Untitled
Abstract: No abstract text available
Text: SURFACE MOUNT TEST CLIPS DESCRIPTION AND COLOR CHOICE SETS FEATURES Access 0.3mm or 1.27mm Pitch Leads Allows you to attached the clip to a lead on the smallest of surface mount IC’s. Normal oscilloscope lead tips are too large and the probe handle is too heavy to access these
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25VDC
300mADC
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Untitled
Abstract: No abstract text available
Text: The Value Leader Micro & Nano Surface Mount Test Clips Color Coded, Compact, Economical •Can access 0.3mm & 1.27mm Pitch Leads: Allows you to attached the clip to a lead on the smallest of surface mount IC’s for testing the input and/or output of the IC. Normal
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Oscilloscope
Abstract: QFP 0.3mm pitch
Text: MicroGripperTM Oscilloscope Kit Oscilloscope Probe Adapter 0.8mm to 0.3mm Fine-Pitched Probing With Any Standard Oscilloscope w w w w w Connect to devices with lead pitches from 0.8mm to 0.3mm Use on a variety of QFP and SOIC packages Reduces chance of shorting with smallest wire tip diameter 0.08mm
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DOD-5011)
Oscilloscope
QFP 0.3mm pitch
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Oscilloscope 5520
Abstract: smd 1437
Text: Grabbers and Test Clips MINIGRABBER TEST CLIP WITH BANANA JACK Banana Jack built into plunger. Overall Length: 2.54". RATING: 300V, 5 Amps, +102˚C 216˚F Max. *STD COLORS: Available in 10 colors. ACCESS 90603 Model 4723-* PRICE 4.10 ® DO-IT-YOURSELF MINIGRABBER TEST CLIPS
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6041B
IEC1010-2-031,
Oscilloscope 5520
smd 1437
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Untitled
Abstract: No abstract text available
Text: Oscilloscope Probes and Accessories Professional Oscilloscope Probes feature modular design for maximum flexibility Oscilloscope Probes and Accessories ACCESS FAX ON DEMAND This symbol indicates immediate Fax-On-Demand Technical Information is available. Dial U.S. (800) 444-6785, (Outside U.S.) (909) 469-2991. Enter
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QFP lead pitch 0.3mm
Abstract: BGA and QFP Package mounting QFP 0.3mm pitch particle 0.3mm pitch BGA bga socket material for chip resistors 8 soic pcb footprint qfp 100 SOCKET BGA and QFP Package
Text: Socket Technologies High Performance IC Sockets And Test Adapters IP, Sep2009 Overview Company Overview – – – – – Over 5,000 products High Performance Adapters and Sockets Many Custom Designs Engineering – Electrical and Mechanical ISO9001:2000 Registration
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Sep2009
ISO9001
50x50mm
QFP lead pitch 0.3mm
BGA and QFP Package mounting
QFP 0.3mm pitch
particle
0.3mm pitch BGA
bga socket
material for chip resistors
8 soic pcb footprint
qfp 100 SOCKET
BGA and QFP Package
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digital counter
Abstract: No abstract text available
Text: Ironwood Electronics Test socket 0.5 mm pitch Measurement Results Rev A, Ila Pal 5/15/09 1 Table of Contents Table of Contents . 2
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Untitled
Abstract: No abstract text available
Text: New Product News Electroformed Probe Pins XP3B Highly Reliable Electroformed Probe Pins. Outer spring type. • Plunger structure to ensure stable contact. • Highly durability due to the smooth end surfaces achieved with electroforming. •Feature ●Plunger structure to ensure stable contact.
