SOT82 |
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STMicroelectronics
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SOT82 - ASD & DISCRETES - TOURS |
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Original |
PDF
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SOT820-1 |
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NXP Semiconductors
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Plastic thermal enhanced small outline package; 16 leads; body width 7.5 mm; heatsink |
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Original |
PDF
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SOT821-1 |
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NXP Semiconductors
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Plastic low profile fine-pitch ball grid array package; 228 balls; body 15 x 15 x 1.05 mm |
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Original |
PDF
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SOT82_127 |
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NXP Semiconductors
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Tube pack; standard product orientation; 12NC ending 127 |
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Original |
PDF
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SOT822-1 |
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NXP Semiconductors
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Plastic, heatsink small outline package; 16 leads |
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Original |
PDF
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SOT822-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT822-1 |
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Original |
PDF
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SOT823-1 |
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NXP Semiconductors
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Plastic low profile quad flat package; 80 leads; body 14 x 14 x 1.4 mm |
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Original |
PDF
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SOT824-1 |
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NXP Semiconductors
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Plastic low profile fine-pitch ball grid array package; 320 balls; body 13 x 13 x 0.9 mm |
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Original |
PDF
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SOT825-1 |
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NXP Semiconductors
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Plastic low profile fine-pitch ball grid array package; 183 balls; body 12 x 12 x 1.05 mm |
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Original |
PDF
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SOT825-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT825-1 |
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Original |
PDF
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SOT826-1 |
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NXP Semiconductors
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Plastic low profile fine-pitch ball grid array package; 73 balls; body 7 x 7 x 0.9 mm |
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Original |
PDF
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SOT826-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT826-1 |
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Original |
PDF
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SOT827-1 |
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NXP Semiconductors
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Plastic DIL-bent-SIL (special bent) power package; 27 leads (lead length 6.8 mm) |
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Original |
PDF
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SOT829-1 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 256 balls; body 11 x 11 x 0.8 mm |
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Original |
PDF
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SOT82 DPG AGRATE |
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STMicroelectronics
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SOT82 DEDICATED PRODUCT PACKAGE |
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Original |
PDF
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