SF-BGA256J-B-01
Abstract: FR4 substrate 1.6mm SN63 FR4 1.6mm substrate 1.6mm pitch BGA
Text: 14mm [0.551"] 1mm [0.039"] Top View 1mm [0.039"] 14mm [0.551"] 0.8mm [0.031"] pitch typ. 12mm [0.472"] sqr. 0.36mm [0.014"] 0.8mm [0.031"] pitch typ. Side View 6.78mm [0.267"] 2 1.6mm [0.063"] 1 0.8mm [0.031"] pitch typ. 0.33mm [0.013"] 3 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
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FR4/G10
16x16
SF-BGA256J-B-01
FR4 substrate 1.6mm
SN63
FR4 1.6mm substrate
1.6mm pitch BGA
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1mm pitch BGA socket
Abstract: thermal shock standard papst 3412 25M1 Muffin Thermal Resistance Calculation TO
Text: Tel: 800 404-0204 www.ironwoodelectronics.com GHz Socket Specifications Mechanical Specifications Individual contact force: BGA Package Typical 1.27mm pitch BGAi Typical 1.0mm pitch BGAii Typical 0.8mm pitch BGAiii Depth of penetration (mm) 0.1 0.1 0.1 Force per ball (grams)
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MIL-STD202,
1mm pitch BGA socket
thermal shock standard
papst 3412
25M1
Muffin
Thermal Resistance Calculation TO
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256 ball bga
Abstract: IPC-4552
Text: 256-301750-18 16x16 Array 256 Ball BGA Adapter Converts from 0.8mm Pitch to 1.00mm Pitch FEATURES: • Correct-A-Chip technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by
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16x16
IPC-4552
ASTM-B-733.
256 ball bga
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ASTM-B-733
Abstract: 16x16 bga 256 ball bga
Text: 256-301750-18 16x16 Array 256 Ball BGA Adapter Converts from 0.8mm Pitch to 1.00mm Pitch FEATURES: • Correct-A-Ship technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by
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16x16
IPC-4552
ASTM-B-733.
ASTM-B-733
16x16 bga
256 ball bga
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Untitled
Abstract: No abstract text available
Text: 35.56mm [1.400"] Orientations: Top Views PLCC QFP 35.56mm [1.400"] 2.54mm [0.100"] pitch typ. Top View 4 17.16mm [0.676"] 1 19.08mm [0.751"] assembled 3 6.35mm [0.250"] 0.8mm [0.031"] pitch typ. 2 0.46mm [0.018"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
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FR4/G10
QFE44SE
PC-PLCC/QFP44-L-T-02
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smt a1 transistor
Abstract: foot
Text: 0.8mm Pitch SMT foot and female-to-female socket Attachment and Use Daughter board Orientation mark, Align with Target pin A1 Surface mount Foot UGA socket A Top View: Surface mount foot Surface mount Foot Cross section: A-A Target PCB Step 1 Attach SMT BGA emulator foot to target PCB
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Untitled
Abstract: No abstract text available
Text: MX23L1612 16M-BIT MASK ROM PIN DESCRIPTION FEATURES • Bit organization - 2M x 8 byte mode - 1M x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:25mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 ball mini BGA (6mm x 8mm, ball pitch 0.8mm, ball
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MX23L1612
16M-BIT
D15/A-1
JUL/10/2001
JUL/16/2001
OCT/03/2001
MAR/12/2002
MAY/20/2002
JUN/23/2003
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MX23L8102
Abstract: MX23L8102XI-12 MX23L8102XI-70 MX23L8102XI-90
Text: MX23L8102 8M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 1M x 8 byte mode - 512K x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:15mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 ball mini BGA (6mm x 8mm, ball pitch 0.8mm, ball
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MX23L8102
D15/A-1
JUN/23/2003
MX23L8102
MX23L8102XI-12
MX23L8102XI-70
MX23L8102XI-90
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C4 to BGA
