
    Text: 7 8 1. MECHANICAL DIMENSIONS B B 8.89 [0.350] GO CT> 00 o □□□□□□O' 0.76 [0.030] 1.27 [0.050] SUGGESTED PAD LAYOUT D D o. j=snn r a n p 0.51 [0.020] 0.89 [0,035] ©mpQononit 1.27 [0.050] re x MULTIPLE MULTIPLE ASM 4F, Ha Guang S t, No. 347,Yarn


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    XDGS1601CC2 XTFZ-DGS160LCC2 Base-T/1000 XTFZ-DGS160 J-STD-020C 350uH XTFZ-DGS1601CC2 PDF

    Untitled

    Abstract: No abstract text available
    Text: 8 1. MECHANICAL DIMENSIONS : .89 [0.350 IE,70 [0.500] •nnnnnnnn B f nj B KXmultiple XDGS1601CC1 YYWW ooooooo: yyyyyy 8.89 [0.350] 0,76 [0,030] 1.91 [0.075] 1.27 [0,050] SUGGESTED PAD LAYOUT Jn rü-0-l L o m a u OJ 0.51 [0,020] 0,89 [0,035] 1.27 [0.050] o m p Q I a o iift


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    XDGS1601CC1 XTFZ-DGS1601CC1- -T/1000 XTFZ-DGS1601CC1-JU J-STD-020C 100KHz, 350uH PDF

    208H

    Abstract: No abstract text available
    Text: 1. M echanical Dimensions: 2. S chem afic: 2.54 5X0.71 — 1.27 r - 2 .5 4 1.27 a r-0 d x -i I i I □ un o r □ □ m ca -H □ A 5UGGE5TED PAD LAYOUT 3.81 ± 0.38 3. Electrical S pecifications: Im pedance Ratio: 1.5:1 ± 2 % Turns Ratio: 1.22:1 ± 2 % Bandwidth: 1-1000M H z 1.0dB Typ


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    1-1000MHz MIL-STD-202D, UL94-V-0 E151556 -l-125 102mm) XFWBC2043 208H PDF