| SOT1190-1 |
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NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 144 balls |
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Original |
PDF
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| SOT1190-2 |
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NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 144 balls |
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Original |
PDF
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| SOT1191-1 |
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NXP Semiconductors
|
Plastic, extremely thin quad flat package; no leads; 10 terminals |
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Original |
PDF
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| SOT1192-1 |
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NXP Semiconductors
|
Plastic thermal enhanced extremely thin small outline package; no leads; 4 terminals |
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Original |
PDF
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| SOT1192-1 |
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NXP Semiconductors
|
Reflow soldering footprint SOT1192-1 |
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Original |
PDF
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| SOT1193-1 |
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NXP Semiconductors
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Plastic, extremely thin quad flat package; no leads; 8 terminals |
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Original |
PDF
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| SOT1193-2 |
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NXP Semiconductors
|
Plastic, extremely thin quad flat package; no leads; 8 terminals |
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Original |
PDF
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| SOT1194-1 |
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NXP Semiconductors
|
Footprint for reflow soldering SOT1194-1 |
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Original |
PDF
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| SOT1194-1 |
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NXP Semiconductors
|
Plastic thermal enhanced ultra thin small outline package; no leads; 4 terminals |
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Original |
PDF
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| SOT1196-1 |
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NXP Semiconductors
|
SO12: plastic small outline package; 12 leads; body width 3.9 mm |
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Original |
PDF
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| SOT1197-1 |
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NXP Semiconductors
|
Plastic thermal enhanced extremely thin small outline package; no leads; 10 terminals |
|
Original |
PDF
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| SOT1197-1 |
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NXP Semiconductors
|
Footprint for reflow soldering SOT1197-1 |
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Original |
PDF
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| SOT1198-1 |
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NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 54 terminals; resin based |
|
Original |
PDF
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| SOT1199-1 |
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NXP Semiconductors
|
Plastic very thin fine-pitch ball grid array package; 24 balls |
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Original |
PDF
|
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| SOT119a |
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NXP Semiconductors
|
Flanged ceramic package; 2 mounting holes; 6 leads |
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Original |
PDF
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| SOT119A_112 |
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NXP Semiconductors
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CDFM6; Blister pack Packing method; standard product orientation 12NC ending 112 |
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Original |
PDF
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