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Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: Reportable Substances in Components Package Type : QFN 32 Lead #: No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Leadframe Plating Silver Die Attach Epoxy Gold Wire External Lead Plating Silicon Die Rev ECN A 073113HC13 Content in % 52.591%	Original	PDF	QFN55-32LD-GRN-RS-3C 073113HC13

Catalog Datasheet

MFG & Type

PDF

Document Tags

Untitled

Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : QFN 32 Lead #: No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Leadframe Plating Silver Die Attach Epoxy Gold Wire External Lead Plating Silicon Die Rev ECN A 073113HC13 Content in % 52.591%

Original

PDF

QFN55-32LD-GRN-RS-3C 073113HC13