021414HC07 Search Results

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Text: Reportable Substances in Components Package Type : Lead #: No 1 2 3 5 6 7 Component Weight : SOICN-Epad 0.150" Document No : 8 Process Type : Material Molding Compound Copper Frame Full PPF (NiPdAu) Platin Die Attach Epoxy Gold Wire Silicon Die Rev ECN A