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    0402 LAND PATTERN Search Results

    0402 LAND PATTERN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    0402AF-201XJLU Coilcraft Inc General Purpose Inductor, 0.2uH, 5%, 1 Element, Ferrite-Core, SMD, 0403, CHIP, ROHS COMPLIANT Visit Coilcraft Inc
    0402AF-301XJLU Coilcraft Inc General Purpose Inductor, 0.3uH, 5%, 1 Element, Ferrite-Core, SMD, 0403, CHIP, ROHS COMPLIANT Visit Coilcraft Inc
    0402AF-390XJLU Coilcraft Inc General Purpose Inductor, 0.039uH, 5%, 1 Element, Ferrite-Core, SMD, 0403, CHIP, ROHS COMPLIANT Visit Coilcraft Inc
    0402AF-560XJLU Coilcraft Inc General Purpose Inductor, 0.056uH, 5%, 1 Element, Ferrite-Core, SMD, 0403, CHIP, ROHS COMPLIANT Visit Coilcraft Inc
    0402CS-10NXGLU Coilcraft Inc General Purpose Inductor, 0.01uH, 2%, 1 Element, Ceramic-Core, SMD, 0402, CHIP, 0402, ROHS COMPLIANT Visit Coilcraft Inc

    0402 LAND PATTERN Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    land pattern 0805

    Abstract: 0402 0603 0805 land
    Text: 4/2/02 http:www.niccomp.com Technical Inquiries: tpmg@niccomp.com SOLDERING LAND PATTERNS PRODUCTS: NRC SERIES, THICK FILM CHIP RESISTORS SOLDERING LAND PATTERN DIMENSIONS mm SIZE 0201 0402 0603 0805 1206 1210 2010 2512 A 0.3~0.4 0.5~0.6 0.8~1.0 1.2~1.4


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    Abstract: No abstract text available
    Text: Land Patterns and Soldering Temperature Profiles Recommended PC Board Land Patterns Chip Size L mm inch G mm (inch) H mm (inch) 0402(1005) 1.3 (0.051) 0.4 (0.016) 0.5 (0.020) 0603(1608) 2.6 (0.102) 0.6 (0.023) 0.8 (0.031) 0805(2012) 3.0 (0.118) 1.0 (0.039)


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    CA92121, PDF

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    Abstract: No abstract text available
    Text: *1130 PRINTER 003-62 v2 3/13/03 2:32 PM Page 43 Land Patterns and Soldering Temperature Profiles Recommended PC Board Land Patterns A B C 0402 1005 0.051 (1.3) 0.020 (0.5) 0.016 (0.4) 0603 (1608) 0.102 (2.6) 0.031 (0.8) 0.023 (0.6) 0805 (2012) 0.118 (3.0)


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    Abstract: No abstract text available
    Text: *1566 PRINTER 03-62 12/4/06 9:06 AM Page 43 Land Patterns and Soldering Temperature Profiles Recommended PC Board Land Patterns A B C 0402 1005 0.051 (1.3) 0.020 (0.5) 0.016 (0.4) 0603 (1608) 0.102 (2.6) 0.031 (0.8) 0.023 (0.6) 0805 (2012) 0.118 (3.0) 0.039 (1.0)


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    land pattern 0805

    Abstract: 0402 land pattern land pattern 1812 0402 0603 0805 1206 0402 0603 0805 land
    Text: APPLICATION NOTE RECOMMENDED LAND PATTERN NMC CHIP CERAMIC CAPACITOR Land Pattern NMC C < >< D > A < > B Solder Resist 1. Flow Soldering SIZE 0402 0603 0805 1206 1210 1812 2225 A NA 0.8 ~ 1.0 0.8 ~ 1.4 1.8 ~ 2.4 1.8 ~ 2.4 2.5 ~ 3.2 N/A B NA 2.6 ~ 3.2 3.0 ~ 4.0


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    Abstract: No abstract text available
    Text: Super Frequency Ceramic RF Chip Inductors - 0402CH Series Monolithic inorganic material construction Very High Q Values High Self Resonant Frequency Industry Standard 0402 1005 Surface Mount Land Pattern Electrical Specifications @ 25° Part Number Inductance


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    0402CH PE-0402CH1N0STT PE-0402CH1N2STT PE-0402CH1N5STT PE-0402CH1N8STT WC702 PDF

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    Abstract: No abstract text available
    Text: Super Frequency Ceramic RF Chip Inductors - 0402CH Series Monolithic inorganic material construction Very High Q Values High Self Resonant Frequency Industry Standard 0402 1005 Surface Mount Land Pattern Electrical Specifications @ 25° Part Number Inductance Standard