Abstract: MX23L1612 MX23L1612XI-70 MX23L1612XI-70G MX23L1612XI-90 MX23L1612XI-90G PM0815
Text: MX23L1612 16M-BIT MASK ROM PIN DESCRIPTION FEATURES • Bit organization - 2M x 8 byte mode - 1M x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:25mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 ball mini BGA (6mm x 8mm, ball pitch 0.8mm, ball
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MX23L1612
16M-BIT
D15/A-1
JUN/23/2003
C4 to BGA
MX23L1612
MX23L1612XI-70
MX23L1612XI-70G
MX23L1612XI-90
MX23L1612XI-90G
PM0815
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MX23L8102
Abstract: MX23L8102XI-12 MX23L8102XI-70 MX23L8102XI-90
Text: MX23L8102 8M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 1M x 8 byte mode - 512K x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:15mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 ball mini BGA (6mm x 8mm, ball pitch 0.8mm, ball
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MX23L8102
D15/A-1
M0817
JUL/11/2001
AUG/20/2001
SEP/28/2001
MAR/12/2002
JUN/23/2003
MX23L8102
MX23L8102XI-12
MX23L8102XI-70
MX23L8102XI-90
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0.3mm pitch BGA
Abstract: SF-BGA180C-B-11
Text: 1mm [0.039"] Top View 1mm [0.039"] 14mm [0.551"] sqr. 12mm [0.472"] sqr. Side View 0.3mm [0.012"] dia. typ. 8.75mm [0.344"] 6.79mm [0.268"] 2 3.75mm [0.148"] 1 3 0.8mm pitch typ. 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2
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FR4/G10
16x16
SF-BGA180C-B-11
0.3mm pitch BGA
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smt a1 transistor
Abstract: kapton
Text: 0.8mm Pitch SMT foot and UGA socket Attachment and Use Daughter board Orientation mark, Align with Target pin A1 Kapton Tape UGA socket Note: Do not remove the kapton tape from the bottom of the socket until it is attached to the daughter board. Surface mount Foot
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LPC2468 reflow solder profile
Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,
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AN10778
LPC2220,
LPC2292,
LPC2364,
LPC2368,
LPC2458,
LPC2468,
LPC2470,
LPC2478,
LPC2880,
LPC2468 reflow solder profile
0.65mm pitch BGA
1mm pitch BGA
AN10778
MO-275
TFBGA208
LFBGA32
LPC2468 pcb
SOT1018-1
nxp cross
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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0.8mm pitch BGA
Abstract: LS-BGA90B-61
Text: Tooling hole X2 Y Top View (reference only) 3.76mm [0.148"] 6.40mm [0.252"] See BGA pattern code to the right for actual pattern layout 0.80mm typ. 11.20mm [0.441"] X Ø 0.51mm [Ø 0.020"] BGA pad 2.17mm [0.086"] 1 Top View of Land Pattern Scale: 2:1 0.80mm
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FR4/G10
LS-BGA90B-61
LG-BGA90B-61
0.8mm pitch BGA
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BGA60C
Abstract: 0.8mm pitch BGA LS-BGA60C-11 BGA-60
Text: Tooling hole X2 BGA60C 6.40mm [0.252"] See BGA pattern code to the right for actual pattern layout Y 7.20mm [0.283"] Top View (reference only) 3.76mm [0.148"] 0.80mm typ. X Ø 0.51mm [Ø 0.020"] BGA pad 2.17mm [0.086"] 1 0.20mm [0.008"] dia. Top View of Land Pattern
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BGA60C
FR4/G10
LS-BGA60C-11
BGA60C
0.8mm pitch BGA
BGA-60
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0.8mm pitch BGA
Abstract: LS-BGA81C-11 BGA81C
Text: Tooling hole X2 BGA81C 6.40mm [0.252"] See BGA pattern code to the right for actual pattern layout Y 0.80mm typ. [0.031"] 6.40mm [0.252"] Top View (reference only) X Ø 0.51mm [Ø 0.020"] BGA pad 2.17mm [0.086"] 1 3.76mm [0.148"] Top View of Land Pattern
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BGA81C
FR4/G10
LS-BGA81C-11
0.8mm pitch BGA
BGA81C
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0.8mm pitch BGA
