LGA 1156 PIN OUT diagram
Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)
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DIP8-P-300-2
DIP14-P-300-2
DIP16-P-300-2
DIP18-P-300-2
MIL-M-38510
MIL-STD-883
LGA 1156 PIN OUT diagram
QSJ-44403
LGA 1150 Socket PIN diagram
LGA 1155 Socket PIN diagram
IC107-26035-20-G
LGA 1151 PIN diagram
REFLOW lga socket 1155
IC107-3204-G
TB 2929 H alternative
LGA 1155 pin diagram
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high power diode axial
Abstract: HITACHI AXIAL DIODE ZSH5MA HITACHI
Text: Application Note HITACHI Power Diode Lead-Free Status 1. Lead-Free Status Details Package Glass Molded Resin Molded Axial Lead High Voltage resin Surface Mounted ZSA5MA ZSH Series Plan Current plate material of external lead Sn Ag Current internal solder material for
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260degC,
10sec
280degC,
300degC,
260degC
250degC,
20sec
high power diode axial
HITACHI AXIAL DIODE
ZSH5MA HITACHI
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Untitled
Abstract: No abstract text available
Text: External Lead Finish for Plastic Packages For plastic packages, National Semiconductor offers two primary lead finishes: solder plate and solder dip. The component lead finish serves as a protective coating to prevent oxidation of the lead base material prior to use. The lead finish
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HQFP208-C-3939-0
Abstract: No abstract text available
Text: HQFP208-C-3939-0.65 Radiation fin 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Al2O3 Kovar Solder dipping (5~50µm) 25.9 TYP.
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HQFP208-C-3939-0
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ceramic pin grid array package lead finish gold
Abstract: 40 lead ceramic flatpack ceramic pin grid array package lead finish EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES 85# Tin Plate gold plate MIL-M38510 lead finish National Semiconductor 16 Pin Dip
Text: External Lead Finish for Hermetic Packages For hermetic packages, National Semiconductor offers three primary lead finishes: solder dip, gold plate and tin plate. The component lead finish serves as a protective coating to prevent oxidation of the lead base material prior to use. The
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Mil-M-38510.
ceramic pin grid array package lead finish gold
40 lead ceramic flatpack
ceramic pin grid array package lead finish
EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES
85# Tin Plate
gold plate
MIL-M38510 lead finish
National Semiconductor 16 Pin Dip
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crossover
Abstract: No abstract text available
Text: TEPRO TYPE "TDN" ELECTRO TECHNIK STANDARD AND CUSTOM THICK FILM DIP NETWORKS FEATURES: Resistive element: Substrate material: Resistance range: Resistance tolerance: Temperature coefficient: Power rating, watts: Operating temperature: Lead material: Overcoating:
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100ppm
50ppm
200ppm
crossover
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Untitled
Abstract: No abstract text available
Text: TEPRO TYPE ELECTRa TECHNIK UUTDNUU STANDARD AND CUSTOM THICK FILM DIP NETWORKS FEATURES: Resistive element: Substrate material: Resistance range: Resistance tolerance: Temperature coefficient: Power rating, wafts: Operating temperature: Lead material: Overcoating:
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100PPM
50PPM
200PPM
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Noble resistor
Abstract: crossover
Text: TEPRO TYPE “TDN” ELECTRO TECHNIK STANDARD AND CUSTOM THICK FILM DIP NETWORKS FEATURES: Resistive element: Substrate material: Resistance range: Resistance tolerance: Temperature coefficient: Power rating, watts: Operating temperature: Lead material: Overcoating:
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to100ppm
50ppm
200ppm
Noble resistor
crossover
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DIP36-P-600-2
Abstract: No abstract text available
Text: DIP36-P-600-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 5.73 TYP. 2/Dec. 11, 1996
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DIP36-P-600-2
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Untitled
Abstract: No abstract text available
Text: DIP24-P-600-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 3.55 TYP. 2/Dec. 11, 1996
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DIP24-P-600-2
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Untitled
Abstract: No abstract text available
Text: DIP18-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.30 TYP. 2/Dec. 11, 1996
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DIP18-P-300-2
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Untitled
Abstract: No abstract text available
Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996
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DIP8-P-300-2
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DIP42-P-600-2
Abstract: No abstract text available
Text: DIP42-P-600-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 6.20 TYP. 2/Dec. 11, 1996
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DIP42-P-600-2
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Untitled
Abstract: No abstract text available
Text: DIP22-P-400-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.90 TYP. 2/Dec. 11, 1996
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DIP22-P-400-2
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Untitled
Abstract: No abstract text available
Text: DIP16-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.99 TYP. 2/Dec. 11, 1996
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DIP16-P-300-2
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Untitled
Abstract: No abstract text available
Text: DIP28-P-600-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 4.30 TYP. 2/Dec. 11, 1996
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DIP28-P-600-2
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DIP14-P-300-2
Abstract: No abstract text available
Text: DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.93 TYP. 2/Dec. 11, 1996
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DIP14-P-300-2
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Untitled
Abstract: No abstract text available
Text: DIP40-P-600-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 6.10 TYP. 2/Dec. 11, 1996
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DIP40-P-600-2
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Untitled
Abstract: No abstract text available
Text: DIP32-P-600-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 4.70 TYP. 3/Dec. 11, 1996
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DIP32-P-600-2
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DIP20-P-300-2
Abstract: No abstract text available
Text: DIP20-P-300-2.54-W1 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.50 TYP. 2/Dec. 11, 1996
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DIP20-P-300-2
54-W1
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Untitled
Abstract: No abstract text available
Text: DIP22-P-300-2.54-S1 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.88 TYP. 2/Dec. 11, 1996
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DIP22-P-300-2
54-S1
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solder
Abstract: plating
Text: GENERAL PURPOSE INFORMATION 2. STRUCTURE MINI MOLD Case Materia! Epoxy Lead Material : Fe - Ni Lead Plating Solder Dipping or Solder Plating M ark in g S u rfa ce POWER MINI MOLD Case Material Epoxy M a rk in g Lead Material : Cu Lead Plating Solder Plating
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Untitled
Abstract: No abstract text available
Text: IDC DIP CONNECTORS CENTURY INTERCONNECT PRODUCTS 203 375-5344 FAX (203) 375-1631 SPECIFICATIONS MECHANICAL: Insulator Material: PBT, glass fiber reinforced, UL94V-0 Contact Material: Copper Alloy Contact Finish: Gold or tin-lead over nickel IDC Terminal Finish: Tin-lead over nickel
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UL94V-0
l64331
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Untitled
Abstract: No abstract text available
Text: IDC DIP CONNECTORS CENTURY INTERCONNECT PRODUCTS 203 375-5344 FAX (203) 375-1631 SPECIFICATIONS JTI MECHANICAL: Insulator Material: PBT, glass fiber reinforced, UL94V-0 Contact Material: Copper Alloy Contact Finish: Gold or tin-lead over nickel IDC Terminal Finish: Tin-lead over nickel
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UL94V-0
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