| SOT115 |
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NXP Semiconductors
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SOT115 Mounting |
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Original |
PDF
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| SOT1150-1 |
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NXP Semiconductors
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SOT1150-1_po |
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Original |
PDF
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| SOT1151-1 |
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NXP Semiconductors
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Plastic thermal enhanced ball grid array package; 640 balls; heatsink |
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Original |
PDF
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| SOT1152-1 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; resin based |
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Original |
PDF
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| SOT1153-1 |
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NXP Semiconductors
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Plastic ball grid array package; 456 balls |
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Original |
PDF
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| SOT1154-1 |
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NXP Semiconductors
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Plastic dual bent surface mounted SIL power package; 27 leads |
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Original |
PDF
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| SOT1155-1 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 48 balls |
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Original |
PDF
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| SOT1155-1_118 |
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NXP Semiconductors
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TFBGA48; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
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Original |
PDF
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| SOT1155-2 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 48 balls |
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Original |
PDF
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| SOT1156-1 |
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NXP Semiconductors
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Plastic, thermal enhanced extremely thin small outline package; no leads; 12 terminals |
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Original |
PDF
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| SOT1156-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT1156-1 |
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Original |
PDF
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| SOT1157-1 |
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NXP Semiconductors
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Plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals |
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Original |
PDF
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| SOT1157-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT1157-1 |
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Original |
PDF
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| SOT1158-1 |
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NXP Semiconductors
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Plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals |
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Original |
PDF
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| SOT1158-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT1158-1 |
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Original |
PDF
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| SOT1159-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT1159-1 |
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Original |
PDF
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| SOT1159-1 |
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NXP Semiconductors
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Plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals |
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Original |
PDF
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| SOT115AA |
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NXP Semiconductors
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Plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals |
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Original |
PDF
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| SOT115AD |
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NXP Semiconductors
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Plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals |
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Original |
PDF
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| SOT115AE |
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NXP Semiconductors
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Plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals |
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Original |
PDF
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