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G088-E1-01
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FR4 substrate board
Abstract: 0.3mm pitch probe BGA zif socket 0.3mm pitch BGA PB-BGA48D-Z-01 1J23
Text: 7.62mm [0.300"] Top View 33.02mm [1.300"] * This height varies depending on the screw position. 3 5 2 5mm [0.197"]* 9.97mm [0.393"] 6 Side View 7.92mm 4 Pins: material- Brass Alloy 360 1/2 hard; finish0.25µm [10µ"] Au over 1.27µm [50µ"] Ni min. . Substrate: 3.60mm ±0.18mm [0.142" ±0.007"]
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FR4/G10
PB-BGA48D-Z-01
FR4 substrate board
0.3mm pitch probe
BGA zif socket
0.3mm pitch BGA
1J23
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WLCSP flip chip
Abstract: WLCSP smt 0.3mm pitch csp package wlcsp inspection WLCSP chip mount WLCSP PBO design amkor flip amkor RDL amkor polyimide system in package WLCSP underfill
Text: data sheet wafer level packaging WLCSP Features • 4 - 196 ball count • 0.8 mm – 6.5 mm body size • Repassivation, Redistribution and Bumping options available • Electroplated and Ball-loaded bumping options • Eutectic and Lead-free solder • Standard JEDEC / EIAJ pitches and CSP solder ball diameters
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X7T voltage dependence
Abstract: GRM155B31A225K GR331 GRM155R71E104K GRM188R61E475 GRM188R71C105KA12 GRM1555C1HR10BA01 GRM32ER71H106KA12 GRM0222C1A101GD05 GRM188D71
Text: !Note • Please read rating and !CAUTION for storage, operating, rating, soldering, mounting and handling in this catalog to prevent smoking and/or burning, etc. • This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
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ISO14001
C02E-17
X7T voltage dependence
GRM155B31A225K
GR331
GRM155R71E104K
GRM188R61E475
GRM188R71C105KA12
GRM1555C1HR10BA01
GRM32ER71H106KA12
GRM0222C1A101GD05
GRM188D71
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Untitled
Abstract: No abstract text available
Text: FEATURES BENEFITS QUICK CONNECT Push/pull latching feature allows for easy one-hand mating HOW TO ORDER & HG 1 IMMEDIATE DELIVERY Four standard sizes are stocked for optimal lead time: HG0: 5 contacts HG2: 12 contacts HG3: 19 contacts HG4: 33 contacts CUSTOMISABLE
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091B2;
995B2;
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"Fiber Optic transmitter"
Abstract: C6560
Text: Fiber Optic Transmitter MOF-T2K2 Outline Dimensions Features 1.Compact adoption of small jack for mini plug JIS C6560 2.Thin type (4.4mm) transmitter unit. 3.Both optical and electrical signal can be distinguished and transmitted. 4.Signal transmission speed :
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"Fiber Optic transmitter"
C6560
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MOF-T4K2
Abstract: "Fiber Optic transmitter" C6560
Text: Fiber Optic Transmitter MOF-T4K2 Outline Dimensions Features 1.Compact adoption of small jack for mini plug JIS C6560 2.Thin type (4.4mm) transmitter unit. 3.Both optical and electrical signal can be distinguished and transmitted. 4.Signal transmission speed :
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C6560)
MOF-T4K2
"Fiber Optic transmitter"
C6560
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"Fiber Optic transmitter"
Abstract: C6560
Text: Fiber Optic Transmitter MOF-T4C2 Outline Dimensions Features 1.Compact adoption of small jack for mini plug JIS C6560 2.Thin type (4.4mm) transmitter unit. 3.Both optical and electrical signal can be distinguished and transmitted. 4.Signal transmission speed :
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C6560)
25Mbps
"Fiber Optic transmitter"
C6560
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"Fiber Optic transmitter"
Abstract: C6560 optical jack
Text: Fiber Optic Transmitter MOF-T2C2 Outline Dimensions Features 1.Compact adoption of small jack for mini plug JIS C6560 2.Thin type (4.4mm) transmitter unit. 3.Both optical and electrical signal can be distinguished and transmitted. 4.Signal transmission speed :
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C6560)
