08052F47SZ6BBOD Search Results

J-STD-005

Abstract: 1092-03A-5 62NCLR-A 292-06A-5 1092-04A-5 hakko AVX0402YG104ZAT2A SMA end launch for pcb 142-0761-841-A SN62 PB36 ag2 heat conductivity
Text: AMMP-XXXX Production Assembly Process Application Note 5386 Description Package Features This document describes and illustrates the attachment and detachment of Avago’s 5x5mm packaged products in a PCB soft board environment. The AMMP package has a solid copper filled cavity to allow optimum thermal transfer of the packaged device to the PCB and associated heat