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    0402CH PE-0402CH1N0STT PE-0402CH1N2STT PE-0402CH1N5STT WC702 PDF

    122N10N

    Abstract: No abstract text available
    Text: CERAMIC RF CHIP INDUCTORS – 0402CC SERIES Monolithic inorganic material construction Low DC resistance and high Q Values at high frequency High Self Resonant Frequency Industry Standard 0402 1005 Surface Mount Land Pattern Electrical Specifications @ 25°C


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    0402CC PE-0402CC1N0STT PE-0402CC1N2STT PE-0402CC1N5STT PE-0402CC1N8STT PE-0402CC2N0STT WC704 122N10N PDF

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    Abstract: No abstract text available
    Text: WIRE-WOUND RF CHIP INDUCTORS - 0402CD SERIES Wirewound ceramic core construction High Q values High self resonant frequency Industry standard 0402 1005 surface mount land pattern See page 3 for Competition Cross Reference Electrical Specifications @ 25°C


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    0402CD PE-0402CD1N0KTT PE-0402CD1N2KTT PE-0402CD1N8KTT PE-0402CD1N9KTT PE-0402CD2N0KTT PE-0402CD2N2KTT PE-0402CD2N4KTT PE-0402CD2N7KTT PE-0402CD3N3KTT PDF

    122N10N

    Abstract: No abstract text available
    Text: CERAMIC RF CHIP INDUCTORS – 0402CC SERIES Monolithic inorganic material construction Low DC resistance and high Q Values at high frequency High Self Resonant Frequency Industry Standard 0402 1005 Surface Mount Land Pattern Electrical Specifications @ 25°C


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    0402CC PE-0402CC1N0STT PE-0402CC1N2STT PE-0402CC1N5STT PE-0402CC1N8STT PE-0402CC2N0STT WC704 122N10N PDF

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    Abstract: No abstract text available
    Text: Ver 201207 Multilayer High Frequency inductor CIH05T Series 1005/ EIA 0402 APPLICATION Mobile communication systems, noise suppression at high frequency and Impedance matching. FEATURES RECOMMENDED LAND PATTERN  Lowest value of specific resistivity, good property of Q


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    CIH05T 100MHz 100nH) PDF

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    Abstract: No abstract text available
    Text: WIRE-WOUND RF CHIP INDUCTORS - 0402CD SERIES Wirewound ceramic core construction High Q values High self resonant frequency Industry standard 0402 1005 surface mount land pattern Refer to page 3 for Competition Cross Reference Electrical Specifications @ 25°C


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    0402CD PE-0402CD1N0KTG PE-0402CD1N2KTG PE-0402CD1N8KTG PE-0402CD2N0KTG PE-0402CD2N2KTG PE-0402CD3N3KTG PE-0402CD3N6KTG PE-0402CD3N9KTG PE-0402CD4N7KTG PDF

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    Abstract: No abstract text available
    Text: Ver 201208 Chip Bead For EMI Suppression CIB/CIM05 Series 1005/ EIA 0402 APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN 0.45~0.55mm Perfect shape for automatic mounting, with no directionality.


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    CIB/CIM05 PDF

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    Abstract: No abstract text available
    Text: Ver 201207 Chip Bead For High Current CIC05 Series 1005/ EIA 0402 APPLICATION Noise Suppression in power line FEATURES RECOMMENDED LAND PATTERN 0.45~0.55mm CIC series is used for high current. (~ 3A) 0.45~0.55mm 0.40~0.50mm 0.40~0.50mm DIMENSION Type 05


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    CIC05 100MHz CIC05P300 CIC05P600 CIC05P121 CIC05P102 CIC05J600 PDF

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    Abstract: No abstract text available
    Text: Ver 201305 Chip Bead For EMI Suppression CIB/CIM05 Series 1005/ EIA 0402 APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN 0.45~0.55mm Perfect shape for automatic mounting, with no directionality.