25Mbps
"Fiber Optic transmitter"
C6560
optical jack
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0.3mm pitch csp package
Abstract: AN-1187 DAP 08 PCB design for 0.2mm pitch csp package DAP 07 dap sot 23-5 SAC405 LDA08B MO-220 MO-229
Text: Table of Contents Introduction . 2 Package Overview . 2
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AN-1187
0.3mm pitch csp package
AN-1187
DAP 08
PCB design for 0.2mm pitch csp package
DAP 07
dap sot 23-5
SAC405
LDA08B
MO-220
MO-229
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OM338
Abstract: technical of tamura solder paste technical of tamura solder mask luxeon F1 LUXEON Rebel LED Tamura Of America tamura solder paste PROFILE 210WP tamura solder paste E38152
Text: Application Brief AB32 LUXEON Rebel Assembly and Handling Information Introduction This application brief covers the recommended board design and assembly procedures for LUXEON® Rebel LEDs. LUXEON Rebel is a revolutionary, ultra compact, surface mount high
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PCB design for 0.2mm pitch csp package
Abstract: SAC305 reflow profile sac305 thermal conductive DAP 07 JESD22-B111 dap sot 23-5 DAP 06 dap 11 LDA08B MO-220
Text: Table of Contents Introduction . 2 Package Overview . 2
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CSP-9-111S2)
CSP-9-111S2.
AN-1187
PCB design for 0.2mm pitch csp package
SAC305 reflow profile
sac305 thermal conductive
DAP 07
JESD22-B111
dap sot 23-5
DAP 06
dap 11
LDA08B
MO-220
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DAP 07
Abstract: JESD22-B111 DAP 08 transistor smd sensor 80L dap 07 smd dap sot 23-5 SPA52A AN-1187 LQB08A MO-220
Text: National Semiconductor Application Note 1187 August 27, 2010 Table of Contents Introduction . 2 Package Overview . 2
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AN-1187
DAP 07
JESD22-B111
DAP 08
transistor smd sensor 80L
dap 07 smd
dap sot 23-5
SPA52A
AN-1187
LQB08A
MO-220
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Untitled
Abstract: No abstract text available
Text: VMMK-2503 1 to 12 GHz GaAs Wideband Amplifier in Wafer Level Package Data Sheet Description Features Avago’s VMMK-2503 is an easy-to-use broadband, high linearity amplifier in a miniaturized wafer level package WLP . The wide band and unconditionally stable performance makes this amplifier suitable as a gain block or a
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VMMK-2503
VMMK-2503
12GHz.
100mm
250mm.
AV02-2004EN
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34992
Abstract: No abstract text available
Text: VMMK-2203 0.9-11 GHz E-pHEMT Wideband Amplifier in Wafer Level Package Data Sheet Description Features Avago Technologies has combined its industry leading E-pHEMT technology with a revolutionary wafer level package WLP . • 1 x 0.5 mm Surface Mount Package
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VMMK-2203
VMMK-2203
100mm
250mm.
AV02-2001EN
34992
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WLP0402
Abstract: VMMK-2203 34992 VMMK2203 A004R VMMK-2203-BLKG
Text: VMMK-2203 0.9-11 GHz E-pHEMT Wideband Amplifier in Wafer Level Package Data Sheet Description Features Avago Technologies has combined its industry leading E-pHEMT technology with a revolutionary wafer level package WLP . • 1 x 0.5 mm Surface Mount Package
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VMMK-2203
VMMK-2203
100mm
250mm.
AV02-2001EN
WLP0402
34992
VMMK2203
A004R
VMMK-2203-BLKG
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Untitled
Abstract: No abstract text available
Text: VMMK-2403 2 to 4 GHz GaAs High Linearity LNA in Wafer Level Package Data Sheet Description Features Avago’s VMMK-2403 is an easy-to-use, high linearity low noise amplifier in a miniaturized wafer level package WLP . The low noise and unconditionally stable performance makes this amplifier ideal as a primary or subsequent gain block of an RF receiver in applications from
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VMMK-2403
VMMK-2403
100mm
250mm.
AV02-2003EN
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