Abstract: LS-BGA100C-11
Text: Tooling hole X2 BGA100C 7.20mm [0.283"] See BGA pattern code to the right for actual pattern layout Y 7.20mm [0.283"] Top View (reference only) 3.76mm [0.148"] 0.80mm typ. X Ø 0.51mm [Ø 0.020"] BGA pad 2.17mm [0.086"] 1 Top View of Land Pattern Scale: 2:1
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BGA100C
FR4/G10
10x10
LS-BGA100C-11
0.8mm pitch BGA
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0.8mm pitch BGA
Abstract: BOX21151 LS-BGA54B-61
Text: Tooling hole X2 BGA54B 6.40mm [0.252"] See BGA pattern code to the right for actual pattern layout Y 6.40mm [0.252"] Top View (reference only) 3.76mm [0.148"] 0.80mm typ. X Ø 0.51mm [Ø 0.020"] BGA pad 2.17mm [0.086"] 1 0.20mm [0.008"] dia. Top View of Land Pattern
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BGA54B
FR4/G10
LS-BGA54B-61
BOX21151
0.8mm pitch BGA
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BGA 256 PACKAGE power dissipation
Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432
Text: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction Rapid evolution of complex electronic systems and the demand for improved functionality at lower cost have resulted in the need for silicon products with smaller footprints. Advanced
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00-mm
27-mm
XC9500
BGA 256 PACKAGE power dissipation
BGA 64 PACKAGE thermal resistance
xilinx CS144 thermal resistance
FG676
BG560
BGA and CSP
BGA-1156
fine BGA thermal profile
cte table flip chip substrate
BG432
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BGA Solder Ball 0.35mm collapse
Abstract: BGA Solder Ball collapse BGA Package 0.35mm pitch BGA 0.56mm AN-5026 FSTD16211 FSTD32211 BGA Solder Ball 0.35mm 0.35mm BGA fanout AN500543
Text: Fairchild Semiconductor Application Note January 2001 Revised February 2001 Using BGA Packages Introduction Demanding space and weight requirements of personal computing and portable electronic equipment has led to many innovations in IC packaging. Combining the right
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AN-5026
BGA Solder Ball 0.35mm collapse
BGA Solder Ball collapse
BGA Package 0.35mm pitch
BGA 0.56mm
FSTD16211
FSTD32211
BGA Solder Ball 0.35mm
0.35mm BGA fanout
AN500543
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BGA Solder Ball collapse
Abstract: BGA Solder Ball 0.35mm collapse 1mm pitch BGA socket 0.35mm BGA fanout BGA Package 0.35mm pitch land pattern for tvSOP 1mm pitch BGA micro pitch BGA AN-5026 BGA 0.56mm
Text: Fairchild Semiconductor Application Note January 2001 Revised September 2001 Using BGA Packages Introduction TABLE 1. BGA Space Savings Compared to Surface Mount Packages Demanding space and weight requirements of personal computing and portable electronic equipment has led to
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TSSOP YAMAICHI SOCKET
Abstract: TSSOP-56 footprint texas JEDEC Jc-11 mo-205 free IDT marking IDT package marking LVCH JEDEC Jc-11 free OREGA IC280-096-144 marking B44 RC3041
Text: 32 Bit Logic Families in LFBGA packages: 96 and 114 Balls Low Profile Fine Pitch BGA Packages. Application Note. October 26th, 1998 by: Sylvie Kadivar, Philips Semiconductors Maria Balian, Texas Instruments Ed Agis, Texas Instruments Valentino Liva, Integrated Device Technology
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SF-BGA208D-P-01
Abstract: No abstract text available
Text: 2 Side View 1.71mm [0.068"] 3 1 11.11mm [0.438"] 14.29mm [0.563"] 4 4 15.01mm [0.591"] 17.08mm [0.673"] Substrate: FR4/G10 or equivalent high temp material. Non-clad. 0.8mm [0.031"] Bottom View 15.01mm [0.591"] 0.8mm [0.031"] 17.06mm [0.671"] 1 2 Description: BGA Emulator Foot
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FR4/G10
SF-BGA208D-P-01
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