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    CIB/CIM05 PDF

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    Abstract: No abstract text available
    Text: Ver 201208 Chip Bead For GHz noise suppression CIV05 Series 1005/ EIA 0402 APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN CIV Series have high impedance in a GHz band


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    CIV05 PDF

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    Abstract: No abstract text available
    Text: SPECTRUM CONTROL INC. Land Patterns and Soldering Temperature Profiles Chip Size EIA EIAJ A B C 0402 (1005) 0.051 (1.3) 0.020 (0.5) 0.016 (0.4) 0603 (1608) 0.102 (2.6) 0.031 (0.8) 0.023 (0.6) 0805 (2012) 0.118 (3.0) 0.039 (1.0) 0.039 (1.0) 1206 (3216) 0.173 (4.4)


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    Abstract: No abstract text available
    Text: Ferrite EMI Chip Bead Dimensions LAND PATTERN FOR REFLOW SOLDERING CHIP SIZE Monolithic Chip Bead B A C D See Page 41 for Equivalent Circuit Diagrams Metric EIA Pkg. Size A mm (inches) B mm (inches) C* mm (inches) D mm (inches) 1005 (0402) 1.01 (0.040)


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    Abstract: No abstract text available
    Text: Chip Inductors • NK Type 1005 0402 ● Recommended Land Pattern in mm (not to scale) (0.1) 0.5 1.0 0.5 to 0.6 ● Dimensions in mm (not to scale) 0.5 0.5 to 0.6 0.64 max. 1.5 to 1.7 0.2 0.2 ■ Standard Packing Quantity ● 10000 pcs./Reel ■ Standard Parts


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    ELJNK10NJ/AF ELJNK12NJ/AF ELJNK15NJ/AF ELJNK18NJ/AF ELJNK22NJ/AF ELJNK27NJ/AF ELJNK33NJ/AF ELJNK39NJ/AF ELJNK47NJ/AF ELJNK56NJ/AF PDF

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    Abstract: No abstract text available
    Text: Chip Inductors 2. Type Non Wound High-Q QF, QE • QF Type 1005 (0402) ● Recommended Land Pattern in mm (not to scale) 0.5 0.5 to 0.6 ● Dimensions in mm (not to scale) 0.2 0.2 1.0 0.5 0.5 to 0.6 1.5 to 1.7 ■ Standard Packing Quantity ● 10000 pcs./Reel


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    ELJQF10NJ/GF ELJQF12NJ/GF ELJQF15NJ/GF ELJQF18NJ/GF ELJQF22NJ/GF ELJQF27NJ/GF ELJQF33NJ/GF ELJQF39NJ/GF PDF

    1100 A 4600

    Abstract: types of transistors ELJPF10NJF ELJPF5N6DF
    Text: Chip Inductors 4. High Power Types PF, PE, PC, PA, PB • Type 1005 0402 PF ● Recommended Land Pattern in mm (not to scale) 0.5 0.5 to 0.6 ● Dimensions in mm (not to scale) 0.2 0.2 1.0 0.5 0.5 to 0.6 1.5 to 1.7 ■ Examples Inductance Part No. ELJPF2N2DF


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    ELJPF10NJF 1100 A 4600 types of transistors ELJPF10NJF ELJPF5N6DF PDF

    kf 680

    Abstract: kf 1300 KF 520 KF-470 220 NK 63 elj-NA5R6JF
    Text: Chip Inductors n Type 1005 0402 NK l Recommended Land Pattern in mm (not to scale) 0.5 (0.1) 0.5 to 0.6 l Dimensions in mm (not to scale) 1.0 0.5 0.5 to 0.6 0.64 max. 1.5 to 1.7 0.2 0.2 n Standard Packing Quantity l 10000 pcs./Reel n Examples Inductnce Part No.


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    Abstract: No abstract text available
    Text: Chip Inductors 5. High Power Types PF, PE, PC, PA, PB • PF Type 1005 0402 ● Recommended Land Pattern in mm (not to scale) 0.5 0.5 to 0.6 ● Dimensions in mm (not to scale) 0.2 1.0 0.2 0.5 0.5 to 0.6 1.5 to 1.7 ■ Standard Packing Quantity ● 10000 pcs./Reel


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    ELJPF10NJF ResistanPB121KF ELJPB151KF ELJPB181KF ELJPB221KF PDF

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    Abstract: No abstract text available
    Text: Chip Inductors • Type 1005 0402 RF ● Recommended Land Pattern in mm (not to scale) 0.5 0.5 to 0.6 ● Dimensions in mm (not to scale) 0.2 0.2 1.0 0.5 0.5 to 0.6 1.5 to 1.7 ■ Examples Inductnce Part No. (nH) Tolerance Q min. Q L,Q Test Freq. Typical (MHz) (800 MHz)


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    ELJRF10NJF2 ELJRF12NJF2 ELJRF15NJF2 ELJRF18NJF2 ELJRF22NJF2 ELJRF27NJF2 ELJRF33NJF2 ELJRF39NJF2 ELJRF47NJF2 ELJRF56NJF2 PDF