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    Micron NAND

    Abstract: TN-00-19 TN0019
    Text: TN-00-19: Thinning Considerations Introduction Technical Note Thinning Considerations for Wafer Products Introduction With increased use of wafer- and die-level products comes added logistic and process considerations. For customers who thin Micron’s wafers, this document contains information helpful for determining the optimal wafer-thinning processes to meet their


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    PDF TN-00-19: 09005aef816bf187/ZIP: 09005aef816bf19a TN0019 Micron NAND TN-00-19