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    QFP PACKAGE thermal resistance

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 160 PIN PLASTIC To Top / Package Lineup / Package Index FPT-160P-M11 160-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold


    Original     		PDF FPT-160P-M11 160-pin FPT-160P-M11) 73MIN 03MAX 029MIN~ 041MAX) F160030S-1C-1 QFP PACKAGE thermal resistance

    QFP PACKAGE thermal resistance

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 160 PIN PLASTIC FPT-160P-M11 160-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold Thermal resistance Low thermal resistance type


    Original     		PDF FPT-160P-M11 160-pin FPT-160P-M11) 73MIN 03MAX 029MIN~ 041MAX) F160030S-1C-1 QFP PACKAGE thermal resistance