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    bare die

    Abstract: No abstract text available
    Text: TN-00-14: Quality/Reliability Requirements for Bare Die Introduction Technical Note Understanding the Quality and Reliability Requirements for Bare Die Applications Introduction With the advent of multichip modules MCMs and system in a package (SiP) applications, customer demand for known good die (KGD) has increased. In many cases,


    Original     		PDF TN-00-14: 09005aef83ca256c/Source: 09005aef83ca2578 tn0014 bare die